公开(公告)号：US10308749B2

公开(公告)日：2019-06-04

申请号：US15673798

申请日：2017-08-10

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Ying-Te Huang ,  Hao-Sheng Chen ,  Hung-Yi Chang ,  Chuan Chou ,  Jui-Jung Lin Lai

IPC: C08F283/08 ,  C08F6/06 ,  C08F8/02 ,  C08L65/02

Abstract: A process for producing a modified polyphenylene ether resin having a purity of more than 99.4%, comprising steps of graft modification, water rinse, and extraction as well as phase splitting, is disclosed that step of separating out powder during purification is no needed, and the solvent for use in performing dissolving of or/and extraction of polyphenylene ether resin can be recycled for future use, so that the manufacturing process is simple and uses less solvent as compared to the prior art, and further helps to conserve resources and is environmentally friendly.

公开(公告)号：US09920218B2

公开(公告)日：2018-03-20

申请号：US15148050

申请日：2016-05-06

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Jung-Jen Chuang ,  Hao-Sheng Chen ,  Yi-Cheng Li ,  Zhang-Jian Huang

IPC: C09D171/12 ,  C08G65/46 ,  C08L71/12 ,  C08G65/48

CPC classification number: C09D171/12 ,  C08G65/46 ,  C08G65/485 ,  C08L71/12

Abstract: A process for preparing PPE microspore dispersion includes steps of: dissolving a high-molecular polyphenylene ether in a first solvent at 45-110° C. to form a dissolution liquid; adding processing aids and well mixing the dissolution liquid into a dispersed phase; cooling the dissolution liquid to 42-80° C., and adding a second solvent to generate PPE microspores via PPE to wrap around the processing aids; cooling the dissolution liquid to 0-40° C. to obtain PPE microspore dispersions for use in application for impregnation processes performed below 40° C., thereby high-temperature impregnation equipment are no longer needed, and copper clad laminates made of using the PPE microspore dispersion enjoy excellent physical properties including high Tg, low Dk, low Df and high copper foil's peel strength.

公开(公告)号：US20250026903A1

公开(公告)日：2025-01-23

申请号：US18909909

申请日：2024-10-08

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Wen-Cheng Yang ,  Te-Chao Liao ,  Chun-Cheng Yang ,  Chia-Yen Hsiao ,  Hao-Sheng Chen

IPC: C08J11/10 ,  B29B17/04 ,  B29C48/00 ,  B29C48/08 ,  B29K67/00 ,  B29K105/00 ,  B29K105/26 ,  C08J5/18 ,  C08J11/06 ,  C08L67/02

Abstract: A matte polyester film and a method for manufacturing the same are provided. The method for manufacturing the matte polyester film includes: providing a recycled polyester material; physically regenerating a part of the recycled polyester material to form physically regenerated polyester chips having a first intrinsic viscosity; chemically regenerating another part of the recycled polyester material to form chemically regenerated polyester chips having a second intrinsic viscosity less than the first intrinsic viscosity; mixing matte regenerated polyester chips, the physically regenerated polyester chips, and the chemically regenerated polyester chips according to a predetermined intrinsic viscosity so as to form a polyester masterbatch material; melting and then extruding the polyester masterbatch material to obtain the matte polyester film having the predetermined intrinsic viscosity.

公开(公告)号：US11890832B2

公开(公告)日：2024-02-06

申请号：US17316677

申请日：2021-05-10

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Hao-Sheng Chen ,  Hung-Yi Chang ,  Chih-Kai Chang ,  Chia-Lin Liu

IPC: B32B15/16 ,  B32B15/08 ,  B32B15/14 ,  B32B5/16

CPC classification number: B32B15/16 ,  B32B5/16 ,  B32B15/08 ,  B32B15/14 ,  B32B2250/02 ,  B32B2250/03 ,  B32B2264/1021 ,  B32B2264/1023 ,  B32B2264/12 ,  B32B2264/201 ,  B32B2264/202 ,  B32B2307/204 ,  B32B2307/302

Abstract: A prepreg and a metallic clad laminate are provided. The prepreg includes a reinforcing material and a thermosetting resin layer. The thermosetting resin layer is formed by immersing the reinforcing material in a thermosetting resin composition. The thermosetting resin composition includes a polyphenylene ether resin, a liquid polybutadiene resin, a crosslinker, and fillers. Based on a total weight of the thermosetting resin composition being 100 phr, an amount of the fillers ranges from 50 phr to 70 phr. The fillers include a granular dielectric filler and a flaky thermal conductive filler. The metallic clad laminate is formed by disposing at least one metal layer onto the prepreg.

公开(公告)号：US10889741B2

公开(公告)日：2021-01-12

申请号：US16202173

申请日：2018-11-28

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Hao-Sheng Chen ,  Chih-Kai Chang ,  Hung-Yi Chang

IPC: B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  C08L27/18 ,  H05K1/03 ,  C09K5/14 ,  C08J5/24 ,  H05K1/02 ,  H05K3/02 ,  B32B15/082

Abstract: A fluorocarbon resin composition is applicable to produce high-frequency circuit boards including a polytetrafluoroethylene resin; a fluorine-containing copolymer such as poly fluoroalkoxy and fluorinated ethylene propylene; low molecular-weight PTFE micro-powders and inorganic powders; in particular the temperature of pressing copper foil substrates is lowered from 350° C. to 250° C. via a lowering temperature rate of 1 to 4° C./min to improve the crystallinity of the fluorocarbon resin composition as well as improve the copper foil substrate with a high thermal conductivity and a wide range of dielectric constant.

公开(公告)号：US10023707B2

公开(公告)日：2018-07-17

申请号：US14973809

申请日：2015-12-18

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Dein-Run Fung ,  Ying-Te Huang ,  Hao-Sheng Chen ,  Hung-Yi Chang ,  Chia-Lin Liu

IPC: C08L51/08 ,  H05K1/09 ,  H05K1/03 ,  C08J5/04 ,  C08J5/24 ,  C08J3/24 ,  C08L71/12

Abstract: A thermosetting resin composition due to containing a modified PPE resin as a main ingredient is suited for use in making a pregreg or a copper foil substrate, when hardened, featuring a small dielectric constant (Dk), a low dielectric dissipation factor (Df) and a high Tg as well as a high resistance to heat and flame, this outstanding result is because the modified PPE resin is formed with a novel two-dimensional hardenable structure prepared to have side-chain reactive functional groups being provided in addition to those at the terminal ends of the main chain of the PPE resin thereof.

公开(公告)号：US11753512B2

公开(公告)日：2023-09-12

申请号：US17199451

申请日：2021-03-12

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Wen-Cheng Yang ,  Te-Chao Liao ,  Chia-Yen Hsiao ,  Hao-Sheng Chen

IPC: C08J5/18 ,  B29C48/00 ,  C08G63/183 ,  C08G63/692 ,  C08J3/12 ,  C08K3/04 ,  C08K3/22 ,  C08K3/26 ,  C08K3/30 ,  C08K3/36 ,  C08K5/00 ,  C08K5/098 ,  C08L25/06 ,  C08L33/08 ,  C08L67/02

CPC classification number: C08J5/18 ,  B29C48/022 ,  C08G63/183 ,  C08G63/692 ,  C08J3/12 ,  C08K3/04 ,  C08K3/22 ,  C08K3/26 ,  C08K3/30 ,  C08K3/36 ,  C08K5/0066 ,  C08K5/098 ,  C08L25/06 ,  C08L33/08 ,  C08L67/02 ,  C08K2003/2203 ,  C08K2003/2227 ,  C08K2003/2241 ,  C08K2003/265 ,  C08K2003/3045 ,  C08K2201/005 ,  C08L2201/02 ,  C08L2201/10 ,  C08L2203/16 ,  C08L2203/30 ,  C08L2207/20

Abstract: A flame-retardant polyester film and a method for manufacturing the same are provided. The flame-retardant polyester film includes a physically recycled polyester resin and a chemically recycled polyester resin. The physically recycled polyester resin is formed by a plurality of physically recycled polyester chips. The chemically recycled polyester resin is formed by a plurality of chemically recycled polyester chips and mixed with the physically recycled polyester resin. The plurality of chemically recycled polyester chips further includes chemically recycled electrostatic pinning polyester chips. The chemically recycled electrostatic pinning polyester chips contain electrostatic pinning additives, and the electrostatic pinning additives are metal salts. Expressed in percent by weight based on a total weight of the polyester film, a content of the electrostatic pinning additives in the polyester film is between 0.005% and 0.1% by weight. The flame-retardant polyester film further includes a flame-retardant additive.

公开(公告)号：US11639420B2

公开(公告)日：2023-05-02

申请号：US17004206

申请日：2020-08-27

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Hao-Sheng Chen ,  Hung-Yi Chang ,  Chi-Lin Chen

IPC: C08G73/12 ,  C08J5/24 ,  B32B15/20

Abstract: A modified bismaleimide resin, a method for preparing the same, a prepreg, a copper clad laminate, and a printed circuit board are provided. The modified bismaleimide resin is formed by reacting a diamine having a specific structure with maleic anhydride, and has greater amounts of non-polar and hydrophobic groups in the molecular structure thereof.

公开(公告)号：US20220243031A1

公开(公告)日：2022-08-04

申请号：US17408497

申请日：2021-08-23

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Wen-Cheng Yang ,  Te-Chao Liao ,  Chun-Cheng Yang ,  Chia-Yen Hsiao ,  Hao-Sheng Chen

IPC: C08J11/10 ,  C08J11/06 ,  C08L67/02 ,  C08J5/18 ,  B29B17/04 ,  B29C48/00 ,  B29C48/08

Abstract: A matte polyester film and a method for manufacturing the same are provided, The method for manufacturing the matte polyester film includes: providing a recycled polyester material; physically regenerating a part of the recycled polyester material to form physically regenerated polyester chips having a first intrinsic viscosity; chemically regenerating another part of the recycled polyester material to form chemically regenerated polyester chips having a second intrinsic viscosity less than the first intrinsic viscosity; mixing matte regenerated polyester chips, the physically regenerated polyester chips, and the chemically regenerated polyester chips according to a predetermined intrinsic viscosity so as to form a polyester masterbatch material; melting and then extruding the polyester masterbatch material to obtain the matte polyester film having the predetermined intrinsic viscosity.

公开(公告)号：US11903127B2

公开(公告)日：2024-02-13

申请号：US17381201

申请日：2021-07-21

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Te-Chao Liao ,  Hao-Sheng Chen ,  Chih-Kai Chang ,  Hung-Yi Chang

IPC: H05K1/03 ,  B32B27/20 ,  B32B27/12 ,  B32B27/32

CPC classification number: H05K1/0366 ,  B32B27/12 ,  B32B27/20 ,  B32B27/322 ,  B32B2250/03 ,  B32B2250/24 ,  B32B2250/40 ,  B32B2264/101 ,  B32B2264/104 ,  B32B2264/107 ,  B32B2264/301 ,  B32B2457/08 ,  H05K2201/015 ,  H05K2201/0275

Abstract: A fluoride-based resin prepreg and a circuit substrate using the same are provided. The fluoride-based resin prepreg includes 100 PHR of a fluoride-based resin and 20 to 110 PHR of an inorganic filler. Based on a total weight of the fluoride-based resin, the fluoride-based resin includes 10 to 80 wt % of polytetrafluoroethylene (PTFE), 10 to 50 wt % of fluorinated ethylene propylene (FEP), and 0.1 to 40 wt % of perfluoroalkoxy alkane (PFA). The circuit substrate includes a fluoride-based resin substrate and a circuit layer that is formed on the fluoride-based resin substrate.