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公开(公告)号:US20240228755A1
公开(公告)日:2024-07-11
申请号:US18173775
申请日:2023-02-23
Applicant: NAN YA PLASTICS CORPORATION
Inventor: Te-Chao Liao , Wei-Ru Huang , Hung-Yi Chang , Chia-Lin Liu
IPC: C08L9/06
CPC classification number: C08L9/06 , C08L2201/08 , C08L2203/20 , C08L2205/03
Abstract: A resin composition includes SBS resin, BMI resin, a crosslinking agent, and a modified polyphenylene ether resin has a following general formula:
wherein R represents a chemical group of a bisphenol compound located between two hydroxyphenyl functional groups thereof, and n is an integer ranging from 3 to 25.-
公开(公告)号:US20240228705A1
公开(公告)日:2024-07-11
申请号:US18171299
申请日:2023-02-17
Applicant: NAN YA PLASTICS CORPORATION
Inventor: Te-Chao Liao , Wei-Ru Huang , Hung-Yi Chang , Chia-Lin Liu
IPC: C08G73/12 , C08G65/333 , C08G65/48 , C08K3/36 , C08K5/18 , C08K5/5425
CPC classification number: C08G73/12 , C08G65/33337 , C08G65/485 , C08K3/36 , C08K5/18 , C08K5/5425
Abstract: A resin composition is provided, which includes diamine, a BMI resin, and a modified polyphenylene ether resin having a following structural formula:
wherein R represents a chemical group of a bisphenol compound located between two hydroxyphenyl functional groups thereof, and n is an integer ranging from 3 to 25.-
公开(公告)号:US20240150547A1
公开(公告)日:2024-05-09
申请号:US17993851
申请日:2022-11-23
Applicant: NAN YA PLASTICS CORPORATION
Inventor: Te-Chao Liao , Hung-Yi Chang , Chia-Lin Liu , Wei-Ru Huang
CPC classification number: C08K3/36 , B32B15/08 , B32B15/20 , C08G59/245 , C08G61/122 , C08G73/10 , C08J5/18 , C08J5/244 , B32B2250/03 , B32B2307/204 , B32B2307/306 , B32B2311/12 , B32B2457/00 , C08K2201/003 , C08K2201/014
Abstract: A composite material substrate includes an inorganic filler, a resin composition, and a dispersant. The resin composition includes a bismaleimide resin, a naphthalene ring-containing epoxy resin, and a benzoxazine resin. The inorganic filler, the resin composition, and the dispersant are mixed together.
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公开(公告)号:US20230167297A1
公开(公告)日:2023-06-01
申请号:US17855827
申请日:2022-07-01
Applicant: NAN YA PLASTICS CORPORATION
Inventor: Te-Chao Liao , Chien Kai Wei , Hung-Yi Chang
CPC classification number: C08L75/00 , C08J5/249 , C08J5/244 , C08L2201/02 , C08L2203/20 , C08J2375/00 , C08J2445/00 , C08J2471/12
Abstract: A resin composition, including resin and imidazole, is provided. The resin includes cyanate ester resin and bismaleimide resin, and the imidazole does not have acidic hydrogen.
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公开(公告)号:US20230072223A1
公开(公告)日:2023-03-09
申请号:US17549880
申请日:2021-12-14
Applicant: NAN YA PLASTICS CORPORATION
Inventor: Te-Chao Liao , Wei-Ru Huang , Hung-Yi Chang , Chia-Lin Liu , Chien Kai Wei
IPC: C08F136/06 , C08L71/12 , C08K3/36 , C08K5/14 , C08K5/3492 , C08K5/5419 , C08K5/5313
Abstract: A resin composition, including resin and peroxide, is provided. The resin includes liquid rubber resin, polyphenylene ether resin, and a crosslinking agent. The sum of the liquid rubber resin, the polyphenylene ether resin, and the crosslinking agent is 100 parts by mass. The amount of the peroxide used is between 0.1 phr and 5 phr. The peroxide is composed of tertiary butyl cumyl peroxide and an inorganic compound.
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公开(公告)号:US11008451B2
公开(公告)日:2021-05-18
申请号:US16202165
申请日:2018-11-28
Applicant: NAN YA PLASTICS CORPORATION
Inventor: Te-Chao Liao , Ying-Te Huang , Chih-Kai Chang , Hung-Yi Chang , Hao-Sheng Chen , Chia-Lin Liu
Abstract: A fluorocarbon resin composition is applicable to produce a prepreg for use in making a high-frequency circuit board, including a polytetrafluoroethylene resin; a fluorine-containing copolymer of poly fluoroalkoxy or fluorinated ethylene propylene; inorganic powders and an impregnation additive such as hydroxyethyl cellulose; resulted in that the prepreg is capable of increasing a plurality of times for proceeding impregnation-coating, the surface defects prone to occur on a fluorocarbon prepreg during drying, baking and sintering after impregnation are therefore improved at the same time.
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公开(公告)号:US20250115756A1
公开(公告)日:2025-04-10
申请号:US18498059
申请日:2023-10-31
Applicant: NAN YA PLASTICS CORPORATION
Inventor: Te-Chao Liao , Hung-Yi Chang , Chia-Lin Liu , Ren-Yu Liao
Abstract: The disclosure provides a resin composition, a substrate, and a copper clad laminate, wherein the resin composition includes a naphthalene ring epoxy resin, a bismaleimide resin, a crosslinking agent, polysiloxane, an accelerator, and a filler.
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公开(公告)号:US20250066552A1
公开(公告)日:2025-02-27
申请号:US18467735
申请日:2023-09-15
Applicant: Nan Ya Plastics Corporation
Inventor: Te-Chao Liao , Chi-Lin Chen , Hung-Yi Chang
Abstract: The disclosure provides a resin composition, which includes 30 wt % to 50 wt % of a bismaleimide resin; 1 wt % to 10 wt % of an epoxy resin; 1 wt % to 10 wt % of a benzoxazine resin; 1 wt % to 5 wt % of a hardener; 10 wt % to 40 wt % of a filler; and 0.1 wt % to 3 wt % of a coupling agent, based on a total weight of the resin composition.
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公开(公告)号:US20250011527A1
公开(公告)日:2025-01-09
申请号:US18459456
申请日:2023-09-01
Applicant: NAN YA PLASTICS CORPORATION
Inventor: Te-Chao Liao , Chi-Lin Chen , Hung-Yi Chang
IPC: C08G61/02
Abstract: A preparation method of a modified naphthol resin includes the following. A nitration reaction and a hydrogenation reaction are sequentially performed on a naphthol resin to form a modified naphthol resin with an amino group in a structure. A solvent used in the hydrogenation reaction includes tetrahydrofuran, toluene, isopropanol, an amide solvent, or an above-mentioned co-solvent.
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公开(公告)号:US20240400734A1
公开(公告)日:2024-12-05
申请号:US18357943
申请日:2023-07-24
Applicant: NAN YA PLASTICS CORPORATION
Inventor: Te-Chao Liao , Chi-Lin Chen , Hung-Yi Chang , Wen-Hua Lu , Meng-Huai Han
IPC: C08F212/08 , C08F212/32
Abstract: A resin composition includes a copolymer. The copolymer includes an aromatic monomer and an alicyclic monomer. A molecular weight of the copolymer is in a range of 2000 to 5000. Compared with the copolymer, a proportion of the alicyclic monomer is 1% to 30%. A manufacturing method of the resin composition is also provided.
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