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    STRETCHABLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING STRETCHABLE CIRCUIT BOARD
    4.
    发明申请
    STRETCHABLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING STRETCHABLE CIRCUIT BOARD 有权

    公开(公告)号：US20170099730A1

    公开(公告)日：2017-04-06

    申请号：US15278558

    申请日：2016-09-28

    Applicant: NIPPON MEKTRON, LTD.

    Inventor： Masayuki Iwase

    IPC: H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/36

    CPC classification number: H05K1/0283 ,  H05K1/0393 ,  H05K1/092 ,  H05K1/118 ,  H05K3/365 ,  H05K2201/2009

    Abstract: A stretchable circuit board includes a stretchable base, a stretchable wiring portion, a reinforcement base having in-plane rigidity higher than that of the stretchable base 10, and a draw-out wiring portion. The stretchable wiring portion having stretchability is formed on a main surface located on at least one side of the stretchable base. The draw-out wiring portion is formed at least on a main surface that is one side of the reinforcement base. The main surface of the reinforcement base is overlaid with a part of an area where the stretchable wiring portion is formed, in which the main surface faces the main surface of the stretchable base. A part of the stretchable wiring portion and a part of the draw-out wiring portion are joined together, and they are electrically continuous.

    PRESSURE SENSING ELEMENT HAVING AN INSULATING LAYER WITH AN INCREASED HEIGHT FROM THE SUBSTRATE TOWARDS THE OPENING
    5.
    发明申请
    PRESSURE SENSING ELEMENT HAVING AN INSULATING LAYER WITH AN INCREASED HEIGHT FROM THE SUBSTRATE TOWARDS THE OPENING 有权
    具有从基板增加的高度的绝缘层的压力传感元件开启

    公开(公告)号：US20160363491A1

    公开(公告)日：2016-12-15

    申请号：US14769290

    申请日：2015-01-14

    Applicant: NIPPON MEKTRON, LTD.

    Inventor： Masayuki Iwase ,  Keizo Toyama ,  Kazuyuki Ozaki ,  Hirokazu Ohdate ,  Taisuke Kimura ,  Ryoichi Toyoshima

    IPC: G01L1/22 ,  A61B5/00

    CPC classification number: G01L1/2287 ,  A61B5/447 ,  A61B2562/0247 ,  A61B2562/046 ,  A61B2562/12 ,  A61B2562/164 ,  G01L1/205 ,  G01L5/00 ,  G01L5/228

    Abstract: A pressure sensing element (100) includes a support substrate (11); a sensor electrode (12) supported by the support substrate (11); a pressure sensing film (14) functionalized to be electro-conductive, at least in a portion thereof faced to the sensor electrode (12); and an insulating layer (13) which keeps the sensor electrode (12) and the pressure sensing film (14) apart from each other by a predetermined distance A, and has formed therein an opening (20) in which the sensor electrode (12) is exposed to the pressure sensing film (14), the insulating layer (13) having an aperture wall (13b) which partitions the opening (20), and an aperture end (top aperture end (13a)) faced to the pressure sensing film (14), and the insulating layer (13) being increased in height, measured from the support substrate (11), continuously towards the opening (20).

    Abstract translation: 压力传感元件（100）包括支撑衬底（11）; 由所述支撑基板（11）支撑的传感器电极（12）; 功能化为导电的压力感测膜（14）至少在其一部分面对传感器电极（12）; 以及保持传感器电极（12）和压力感测膜（14）彼此分开预定距离A的绝缘层（13），并且在其中形成有传感器电极（12）的开口（20） 暴露于压力感测膜（14），绝缘层（13）具有分隔开口（20）的孔壁（13b）和面对压力感测膜的孔端（顶孔端部13a） （14），并且所述绝缘层（13）从所述支撑基板（11）测量的高度朝向所述开口（20）连续地增加。

    Pressure sensor capable of suppressing dispersion in the initial load of pressure
    6.
    发明授权
    Pressure sensor capable of suppressing dispersion in the initial load of pressure 有权

    公开(公告)号：US10359326B2

    公开(公告)日：2019-07-23

    申请号：US15222166

    申请日：2016-07-28

    Applicant: NIPPON MEKTRON, LTD.

    Inventor： Ryoichi Toyoshima ,  Keizo Toyama ,  Hirokazu Ohdate ,  Masayuki Iwase

    IPC: G01L1/00 ,  G01L5/00 ,  G01L1/20

    Abstract: This invention provides a pressure sensitive element capable of suppressing dispersion in the initial load for pressure sensing among the sensor electrodes or among the pressure sensors. The pressure sensitive element has a support substrate, a sensor electrode, a pressure sensing film and an insulating layer. The pressure sensing film is arranged opposing to the sensor electrode. The insulating layer has an opening and is provided between the support substrate and the pressure sensing film. At least a part of an opening edge of the opening is fallen on the sensor electrode. An exposed part as a part of the sensor electrode is exposed inside the opening, while leaving a buried part as the other part of the sensor electrode buried under the insulating layer.

    METHOD FOR MANUFACTURING STRECTHABLE CIRCUIT BOARD AND STRECTHABLE CIRCUIT BOARD
    7.
    发明申请
    METHOD FOR MANUFACTURING STRECTHABLE CIRCUIT BOARD AND STRECTHABLE CIRCUIT BOARD 审中-公开

    公开(公告)号：US20180077794A1

    公开(公告)日：2018-03-15

    申请号：US15685622

    申请日：2017-08-24

    Applicant: NIPPON MEKTRON, LTD.

    Inventor： Masayuki Iwase

    IPC: H05K1/02 ,  H05K1/18 ,  H05K3/36

    CPC classification number: H05K1/0283 ,  H05K1/189 ,  H05K3/361

    Abstract: [Problem] Provided is a method for manufacturing a stretchable circuit board, which can facilitate positioning of an external terminal and a stretchable wiring, and increase manufacturing yield of a stretchable circuit board.[Solving Mean] A stretchable circuit board is manufactured through: a step in which an external terminal 31 is formed on a main surface 33b located on one side of a film base 33; a step in which a stretchable wiring portion 55 is formed on a main surface 53a located on one side of a stretchable base 53; and a step in which the stretchable wiring portion 55 is positioned with the external terminal 31, and pressure and heat are applied to the film base 33 and the stretchable wiring portion 55 to join them, whereby the external terminal 31 and the stretchable wiring portion 55 are connected with each other.

    CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME, TOUCH PANEL SENSOR SHEET AND SCREEN PRINTING PLATE
    10.
    发明申请
    CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME, TOUCH PANEL SENSOR SHEET AND SCREEN PRINTING PLATE 审中-公开
    电路板及其制造方法，触摸板传感器板和屏幕印刷板

    公开(公告)号：US20140138125A1

    公开(公告)日：2014-05-22

    申请号：US14064581

    申请日：2013-10-28

    Applicant: NIPPON MEKTRON, LTD.

    Inventor： Masayuki Iwase ,  Kazuyuki Ozaki

    IPC: H05K1/09 ,  H05K3/12

    CPC classification number: H05K1/092 ,  G06F3/044 ,  G06F2203/04102 ,  G06F2203/04103 ,  G06F2203/04111 ,  H05K3/1225 ,  H05K3/1233 ,  H05K2201/0329

    Abstract: Disclosed is a method of manufacturing a circuit board, which includes a stand-by process setting a screen printing plate so as to be opposed with a base, where the screen printing plate has a line pattern formed therethrough, and the line pattern is configured by a plurality of dot-like through-holes discretely pierced and arrayed in a single line; a coating process coating an ink which contains a water-dispersed electroconductive paste onto the surface of the screen printing plate; and an ejection process ejecting ink dots through the dot-like through-holes onto the surface of the base, by pressing the screen printing plate into the base under sliding contact of a squeegee with the surface of the screen printing plate, and allowing the ink dots ejected out from the adjacent through-holes to fuse on the surface of the base, to thereby form a linear ink puddle.

    Abstract translation: 公开了一种制造电路板的方法，其包括设置丝网印刷版以与丝网印刷板相对的丝网印刷版的待机过程，其中丝网印刷版具有通过其形成的线图案，并且线图案由 多个点状通孔离散地穿透并排列成一行; 将含有水分散导电浆料的油墨涂覆在丝网印刷版的表面上的涂布工艺; 以及喷墨处理，通过点状通孔将墨点喷射到基座的表面上，通过将丝网印刷板与丝网印刷板的表面滑动接触而将丝网印刷板压入基座，并且允许墨水 从相邻通孔喷出的点在基座的表面上熔化，从而形成线状墨水池。

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