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公开(公告)号：US20230167336A1
公开(公告)日：2023-06-01
申请号：US17920228
申请日：2021-03-22
Applicant: NITTO DENKO CORPORATION
Inventor： Mizuho NAGATA , Yu TACHIKAWA , Tomokazu TAKAHASHI , Satoshi HONDA
IPC: C09J7/38
CPC classification number: C09J7/38 , C09J2301/312 , C09J2301/408
Abstract: Provided is a pressure-sensitive adhesive sheet that can temporarily fix an adherend in a peelable manner, the pressure-sensitive adhesive sheet being free from requiring high-output laser light irradiation at the time of the peeling of the adherend. The pressure-sensitive adhesive sheet of the present invention includes a pressure-sensitive adhesive layer containing a UV absorber, wherein the pressure-sensitive adhesive layer has a first surface and a second surface opposed to the first surface, and wherein a maximum value S1 of a detection intensity of the UV absorber by time-of-flight secondary ion mass spectrometry (TOF-SIMS) in a range of from the first surface to a depth of 1 μm in a thickness direction and a detection intensity C of the UV absorber by the TOF-SIMS at a center point in the thickness direction of the pressure-sensitive adhesive layer satisfy a relationship: S1/C≥1.1.
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公开(公告)号：US20190311936A1
公开(公告)日：2019-10-10
申请号：US16308937
申请日：2017-05-23
Applicant: NITTO DENKO CORPORATION
Inventor： Satoshi HONDA , Yuki SUGO , Nao KAMAKURA
IPC: H01L21/683 , B23K35/02 , C09J7/35 , C09J11/06 , C09J11/08
Abstract: Provided are a thermal bonding sheet capable of suppressing inhibition of sintering of sinterable metallic particles by an organic component, thereby imparting sufficient bonding reliability to a power semiconductor device, and a thermal bonding sheet with a dicing tape having the thermal bonding sheet. A thermal bonding sheet has a precursor layer that is to become a sintered layer by heating, and the precursor layer has sinterable metallic particles and an organic component, a 95% weight loss temperature of the organic component is 150° C. or more and 300° C. or less when thermogravimetry of the thermal bonding sheet is performed under an air atmosphere at a heating rate of 10° C./min.
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公开(公告)号：US20240141217A1
公开(公告)日：2024-05-02
申请号：US18280161
申请日：2022-02-28
Applicant: NITTO DENKO CORPORATION
Inventor： Satoshi HONDA , Masahiro KUZE , Kenichi OKADA , Takayuki KUROKAWA , Jian Ping GONG
IPC: C09J167/00 , C08J5/18 , C09J7/38 , C09J133/08
CPC classification number: C09J167/00 , C08J5/18 , C09J7/38 , C09J133/08
Abstract: Provided is a resin film that has a stress integral value of greater than 10 MPa and 1000 MPa or less when uniaxially stretched at a tensile speed of 300 mm/min at 25° C. until it breaks. The resin film showing these properties is supple and durable.
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公开(公告)号：US20210348036A1
公开(公告)日：2021-11-11
申请号：US17262584
申请日：2019-07-29
Applicant: NITTO DENKO CORPORATION
Inventor： Masayuki OKAMOTO , Naofumi KOSAKA , Satoshi HONDA , Yosuke SHIMIZU , Ryoko ASAI
Abstract: Provided is an optical PSA composition that can be easily peeled using an aqueous liquid such as water and has sufficient adhesive strength. An optical PSA composition comprising an acrylic polymer is provided. The PSA composition comprises at least one species of compound A selected among surfactants and compounds having polyoxyalkylene backbones. The monomers forming the acrylic polymer comprises less than 20 wt % alkoxyalkyl (meth)acrylate and less than 20 wt % alkoxypolyalkylene glycol (meth)acrylate. Alternatively, the compound A content is less than 1 part by weight to 100 parts by weight of the acrylic polymer.
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公开(公告)号：US20240392172A1
公开(公告)日：2024-11-28
申请号：US18696005
申请日：2022-09-21
Applicant: NITTO DENKO CORPORATION
Inventor： Yusuke TAKEDA , Satoshi HONDA , Kenta KUMAKURA , Naofumi KOSAKA
IPC: C09J133/04 , C09J7/38 , C09J11/08
Abstract: The present invention provides a pressure-sensitive adhesive composition having an excellent pressure-sensitive adhesive force to an adherend even in a high temperature, enabling peeling with a small peel force without any adhesive residue when brought into contact with warm water during peeling, and having a pressure-sensitive adhesive force and easy peelability. The pressure-sensitive adhesive composition according to the present invention contains: an acrylic polymer containing a structural unit of an alkoxy group-containing (meth)acrylate monomer as a main component and containing, with respect to 100 parts by mass of all components of monomer structural units, 1 to 40 parts by mass of a structural unit of a polymerizable monomer having a homopolymer Tg of 0° C. or higher; and a surfactant.
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6.发明申请
公开(公告)号：US20240368435A1
公开(公告)日：2024-11-07
申请号：US18773082
申请日：2024-07-15
Applicant: NITTO DENKO CORPORATION
Inventor： Naofumi KOSAKA , Yosuke SHIMIZU , Satoshi HONDA , Taiki SHIMOKURI , Shou TAKARADA , Masayuki SATAKE , Kenichi OKADA , Atsushi TAKASHIMA , Ginji MIZUHARA , Masayuki OKAMOTO , Ryoko ASAI
IPC: C09J7/38 , B32B7/06 , B32B27/18 , B32B27/30 , B32B37/12 , B32B37/18 , B32B38/10 , C09J11/06 , C09J11/08 , C09J133/08
Abstract: Provided is a PSA sheet having a PSA layer. The PSA layer includes a layer A forming at least one surface thereof. The PSA sheet has an adhesive strength N0 of 2.0 N/10 mm or greater, after one day at room temperature following application of the layer A side to a surface of an alkaline float glass plate as an adherend having a contact angle of 5°-10° with distilled water; has an N1 to N0 reduction rate of 30% or lower, wherein N1 is a water-resistant adhesive strength measured after stored at room temperature for one day, immersed in water for 30 minutes, taken out from the water and then residual water is wiped off, and has an N2 to N0 reduction rate of 40% or higher, wherein N2 is a water-peel strength measured after stored at room temperature for one day, 20 μL distilled water is dropped onto the adherend and is allowed to enter a PSA layer/adherend interfacial edge. N2 is measured at a tensile speed of 300 mm/min at a peel angle of 180°.
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公开(公告)号：US20220315808A1
公开(公告)日：2022-10-06
申请号：US17630874
申请日：2020-07-29
Applicant: NITTO DENKO CORPORATION
Inventor： Daisuke MIZUNO , Kensuke TANI , Satoshi HONDA
IPC: C09J7/38
Abstract: The present invention relates to a pressure-sensitive adhesive composition including a compound having a substituent represented by the general formula (1) described in the specification, in which when each of R1 and R2 in the substituent represented by the general formula (1) represents a hydrogen atom, a distance between an oxygen atom of —OR1 and an oxygen atom of —OR2 is 1.31 Å or more and 4.70 Å or less, a pressure-sensitive adhesive layer formed of the pressure-sensitive adhesive composition, and a pressure-sensitive adhesive sheet comprising the pressure-sensitive adhesive layer.
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公开(公告)号：US20210230455A1
公开(公告)日：2021-07-29
申请号：US16967517
申请日：2019-01-28
Applicant: Nitto Denko Corporation
Inventor： Naofumi KOSAKA , Yosuke SHIMIZU , Satoshi HONDA , Taiki SHIMOKURI , Shou TAKARADA , Masayuki SATAKE , Kenichi OKADA , Atsushi TAKASHIMA , Ginji MIZUHARA
Abstract: Provided is a method for peeling a PSA sheet adhered on a polarizing plate. The PSA sheet has a PSA layer. The PSA layer includes a layer A forming at least one surface of the PSA layer. Of the polarizing plate, the surface to which the PSA sheet is adhered is corona-treated or plasma-treated. The peeling method includes a water-peel step in which the PSA sheet is peeled from the polarizing plate, in a state where an aqueous liquid exits at the interface between the polarizing plate and the PSA sheet at the front line of peeling the PSA sheet from the polarizing plate, with the aqueous liquid allowed to further enter the interface following the movement of the peel front line.
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公开(公告)号：US20240409788A1
公开(公告)日：2024-12-12
申请号：US18697099
申请日：2022-09-21
Applicant: NITTO DENKO CORPORATION
Inventor： Satoshi HONDA , Yusuke TAKEDA , Kenta KUMAKURA , Naofumi KOSAKA , Tomokazu TAKAHASHI
IPC: C09J7/38 , C09J11/06 , C09J133/10
Abstract: The present invention provides a pressure-sensitive adhesive composition having an excellent adhesive force when bonding to an adherend, having excellent peelability when subjected to batch heat treatments at a high temperature, and having both a high initial adhesive force and a low post-heating adhesive force. The pressure-sensitive adhesive composition according to the present invention contains: a material having a radically polymerizable functional group; and a thermal polymerization initiator that generates a radical, in which a content of the thermal polymerization initiator is 1.2 to 10 parts by mass with respect to 100 parts by mass of all components excluding the thermal polymerization initiator.
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公开(公告)号：US20230019125A1
公开(公告)日：2023-01-19
申请号：US17785141
申请日：2020-12-10
Applicant: NITTO DENKO CORPORATION
Inventor： Mizuho NAGATA , Yu TACHIKAWA , Tomokazu TAKAHASHI , Satoshi HONDA
Abstract: Provided is a pressure-sensitive adhesive sheet that can temporarily fix an adherend in a peelable manner, the pressure-sensitive adhesive sheet being free from requiring the application of high-output laser light at the time of the peeling of the adherend and being capable of eliminating the need for a step of washing the adherend after the peeling. The pressure-sensitive adhesive sheet of the present invention includes a pressure-sensitive adhesive layer containing a UV absorber and an active energy ray-curable pressure-sensitive adhesive, wherein the pressure-sensitive adhesive sheet has a transmittance of 50% or less for light having a wavelength of 355 nm. In one embodiment, the pressure-sensitive adhesive layer has a thickness of 20 μm or less. In one embodiment, the pressure-sensitive adhesive sheet has a visible light transmittance of 50% or more.
