公开(公告)号：US20140175677A1

公开(公告)日：2014-06-26

申请号：US14188991

申请日：2014-02-25

Applicant: NITTO DENKO CORPORATION

Inventor： Naohide TAKAMOTO ,  Takeshi MATSUMURA ,  Goji SHIGA

IPC: H01L21/683 ,  H01L23/00

CPC classification number: H01L21/6836 ,  H01L21/67132 ,  H01L23/562 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68377 ,  H01L2224/81201 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T428/28 ,  Y10T428/2848 ,  H01L2924/00

Abstract: The present invention provides a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which the film for flip chip type semiconductor back surface contains a black pigment.

Abstract translation: 本发明提供一种半导体背面用切割带一体膜，其特征在于，包括：基材的切割带和设置在基材上的粘合剂层; 以及用于倒装芯片型半导体背面的膜包含黑色颜料的压敏粘合剂层上的倒装芯片型半导体背面的膜。

公开(公告)号：US20160285120A1

公开(公告)日：2016-09-29

申请号：US15028101

申请日：2014-10-08

Applicant: NITTO DENKO CORPORATION

Inventor： Takeshi NAKANO ,  Tsukasa SATO ,  Toshiaki MASAKI ,  Hiroyuki NISHII ,  Takeshi MATSUMURA ,  Yukio ARIMITSU

IPC: H01M8/1004 ,  B32B37/12 ,  H01M8/0276 ,  B32B43/00

CPC classification number: H01M8/1004 ,  B32B7/12 ,  B32B37/12 ,  B32B43/006 ,  B32B2457/18 ,  C09J5/00 ,  C09J7/243 ,  C09J7/385 ,  C09J2203/33 ,  C09J2475/00 ,  H01M8/0276 ,  H01M2008/1095 ,  Y02P70/56

Abstract: A manufacturing method for a fuel-cell membrane electrode assembly, which is excellent in handling property of a polymer electrolyte membrane, can prevent deformation of the polymer electrolyte membrane and the occurrence of a wrinkle therein, and allows efficient mounting of the polymer electrolyte membrane, a gas diffusion electrode, and/or a gas diffusion layer. The manufacturing method for a fuel-cell membrane electrode assembly includes a first gas diffusion electrode, a polymer electrolyte membrane, and a second gas diffusion electrode, the manufacturing method including: conveying the polymer electrolyte membrane, the first gas diffusion electrode, and/or the second gas diffusion electrode in a state of being bonded onto a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive strength which lowers through an external stimulus; and peeling off the pressure-sensitive adhesive sheet by lowering the pressure-sensitive adhesive strength of the pressure-sensitive adhesive sheet through application of the external stimulus to the pressure-sensitive adhesive sheet.

Abstract translation: 高分子电解质膜的处理性优异的燃料电池用膜电极接合体的制造方法能够防止高分子电解质膜的变形和皱纹的发生，能够高效率地安装高分子电解质膜， 气体扩散电极和/或气体扩散层。 燃料电池膜电极组件的制造方法包括：第一气体扩散电极，高分子电解质膜和第二气体扩散电极，其制造方法包括：输送聚合物电解质膜，第一气体扩散电极和/或 所述第二气体扩散电极处于粘合到通过外部刺激降低的压敏粘合强度的压敏粘合片的状态; 并且通过将外部刺激施加到压敏粘合片上来降低压敏粘合片的压敏粘合强度来剥离压敏粘合片。

公开(公告)号：US20140004636A1

公开(公告)日：2014-01-02

申请号：US13917135

申请日：2013-06-13

Applicant: NITTO DENKO CORPORATION

Inventor： Tomokazu TAKAHASHI ,  Shinya AKIZUKI ,  Toshimasa SUGIMURA ,  Takeshi MATSUMURA ,  Daisuke UENDA

IPC: H01L33/60

CPC classification number: H01L33/60 ,  H01L33/0079 ,  H01L33/0095 ,  H01L2221/68327 ,  H01L2221/68336

Abstract: A method of manufacturing an LED including: back-grinding a substrate of an LED wafer including a light emitting element and the substrate; and attaching a protective sheet to the LED wafer one of prior to the back-grinding and after grinding the substrate in the back-grinding.

Abstract translation: 一种制造LED的方法，包括：背面研磨包括发光元件和所述基板的LED晶片的基板; 并且在后磨削之前和在后研磨中研磨基底之后，将保护片附接到LED晶片。

公开(公告)号：US20130285262A1

公开(公告)日：2013-10-31

申请号：US13927408

申请日：2013-06-26

Applicant: Nitto Denko Corporation

Inventor： Naohide TAKAMOTO ,  Takeshi MATSUMURA

IPC: H01L23/00

CPC classification number: H01L21/6836 ,  H01L23/544 ,  H01L23/562 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2223/5448 ,  H01L2224/16 ,  H01L2224/27436 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/12042 ,  Y10T428/1467 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/31511 ,  H01L2924/00 ,  H01L2224/0401

Abstract: The present invention provides a dicing tape-integrated wafer back surface protective film including: a dicing tape including a base material and a pressure-sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored. It is preferable that the colored wafer back surface protective film has a laser marking ability. The dicing tape-integrated wafer back surface protective film can be suitably used for a flip chip-mounted semiconductor device.

Abstract translation: 本发明提供一种切片带集成晶片背面保护膜，其包括：切割带，其包括基材和形成在基材上的压敏粘合剂层; 以及形成在切割带的压敏粘合剂层上的晶片背面保护膜，其中晶片背面保护膜着色。 彩色晶片背面保护膜最好具有激光打标能力。 切割带集成的晶片背面保护膜可以适用于倒装芯片安装的半导体器件。

公开(公告)号：US20130183469A1

公开(公告)日：2013-07-18

申请号：US13740757

申请日：2013-01-14

Applicant: Nitto Denko Corporation

Inventor： Yusaku SHIMIZU ,  Eiji TOYODA ,  Takeshi MATSUMURA

IPC: B32B1/02 ,  B32B3/30

CPC classification number: B32B1/02 ,  B32B3/30 ,  B32B27/20 ,  B32B27/26 ,  B32B27/302 ,  B32B27/38 ,  B32B2270/00 ,  B32B2457/00 ,  B81C1/00269 ,  B81C2203/0118 ,  Y10T156/1052 ,  Y10T428/1397

Abstract: A resin sheet is provided for hollow encapsulation excellent in productivity, and excellent in resin strength and heat resistance as well. The resin sheet for hollow encapsulation to be used for subjecting electronic parts mounted on an aggregate substrate to hollow encapsulation includes an epoxy resin composition containing the following components (A) to (D), in which the resin sheet for hollow encapsulation has, in one surface of a sheet main body, a plurality of cavities for storing the electronic parts to subject the parts to hollow encapsulation: (A) an epoxy resin; (B) a curing agent; (C) an inorganic filler; and (D) a curing accelerator.

Abstract translation: 树脂片材的生产率优异，树脂强度和耐热性也优异。 用于将安装在集合基板上的电子部件用于中空封装的中空封装用树脂片材包括含有以下成分（A）〜（D）的环氧树脂组合物，其中中空封装用树脂片材 片状主体的表面，多个空腔，用于存放电子部件以使部件承受中空封装：（A）环氧树脂; （B）固化剂; （C）无机填料; 和（D）固化促进剂。

公开(公告)号：US20160211217A1

公开(公告)日：2016-07-21

申请号：US14908687

申请日：2014-06-30

Applicant: NITTO DENKO CORPORATION

Inventor： Chie IINO ,  Takeshi MATSUMURA ,  Goji SHIGA ,  Kosuke MORITA

IPC: H01L23/544 ,  H01L25/00 ,  H01L25/065

CPC classification number: H01L23/544 ,  H01L21/561 ,  H01L23/295 ,  H01L23/3128 ,  H01L24/02 ,  H01L24/11 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/0401 ,  H01L2224/16146 ,  H01L2224/17181 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2224/92 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2225/06593 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0231 ,  H01L2224/11 ,  H01L2224/83 ,  H01L21/56 ,  H01L2223/544 ,  H01L21/304 ,  H01L21/78 ,  H01L2924/00014

Abstract: Provided is a thermosetting sheet for sealing which is used to seal an electronic device. One surface of the sheet has a surface roughness (Ra) of 3 μm or less before the sheet is cured.

Abstract translation: 提供一种用于密封电子设备的用于密封的热固性片材。 片材的一个表面在片材固化之前的表面粗糙度（Ra）为3μm以下。

公开(公告)号：US20140091480A1

公开(公告)日：2014-04-03

申请号：US14095164

申请日：2013-12-03

Applicant: NITTO DENKO CORPORATION

Inventor： Naohide TAKAMOTO ,  Takeshi MATSUMURA

IPC: H01L21/683 ,  H01L23/00

CPC classification number: H01L21/6836 ,  H01L23/544 ,  H01L23/562 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2223/5448 ,  H01L2224/16 ,  H01L2224/27436 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/12042 ,  Y10T428/1467 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/31511 ,  H01L2924/00 ,  H01L2224/0401

Abstract: The present invention provides a dicing tape-integrated wafer back surface protective film including: a dicing tape including a base material and a pressure-sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored. It is preferable that the colored wafer back surface protective film has a laser marking ability. The dicing tape-integrated wafer back surface protective film can be suitably used for a flip chip-mounted semiconductor device.

Abstract translation: 本发明提供一种切片带集成晶片背面保护膜，其包括：切割带，其包括基材和形成在基材上的压敏粘合剂层; 以及形成在切割带的压敏粘合剂层上的晶片背面保护膜，其中晶片背面保护膜着色。 彩色晶片背面保护膜最好具有激光打标能力。 切割带集成的晶片背面保护膜可以适用于倒装芯片安装的半导体器件。

公开(公告)号：US20140000793A1

公开(公告)日：2014-01-02

申请号：US13913807

申请日：2013-06-10

Applicant: NITTO DENKO CORPORATION

Inventor： Tomokazu TAKAHASHI ,  Shinya AKIZUKI ,  Toshimasa SUGIMURA ,  Takeshi MATSUMURA ,  Daisuke UENDA

IPC: H01L33/00

CPC classification number: H01L33/005 ,  H01L21/6836 ,  H01L24/27 ,  H01L33/0079 ,  H01L33/0095 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/83191 ,  H01L2224/94 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2224/27

Abstract: A method of manufacturing an LED according to an embodiment of the present invention includes back-grinding a substrate of an LED wafer including a light emitting element and the substrate, where the back-grinding includes fixing the LED wafer to a table via a double-sided pressure-sensitive adhesive sheet, and then grinding the substrate.

Abstract translation: 根据本发明的实施例的制造LED的方法包括对包括发光元件和基板的LED晶片的基板进行背面磨削，其中所述后研磨包括经由双层结构将LED晶片固定到工作台上， 双面压敏粘合片，然后研磨基材。

公开(公告)号：US20130185934A1

公开(公告)日：2013-07-25

申请号：US13739395

申请日：2013-01-11

Applicant: NITTO DENKO CORPORATION

Inventor： Eiji TOYODA ,  Yusaku SHIMIZU ,  Takeshi MATSUMURA

IPC: H05K3/28 ,  H05K13/00

CPC classification number: H05K3/284 ,  C08G59/621 ,  C08L63/00 ,  H01L21/56 ,  H01L23/293 ,  H01L23/3121 ,  H01L2924/0002 ,  H05K13/00 ,  Y10T29/49146 ,  H01L2924/00

Abstract: A resin composition sheet for encapsulating electronic parts and a method of producing an electronic part apparatus using the sheet are provided. The method includes: loading, on a substrate, a resin composition sheet for encapsulating electronic parts including a thermosetting resin composition containing an epoxy resin, a phenol resin, an inorganic filler, and a curing accelerator, having a lowest viscosity in a specific range, and a thickness in a specific range; heating the substrate in a chamber in a decompressed state to sag an end portion of the sheet until it is in contact with a surface of the substrate; and releasing a pressure in the chamber to cause the sheet to adhere onto the substrate due to a difference between a pressure in the space between the sheet and the substrate, and the pressure in the chamber after the release, followed by thermal curing.

Abstract translation: 提供了一种用于封装电子部件的树脂组合物片材和使用该片材的电子部件装置的制造方法。 该方法包括：在基材上装载包含含有特定范围内最低粘度的环氧树脂，酚醛树脂，无机填料和固化促进剂的热固性树脂组合物的电子部件用树脂组合物片， 厚度在特定范围内; 在处于减压状态的腔室中加热衬底以使片材的端部下垂，直到其与衬底的表面接触; 并且释放室内的压力，由于片材与基板之间的间隔的压力和释放后的室内的压力之间的差异，随后进行热固化，使片材粘附到基板上。

公开(公告)号：US20130139874A1

公开(公告)日：2013-06-06

申请号：US13683673

申请日：2012-11-21

Applicant: Nitto Denko Corporation

Inventor： Hiroshi YAMAZAKI ,  Kojiro KAMEYAMA ,  Takeshi MATSUMURA ,  Eiji TOYODA

IPC: C09J9/02 ,  H01L31/0224 ,  B32B38/06

CPC classification number: C09J9/02 ,  B32B38/06 ,  B32B2307/202 ,  B32B2311/00 ,  B32B2457/12 ,  C09J7/28 ,  C09J7/29 ,  C09J2201/16 ,  C09J2201/32 ,  C09J2201/602 ,  C09J2203/322 ,  C09J2400/163 ,  H01L31/0201 ,  H01L31/0508 ,  H01L31/0512 ,  Y02E10/50 ,  Y10T156/1044 ,  Y10T428/12389 ,  Y10T428/1241 ,  Y10T428/24529 ,  Y10T428/24628

Abstract: A conductive adhesive sheet includes a conductor layer including a projecting region that projects curvedly toward at least one side in the thickness direction; a low-melting-point metal layer that is formed on at least one surface in the thickness direction of the projecting region; and an adhesive layer formed on at least one surface in the thickness direction of the low-melting-point metal layer.

Abstract translation: 导电性粘合片包括导体层，导体层包括在厚度方向上朝向至少一侧弯曲地突出的突出区域; 形成在所述突出区域的厚度方向的至少一个面上的低熔点金属层; 以及在低熔点金属层的厚度方向的至少一个面上形成的粘合剂层。