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公开(公告)号:US20140151221A1
公开(公告)日:2014-06-05
申请号:US14069003
申请日:2013-10-31
申请人: NXP B.V.
发明人: Roel Daamen , Viet Hoang Nguyen
IPC分类号: G01N27/327
CPC分类号: G01N27/3272 , G01N27/4148 , H01L21/30625 , H01L21/311 , H01L21/3212 , H01L21/32134 , H01L23/5226 , H01L2224/039
摘要: A method of manufacturing a module for a biosensor is disclosed. The method includes providing a substrate. The substrate includes a trench and a bond pad. The trench is filled with an electrically conductive material and the bond pad is arranged within the substrate. The method also includes removing a part of the electrically conductive material from the trench such that a recess is formed in a surface of the substrate, forming a biocompatible electrode in the recess, and removing a part of the substrate such that the bond pad is accessible through the surface of the substrate.
摘要翻译: 公开了一种用于生物传感器的模块的制造方法。 该方法包括提供基板。 衬底包括沟槽和接合焊盘。 沟槽填充有导电材料,并且接合焊盘被布置在衬底内。 该方法还包括从沟槽中去除导电材料的一部分,使得在衬底的表面中形成凹陷,在凹部中形成生物相容的电极,以及去除衬底的一部分,使得焊盘可接近 通过基板的表面。
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公开(公告)号:US09818905B2
公开(公告)日:2017-11-14
申请号:US14883503
申请日:2015-10-14
申请人: NXP B.V.
IPC分类号: H01L31/18 , G01N21/76 , H01L31/02 , G01N29/02 , G01N29/036 , G01N33/00 , G01N21/78 , G01N21/77
CPC分类号: H01L31/18 , G01N21/766 , G01N21/77 , G01N21/783 , G01N29/022 , G01N29/036 , G01N33/004 , G01N2291/021 , G01N2291/0256 , G01N2291/02809 , G01N2291/0427 , H01L31/02 , Y02A50/243 , Y02A50/244
摘要: Disclosed is an integrated circuit comprising a substrate (10); and an optical CO2 sensor comprising: first and second light sensors (12, 12′) on said substrate, said second light sensor being spatially separated from the first light sensor; and a layer portion (14) including an organic compound comprising at least one amine or amidine functional group over the first light sensor; wherein said integrated circuit further comprises a signal processor (16) coupled to the first and second light sensor for determining a difference in the respective outputs of the first and second light sensor. An electronic device comprising such a sensor and a method of manufacturing such an IC are also disclosed.
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公开(公告)号:US09177852B2
公开(公告)日:2015-11-03
申请号:US14449522
申请日:2014-08-01
申请人: NXP B.V.
发明人: Peter Gerard Steeneken , Roel Daamen , Gerard Koops , Jan Sonsky , Evelyne Gridelet , Coenraad Cornelis Tak
IPC分类号: H01L21/70 , H01L21/762 , H01L21/8238
CPC分类号: H01L21/76232 , H01L21/76224 , H01L21/823878
摘要: An isolated semiconductor circuit comprising: a first sub-circuit and a second sub-circuit; a backend that includes an electrically isolating connector between the first and second sub-circuits; a lateral isolating trench between the semiconductor portions of the first and second sub-circuits, wherein the lateral isolating trench extends along the width of the semiconductor portions of the first and second sub-circuits, wherein one end of the isolating trench is adjacent the backend, and wherein the isolating trench is filled with an electrically isolating material.
摘要翻译: 一种隔离半导体电路,包括:第一子电路和第二子电路; 后端,其包括在所述第一和第二子电路之间的电隔离连接器; 在所述第一和第二子电路的半导体部分之间的横向隔离沟槽,其中所述横向隔离沟槽沿着所述第一和第二子电路的半导体部分的宽度延伸,其中所述隔离沟槽的一端与所述后端 ,并且其中所述隔离沟槽填充有电绝缘材料。
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公开(公告)号:US20150123241A1
公开(公告)日:2015-05-07
申请号:US14500889
申请日:2014-09-29
申请人: NXP B.V.
发明人: Liang Yan , Roel Daamen , Anco Heringa , Erwin Hijzen
IPC分类号: H01L27/12 , H01L29/06 , H01L27/06 , H01L23/367
CPC分类号: H01L27/1203 , H01L23/3677 , H01L27/0211 , H01L29/0653 , H01L29/0696 , H01L29/7824 , H01L2924/0002 , H05K7/20 , H01L2924/00
摘要: An integrated heat sink array is introduced in SOI power devices having multiple unit cells, which can be used to reduce the temperature rise in obtaining more uniform temperature peaks for all the unit cells across the device area, so that the hot spot which is prone to breakdown can be avoided, thus the safe operating area of the device can be improved. Also the array sacrifice less area of the device, therefore results in low Rdson.
摘要翻译: 在具有多个单元电池的SOI功率器件中引入了集成散热器阵列,其可以用于降低温度上升,从而在器件区域上的所有单元电池获得更均匀的温度峰值,使得易于 可以避免故障,从而可以提高设备的安全工作面积。 此外,阵列牺牲了较少的器件面积,因此导致低Rdson。
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公开(公告)号:US20150123200A1
公开(公告)日:2015-05-07
申请号:US14500840
申请日:2014-09-29
申请人: NXP B.V.
发明人: Liang Yan , Roel Daamen , Anco Heringa , Erwin Hijzen
IPC分类号: H01L25/07 , H01L29/78 , H01L29/06 , H01L23/367
CPC分类号: H01L25/072 , H01L23/3677 , H01L27/0211 , H01L27/1203 , H01L29/0653 , H01L29/0696 , H01L29/7824 , H01L2924/0002 , H01L2924/00
摘要: An integrated heat sink array is introduced in SOI power devices having multiple unit cells, which can be used to reduce the temperature rise in obtaining more uniform temperature peaks for all the unit cells across the device area, so that the hot spot which is prone to breakdown can be avoided, thus the safe operating area of the device can be improved. Also the array sacrifice less area of the device, therefore results in low Rdson.
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公开(公告)号:US09891183B2
公开(公告)日:2018-02-13
申请号:US14793257
申请日:2015-07-07
申请人: NXP B.V.
CPC分类号: G01N27/223 , G01N21/8851 , G01N27/24 , G01N2021/8854 , G06F21/87 , H01L23/57 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/181 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要: One example discloses a breach sensor, comprising: a substrate including an integrated circuit; a passivation layer coupled to the substrate; a breach sensing element coupled to the circuit; wherein the breach sensing element is on a first side of the passivation layer and the substrate is on a second side of the passivation layer; a barrier configured to separate the breach sensing element from an ambient environment; wherein the breach sensing element is responsive to barrier damage.
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公开(公告)号:US20170010232A1
公开(公告)日:2017-01-12
申请号:US14793257
申请日:2015-07-07
申请人: NXP B.V.
CPC分类号: G01N27/223 , G01N21/8851 , G01N27/24 , G01N2021/8854 , G06F21/87 , H01L23/57 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/181 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要: One example discloses a breach sensor, comprising: a substrate including an integrated circuit; a passivation layer coupled to the substrate; a breach sensing element coupled to the circuit; wherein the breach sensing element is on a first side of the passivation layer and the substrate is on a second side of the passivation layer; a barrier configured to separate the breach sensing element from an ambient environment; wherein the breach sensing element is responsive to barrier damage.
摘要翻译: 一个实例公开了一种破裂传感器,包括:包括集成电路的基板; 耦合到所述衬底的钝化层; 耦合到所述电路的漏电传感元件; 其中所述漏泄感测元件位于所述钝化层的第一侧上,并且所述衬底位于所述钝化层的第二侧上; 阻挡构造成将破裂传感元件与周围环境分离; 其中所述破裂传感元件响应于屏障损坏。
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公开(公告)号:US20140323350A1
公开(公告)日:2014-10-30
申请号:US14363449
申请日:2012-12-06
申请人: NXP B.V.
IPC分类号: G01N33/68 , G01N33/543 , G01N33/558
CPC分类号: G01N33/689 , G01N27/3274 , G01N33/5438 , G01N33/558
摘要: A lateral test flow arrangement for a test molecule is disclosed, comprising: a test strip for transporting an analyte away from a sampling region and towards an absorbing region, the test strip having therein and remote from the sampling region, a test region for functionalization with a molecule which binds to the test molecule or to a conjugate of the test molecule; a sensing test capacitor having electrodes extending across the test strip at least partially aligned with the test region and being physically isolated therefrom; a reference test capacitor having electrodes extending across the test strip and being physically isolated therefrom; and an electronic circuit configured to measure a time-dependant capacitance difference between the sensing test capacitor and the reference test capacitor. A method for carrying out that lateral flow tests is also disclosed, as are test systems and in particular pregnancy test systems
摘要翻译: 公开了一种用于测试分子的横向测试流程布置,包括:测试条,用于将分析物从采样区域传输到吸收区域,测试条带在其中并且远离采样区域,测试区域用于与 结合测试分子或测试分子的缀合物的分子; 感测测试电容器,其具有延伸穿过所述测试条的电极,所述电极至少部分地与所述测试区域对齐并与其物理隔离; 参考测试电容器,其具有延伸穿过测试条并且与其物理隔离的电极; 以及电子电路,被配置为测量感测测试电容器和参考测试电容器之间的时间相关的电容差。 还公开了进行横向流动测试的方法,以及测试系统,特别是妊娠测试系统
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公开(公告)号:US20140203391A1
公开(公告)日:2014-07-24
申请号:US13887144
申请日:2013-05-03
申请人: NXP B.V.
发明人: Roel Daamen , Nebojsa Nenadovic , Erik Jan Lous
IPC分类号: H01L27/146
CPC分类号: H01L27/14643 , G01S3/781 , G01S3/784 , H01L27/1446 , H01L27/14618 , H01L27/14683 , H01L31/02024 , H01L31/02164 , H01L2224/4847
摘要: An integrated circuit and a method of making the same. The integrated circuit includes a semiconductor substrate having a major surface. The integrated circuit also includes a directional light sensor. The directional light sensor includes a plurality of photodetectors located on the major surface. The directional light sensor also includes one or more barriers, wherein each barrier is positioned to shade one or more of the photodetectors from light incident upon the integrated circuit from a respective direction. The directional light sensor is operable to determine a direction of light incident upon the integrated circuit by comparing an output signal of at least two of the photodetectors.
摘要翻译: 一种集成电路及其制造方法。 集成电路包括具有主表面的半导体衬底。 集成电路还包括定向光传感器。 定向光传感器包括位于主表面上的多个光电探测器。 定向光传感器还包括一个或多个障碍物,其中每个屏障被定位成使一个或多个光电探测器从相应的方向遮蔽入射在集成电路上的光。 定向光传感器可操作以通过比较至少两个光电检测器的输出信号来确定入射在集成电路上的光的方向。
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公开(公告)号:US09921228B2
公开(公告)日:2018-03-20
申请号:US14363449
申请日:2012-12-06
申请人: NXP B.V.
IPC分类号: G01N33/50 , G01N33/68 , G01N33/558 , G01N33/543 , G01N27/327
CPC分类号: G01N33/689 , G01N27/3274 , G01N33/5438 , G01N33/558
摘要: A lateral test flow arrangement for a test molecule is disclosed, comprising: a test strip for transporting an analyte away from a sampling region and towards an absorbing region, the test strip having therein and remote from the sampling region, a test region for functionalization with a molecule which binds to the test molecule or to a conjugate of the test molecule; a sensing test capacitor having electrodes extending across the test strip at least partially aligned with the test region and being physically isolated therefrom; a reference test capacitor having electrodes extending across the test strip and being physically isolated therefrom; and an electronic circuit configured to measure a time-dependant capacitance difference between the sensing test capacitor and the reference test capacitor. A method for carrying out that lateral flow tests is also disclosed, as are test systems and in particular pregnancy test systems.
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