公开(公告)号：US5969138A

公开(公告)日：1999-10-19

申请号：US961221

申请日：1997-10-30

申请人： Naruyoshi Mita ,  Hiroshi Nagase ,  Hajime Iizuka ,  Takahisa Oguchi ,  Kazuya Sakai ,  Kazutoshi Horikomi ,  Takaichi Miwa ,  Shinji Takahashi

发明人： Naruyoshi Mita ,  Hiroshi Nagase ,  Hajime Iizuka ,  Takahisa Oguchi ,  Kazuya Sakai ,  Kazutoshi Horikomi ,  Takaichi Miwa ,  Shinji Takahashi

IPC分类号： A61K31/496 ,  C07D207/26 ,  C07D207/27 ,  C07D241/02

CPC分类号： C07D207/27 ,  A61K31/496

摘要： Since a compound represented by general formula (1), its pharmaceutically acceptable salt and a hydrate of the pharmaceutically acceptable salt have high antipsychotic activity, they may be used as an active ingredient for preparation of an antipsychotic. ##STR1## Also provided are an optical resolution method of the above compound and an intermediate for preparation of the compound.

摘要翻译： 由于由通式（1）表示的化合物，其药学上可接受的盐和药学上可接受的盐的水合物具有高抗精神病活性，因此它们可以用作制备抗精神病药的活性成分。 还提供了上述化合物和制备该化合物的中间体的光学拆分方法。

公开(公告)号：US5538985A

公开(公告)日：1996-07-23

申请号：US377236

申请日：1995-01-24

申请人： Hajime Iizuka ,  Takahisa Oguchi ,  Yoji Aoki ,  Norio Ohto ,  Kazutoshi Horikomi ,  Takaichi Miwa ,  Takeshi Kamioka ,  Shoji Kawashima

发明人： Hajime Iizuka ,  Takahisa Oguchi ,  Yoji Aoki ,  Norio Ohto ,  Kazutoshi Horikomi ,  Takaichi Miwa ,  Takeshi Kamioka ,  Shoji Kawashima

IPC分类号： C07D207/26 ,  C07D401/06 ,  A61K31/395 ,  C07D403/02

CPC分类号： C07D207/26 ,  C07D401/06

摘要： Antipsychotics and ischemic cerebral disease therapeutics comprising as an effective ingredient a compound represented by the following formula (1) or (2): ##STR1## or a salt thereof. These drugs do not induce extrapyramidal side effects.

摘要翻译： 抗精神病药和缺血性脑病治疗剂，其包含作为有效成分的由下式（1）或（2）表示的化合物或其盐。 这些药物不会引起锥体外系的副作用。

公开(公告)号：US06207825B1

公开(公告)日：2001-03-27

申请号：US09190297

申请日：1998-11-13

申请人： Hajime Iizuka ,  Hiroshi Nagase ,  Naruyoshi Mita

发明人： Hajime Iizuka ,  Hiroshi Nagase ,  Naruyoshi Mita

IPC分类号： C07D40106

CPC分类号： C07D207/277

摘要： A compound represented by the following formula (12) useful as an intermediate for production of drug or agricultural chemical: (wherein R21 to R25 are each independently a hydrogen atom, a hydroxyl group, a halogen atom, an alkyl group of 1 to 4 carbon atoms, an alkoxy group of 1 to 4 carbon atoms, a perfluoroalkyl group of 1 to 4 carbon atoms, a cyano group, a nitro group, an amino group, a carboxyl group, a thiol group, an alkylthio group of 1 to 4 carbon atoms or a carbamoyl group) can be produced by reacting a compound represented by the formula (13): (wherein R21 to R25 have the same definitions as given above) with 1,1-cyclopropanedicarboxylic acid. The compound of the formula (12) is useful as a raw material for production of a pyrrolidinone compound useful as an active ingredient of drug.

摘要翻译： 由下式（12）表示的化合物可用作药物或农药的生产中间体：（其中R21至R25各自独立地为氢原子，羟基，卤素原子，1-4个碳原子的烷基 1〜4个碳原子的烷氧基，1〜4个碳原子的全氟烷基，氰基，硝基，氨基，羧基，硫醇基，1〜4个碳的烷硫基 原子或氨基甲酰基）可以通过使式（13）表示的化合物（其中R21至R25具有与上述相同的定义）与1,1-环丙烷二羧酸反应来制备。 式（12）的化合物可用作生产用作药物活性成分的吡咯烷酮化合物的原料。

公开(公告)号：US06555694B1

公开(公告)日：2003-04-29

申请号：US09694340

申请日：2000-10-24

申请人： Hajime Iizuka ,  Hiroshi Nagase ,  Naruyoshi Mita

发明人： Hajime Iizuka ,  Hiroshi Nagase ,  Naruyoshi Mita

IPC分类号： C07D20726

CPC分类号： C07D207/277

摘要： A compound represented by the following formula (12) useful as an intermediate for production of drug or agricultural chemical: (wherein R21 to R25 are each independently a hydrogen atom, a hydroxyl group, a halogen atom, an alkyl group of 1 to 4 carbon atoms, an alkoxy group of 1 to 4 carbon atoms, a perfluoroalkyl group of 1 to 4 carbon atoms, a cyano group, a nitro group, an amino group, a carboxyl group, a thiol group, an alkylthio group of 1 to 4 carbon atoms or a carbamoyl group) can be produced by reacting a compound represented by the formula (13): (wherein R21 to R25 have the same definitions as given above) with 1,1-cyclopropanedicarboxylic acid. The compound of the formula (12) is useful as a raw material for production of a pyrrolidinone compound useful as an active ingredient of drug.

摘要翻译： 由下式（12）表示的化合物可用作药物或农药的生产中间体：（其中R21至R25各自独立地为氢原子，羟基，卤素原子，1-4个碳原子的烷基 1〜4个碳原子的烷氧基，1〜4个碳原子的全氟烷基，氰基，硝基，氨基，羧基，硫醇基，1〜4个碳的烷硫基 原子或氨基甲酰基）可以通过使式（13）表示的化合物（其中R21至R25具有与上述相同的定义）与1,1-环丙烷二羧酸反应来制备。 式（12）的化合物可用作生产用作药物活性成分的吡咯烷酮化合物的原料。

公开(公告)号：US06670447B2

公开(公告)日：2003-12-30

申请号：US10070156

申请日：2002-03-04

申请人： Hidetoshi Tsunoda ,  Michiru Sekiguchi ,  Hajime Iizuka ,  Kazuya Sakai

发明人： Hidetoshi Tsunoda ,  Michiru Sekiguchi ,  Hajime Iizuka ,  Kazuya Sakai

IPC分类号： C07K1600

CPC分类号： C07D263/44 ,  C07C231/10 ,  C07C237/22 ,  C07D231/12 ,  C07D233/56 ,  C07D249/08 ,  C07D295/185 ,  C07D413/06 ,  C07D413/14 ,  C07D417/06 ,  C07D417/14 ,  C07D471/04 ,  C07D487/08

摘要： This invention provides amino acid N-carboxyanhydrides, each of which has an N-acyl substituent on its nitrogen atom, is represented by the following formula (1): readily reacts with nucleophilic reagents such as free amino acids, alcohols, anions or the like, and are intermediates useful for the high-yield production of amino acid derivatives, optically active compounds, peptides, polypeptides and the like useful in many fields lead by the fields of pharmaceuticals and agrochemicals, and also provides a process for the production of the amino acid N-carboxyanhydrides. Further, the present invention also provides a process for the production of diamides, which uses the compounds of the formula (1) and amine derivatives represented by the following formula (7): These diamides can also be suitably used for the production of amino acid derivatives, optically active compounds, peptides, polypeptides and the like.

摘要翻译： 本发明提供氨基酸N-羧酸酐，其各自在其氮原子上具有N-酰基取代基，由下式（1）表示：容易与亲核试剂如游离氨基酸，醇，阴离子等反应 并且是用于高产量生产氨基酸衍生物，光学活性化合物，肽，多肽等的中间体，其在许多领域中可用于药物和农用化学品的领域，并且还提供了制备氨基酸的方法 酸性N-羧酸酐。 此外，本发明还提供了使用式（1）的化合物和由下式（7）表示的胺衍生物的二酰胺的制备方法：这些二酰胺也可以适合用于制备氨基酸 衍生物，光学活性化合物，肽，多肽等。

公开(公告)号：US07989707B2

公开(公告)日：2011-08-02

申请号：US11815580

申请日：2006-12-12

申请人： Takaharu Yamano ,  Hajime Iizuka ,  Hideaki Sakaguchi ,  Toshio Kobayashi ,  Tadashi Arai ,  Tsuyoshi Kobayashi ,  Tetsuya Koyama ,  Kiyoaki Iida ,  Tomoaki Mashima ,  Koichi Tanaka ,  Yuji Kunimoto ,  Takashi Yanagisawa

发明人： Takaharu Yamano ,  Hajime Iizuka ,  Hideaki Sakaguchi ,  Toshio Kobayashi ,  Tadashi Arai ,  Tsuyoshi Kobayashi ,  Tetsuya Koyama ,  Kiyoaki Iida ,  Tomoaki Mashima ,  Koichi Tanaka ,  Yuji Kunimoto ,  Takashi Yanagisawa

IPC分类号： H05K1/16

CPC分类号： H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L25/16 ,  H01L25/162 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/85 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/207 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/185 ,  H05K1/186 ,  H05K3/20 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4644 ,  H05K2201/10007 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00

摘要： A method of producing a chip embedded substrate is disclosed. This method comprises a first step of mounting a semiconductor chip on a first substrate on which a first wiring is formed; and a second step of joining the first substrate with a second substrate on which a second wiring is formed. In the second step, the semiconductor chip is encapsulated between the first substrate and the second substrate and electrical connection is made between the first wiring and the second wiring so as to form multilayered wirings connected to the semiconductor chip.

摘要翻译： 公开了一种制造芯片嵌入式基板的方法。 该方法包括将半导体芯片安装在其上形成有第一布线的第一基板上的第一步骤; 以及将第一基板与形成有第二布线的第二基板接合的第二步骤。 在第二步骤中，将半导体芯片封装在第一基板和第二基板之间，并且在第一布线和第二布线之间形成电连接，以形成连接到半导体芯片的多层布线。

公开(公告)号：US5960308A

公开(公告)日：1999-09-28

申请号：US40370

申请日：1998-03-18

申请人： Masatoshi Akagawa ,  Mitsutoshi Higashi ,  Hajime Iizuka ,  Takehiko Arai

发明人： Masatoshi Akagawa ,  Mitsutoshi Higashi ,  Hajime Iizuka ,  Takehiko Arai

IPC分类号： H01L21/60 ,  H01L23/31 ,  H01L23/485 ,  H01L23/528 ,  H01L23/532 ,  H01L23/552 ,  H01L21/44

CPC分类号： H01L24/12 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/5283 ,  H01L23/5329 ,  H01L23/53295 ,  H01L23/552 ,  H01L24/02 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/3025

摘要： A process for making a chip sized semiconductor device, in which a semiconductor chip is prepared so as to have electrodes on one of surfaces thereof and an electrically insulating passivation film formed on the one surface except for areas where the electrodes exist. An insulation sheet is prepared so as to have first and second surfaces and a metallic film coated on the first surface. The second surface of the insulation sheet is adhered on the one surface of the semiconductor chip. First via-holes are provided in the metallic film at positions corresponding to the electrodes. Second via-holes are provided in the insulation sheet at positions corresponding to the first via-holes so that the electrodes are exposed. The metallic film is electrically connected to the electrodes of the semiconductor chip through the first and second via-holes. A circuit pattern is formed from the metallic film so that the circuit pattern has external terminal connecting portions. An insulation film is adhered on the insulation sheet so that the external terminal connecting portions are exposed. External connecting terminals are electrically connected to the external terminal connecting portions of the circuit pattern.

摘要翻译： 制造芯片尺寸的半导体器件的方法，其中制备半导体芯片以在其一个表面上具有电极，以及形成在除了存在电极的区域之外的一个表面上的电绝缘钝化膜。 制备绝缘片以具有第一表面和第二表面以及涂覆在第一表面上的金属膜。 绝缘片的第二表面粘附在半导体芯片的一个表面上。 在与电极对应的位置处，在金属膜上设置有第一通路孔。 在绝缘片上设置有与第一通路孔对应的位置露出​​第二通孔。 金属膜通过第一和第二通孔与半导体芯片的电极电连接。 电路图案由金属膜形成，使得电路图案具有外部端子连接部分。 绝缘膜粘附在绝缘片上，使得外部端子连接部分露出。 外部连接端子电连接到电路图案的外部端子连接部分。

公开(公告)号：US5198942A

公开(公告)日：1993-03-30

申请号：US520085

申请日：1990-05-07

申请人： Hajime Iizuka ,  Zenjiro Uchida

发明人： Hajime Iizuka ,  Zenjiro Uchida

IPC分类号： G06F3/06 ,  G11B5/54 ,  G11B19/04 ,  G11B21/12 ,  G11B33/12

CPC分类号： G11B33/121 ,  G11B19/04 ,  G11B5/54

摘要： A disc drive control device maintains power to its circuits after a manual power source switch is opened for a time sufficient to assure that the read/write head of a hard disc drive is moved to its shipping zone. This is accomplished with a bypass device for maintaining power to the hard disc drive until the head is properly stowed in its shipping position after the operator turns off the power switch. Further, a detecting circuit prevents the disc drive from hanging up when the operator turns power on again before the head movement is completed. A timer turns off the power bypass device a short time after the power source switch is turned off, if, for any reason, the power bypass fails to be shut down as a normal result of the completed movement of the read/write head to the shipping position.

公开(公告)号：US4965263A

公开(公告)日：1990-10-23

申请号：US310505

申请日：1989-02-14

申请人： Takashi Nishina ,  Joji Kamiya ,  Yasuhito Tanaka ,  Tsutomu Katakami ,  Nobuyuki Fukazawa ,  Hajime Iizuka ,  Takuo Nakano

发明人： Takashi Nishina ,  Joji Kamiya ,  Yasuhito Tanaka ,  Tsutomu Katakami ,  Nobuyuki Fukazawa ,  Hajime Iizuka ,  Takuo Nakano

IPC分类号： C07D237/04 ,  C07D401/12 ,  C07D403/12 ,  C07D405/12 ,  C07D409/12

CPC分类号： C07D401/12 ,  C07D237/04 ,  C07D403/12 ,  C07D405/12 ,  C07D409/12

摘要： This invention relates to pyridazinone derivatives of the general formula: ##STR1## [wherein R.sup.1 stands for a hydrogen atom or a lower alkyl group; R.sup.2 for a hydrogen atom or a lower alkyl group; and A for (i) a ring selected from a benzene ring, a furan ring, a thiophene ring and a pyridine ring (on which ring 1-3 substituents or atoms selected from amino groups, nitro groups, lower alkanoylamino groups, hydroxyl groups, lower alkanoyloxy groups, sulfamoyl groups and halogen atoms may be present), or (ii) a grouping of the formula: ##STR2## (wherein R.sup.3 stands for a hydrogen atom, a lower alkyl group, a phenyl(lower)alkyl, a hydroxyphenyl(lower)alkyl group, a lower alkylmercapto(lower)alkyl group, a benzylmercapto(lower)alkyl group, a guanidino(lower)alkyl group, a nitroguanidino(lower)alkyl group, an indolyl(lower)alkyl group, a carbamoyl(lower)alkyl group or a carboxy(lower)alkyl group, R.sup.4 for a hydrogen atom or a lower alkyl group, R.sup.5 for a hydrogen atom, a lower alkyl group, a lower alkanoyl group, a benzoyl or a benzyloxycarbonyl group, and R.sup.3 and R.sup.4 may be combined to form a grouping of the formula: ##STR3## which forms a ring), or (iii) a grouping of the formula: ##STR4## (wherein R.sup.6, R.sup.7 and R.sup.8 each stand for a hydrogen atom or a lower alkyl group, B is an oxygen atom or a sulfur atom, R.sup.9 stands for a hydrogen atom or a lower alkanoyl group, and n is 0 or 1)].

公开(公告)号：US08736053B2

公开(公告)日：2014-05-27

申请号：US13526821

申请日：2012-06-19

申请人： Koichi Tanaka ,  Nobuyuki Kurashima ,  Hajime Iizuka ,  Tetsuya Koyama

发明人： Koichi Tanaka ,  Nobuyuki Kurashima ,  Hajime Iizuka ,  Tetsuya Koyama

IPC分类号： H01L23/48

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L21/568 ,  H01L23/3135 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3511

摘要： A circuit substrate having a mounting surface on which a semiconductor chip is mounted and at least one connection pad formed on the mounting surface is connected to a support plate having at least one mounting portion with a diameter larger than a diameter of the connection pad, through a truncated-cone-shaped solder layer which is formed from at least one solder ball on the basis of a difference between the diameter of the mounting portion and the diameter of the connection pad.

摘要翻译： 具有安装有半导体芯片的安装面的电路基板和形成在安装面上的至少一个连接焊盘连接到具有至少一个直径大于连接焊盘直径的安装部分的支撑板上，通过 基于安装部分的直径和连接焊盘的直径之间的差异，由至少一个焊球形成的截锥形焊料层。