公开(公告)号：US20230123836A1

公开(公告)日：2023-04-20

申请号：US17548610

申请日：2021-12-13

申请人： National Central University

发明人： Chih-Kuang Lin ,  Jeng-Rong Ho ,  Pi-Cheng Tung

IPC分类号： B23K26/38 ,  B23K26/046 ,  B23K26/08 ,  B23K26/122

摘要： A method for slicing an ingot column is provided, including the following steps: immersing the column into a solution; rotating the column; focusing the rotating column with a focusing device; and using a laser device to cut the rotating column into sliced wafers. The slicing equipment of the present invention has a simple structure, easy operation, small kerf of the column, and fast slicing speed.

公开(公告)号：US20230132534A1

公开(公告)日：2023-05-04

申请号：US17693459

申请日：2022-03-14

申请人： National Central University

发明人： Jeng-Rong Ho ,  Chih-Kuang Lin ,  Pi-Cheng Tung

IPC分类号： H01L41/332 ,  H03B5/32 ,  H01L41/187 ,  H01L41/338

摘要： An oscillator frequency modulation method includes: providing a piezoelectric material having a surface and an interior; and performing a pattern process on the piezoelectric material by a laser. A patterned processing zone is formed on the surface and/or in the interior of the piezoelectric material. The pattern process may be a material removal and/or a material modification. Therefore, without changing the appearance of the piezoelectric material, the pattern process on the piezoelectric material through the laser can accurately adjust the frequency of the oscillator and block unnecessary mode at the same time. An oscillator piezoelectric structure with frequency modulation is also provided.