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公开(公告)号：US20090095634A1
公开(公告)日：2009-04-16
申请号：US11907589
申请日：2007-10-15
申请人： Natsuki Makino , Keisuke Namiki , Kunihito Ide , Junji Kunisawa , Katsuyuki Musaka , Philippe Vereecken , Brett C. Baker-O'Neal , Hariklia Deligianni , Keith Kwietniak
发明人： Natsuki Makino , Keisuke Namiki , Kunihito Ide , Junji Kunisawa , Katsuyuki Musaka , Philippe Vereecken , Brett C. Baker-O'Neal , Hariklia Deligianni , Keith Kwietniak
CPC分类号： C25D17/00 , C25D17/008 , C25D21/12 , H01L21/2885 , H01L21/76877
摘要： A plating method can form a plated film having a uniform thickness over the entire surface, including the peripheral surface, of a substrate. The plating method includes: disposing an anode so as to face a conductive film, formed on a substrate, which serves as a cathode, and disposing an auxiliary cathode on an ring-shaped seal member for sealing a peripheral portion of the substrate; bringing the conductive film, the anode and the auxiliary cathode into contact with a plating solution; and supplying electric currents between the anode and the conductive film, and between the anode and the auxiliary cathode to carry out plating.
摘要翻译： 电镀方法可以在基板的整个表面（包括外周表面）上形成均匀厚度的镀膜。 电镀方法包括：将阳极设置成面对形成在用作阴极的基板上的导电膜，并将辅助阴极设置在用于密封基板的周边部分的环形密封构件上; 使导电膜，阳极和辅助阴极与电镀液接触; 并且在阳极和导电膜之间以及阳极和辅助阴极之间提供电流以进行电镀。
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公开(公告)号：US20070034526A1
公开(公告)日：2007-02-15
申请号：US11202684
申请日：2005-08-12
申请人： Natsuki Makino , Junji Kunisawa , Keisuke Namiki , Yukio Fukunaga , Katsuyuki Musaka , Ray Fang , Emanuel Cooper , John Cotte , Hariklia Deligianni , Keith Kwietniak , Brett Baker-O'Neal , Matteo Flotta , Philippe Vereecken
发明人： Natsuki Makino , Junji Kunisawa , Keisuke Namiki , Yukio Fukunaga , Katsuyuki Musaka , Ray Fang , Emanuel Cooper , John Cotte , Hariklia Deligianni , Keith Kwietniak , Brett Baker-O'Neal , Matteo Flotta , Philippe Vereecken
IPC分类号： B23H3/00
摘要： An electrolytic processing apparatus can planarize uniformly over an entire surface of a substrate under a low pressure without any damages to the substrate. The electrolytic processing apparatus has a substrate holder configured to hold and rotate a substrate having a metal film formed on a surface of the substrate and an electrolytic processing unit configured to perform an electrolytic process on the substrate held by the substrate holder. The electrolytic processing unit has a rotatable processing electrode, a polishing pad attached to the rotatable processing electrode, and a pressing mechanism configured to press the polishing pad against the substrate. The electrolytic processing unit also has a liquid supply mechanism configured to supply an electrolytic processing liquid between the substrate and the rotatable processing electrode, a relative movement mechanism operable to move the substrate and the rotatable processing electrode relative to each other, and a power supply configured to applying a voltage between the rotatable processing electrode and the metal film of the substrate so that the rotatable processing electrode serves as a cathode and the metal film of the substrate serves as an anode.
摘要翻译： 电解处理装置可以在低压下在基板的整个表面上均匀地平坦化，而不会对基板造成任何损坏。 所述电解处理装置具有基板保持件，所述基板保持器被构造成保持和旋转形成在所述基板的表面上的金属膜的基板和被配置为在由所述基板保持器保持的所述基板上进行电解处理的电解处理单元。 电解处理单元具有可旋转的处理电极，附接到可旋转处理电极的抛光垫，以及被配置为将抛光垫压靠在基板上的按压机构。 电解处理单元还具有：液体供给机构，被构造成在基板和可旋转处理电极之间提供电解处理液体;相对移动机构，其可操作以相对于彼此移动基板和可旋转处理电极;电源配置 在可旋转处理电极和基板的金属膜之间施加电压，使得可旋转处理电极用作阴极，并且基板的金属膜用作阳极。
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公开(公告)号：US07901550B2
公开(公告)日：2011-03-08
申请号：US11907591
申请日：2007-10-15
IPC分类号： C25D17/06
CPC分类号： C25D17/00 , C25D5/52 , C25D17/004 , C25D17/007 , C25D21/12 , H01L21/2885 , H01L21/76877
摘要： A plating apparatus can form a plated film having a uniform thickness over the entire surface of a substrate without a change of members. The plating apparatus includes a substrate holder, a cathode contact for contacting a conductive film formed on the substrate so that the conductive film serves as a cathode, a ring-shaped seal member for covering the cathode contact and bringing its inner circumferential portion into contact with the peripheral portion of the substrate to seal the peripheral portion of the substrate, an anode disposed so as to face the conductive film formed on the substrate, and an auxiliary cathode disposed with respect to the seal member such that at least part of the auxiliary cathode is exposed on a surface of the seal member. Plating is carried out by bringing the conductive film, the anode and the auxiliary cathode into contact with a plating solution.
摘要翻译： 电镀装置可以在基板的整个表面上形成均匀厚度的镀膜，而不会改变构件。 镀覆装置包括：基板保持件，用于使形成在基板上的导电膜接触以使导电膜用作阴极的阴极接触件，用于覆盖阴极接触并使其内周部分与其接触的环形密封构件 所述基板的周边部分密封所述基板的周边部分，设置成面对形成在所述基板上的导电膜的阳极和相对于所述密封部件设置的辅助阴极，使得所述辅助阴极的至少一部分 暴露在密封构件的表面上。 通过使导电膜，阳极和辅助阴极与电镀液接触来进行电镀。
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公开(公告)号：US20090095618A1
公开(公告)日：2009-04-16
申请号：US11907591
申请日：2007-10-15
IPC分类号： C25D17/00
CPC分类号： C25D17/00 , C25D5/52 , C25D17/004 , C25D17/007 , C25D21/12 , H01L21/2885 , H01L21/76877
摘要： A plating apparatus can form a plated film having a uniform thickness over the entire surface of a substrate without a change of members. The plating apparatus included a substrate holder, a cathode contact for contacting a conductive film formed on the substrate so that the conductive film serves as a cathode, a ring-shaped seal member for covering the cathode contact and bringing its inner circumferential portion into contact with the peripheral portion of the substrate to seal the peripheral portion of the substrate, an anode disposed so as to face the conductive film formed on the substrate, and an auxiliary cathode disposed to the seal member such that at least part of the auxiliary cathode expose on a surface of the seal member. Plating is carried out by bringing the conductive film, the anode and the auxiliary cathode into contact with a plating solution.
摘要翻译： 电镀装置可以在基板的整个表面上形成均匀厚度的镀膜，而不会改变构件。 电镀装置包括：衬底保持器，用于接触形成在衬底上的导电膜的阴极接触件，使得导电膜用作阴极;环形密封构件，用于覆盖阴极接触并使其内周部分与 基板的周边部分，以密封基板的周边部分，设置成面对形成在基板上的导电膜的阳极和设置在密封部件上的辅助阴极，使得辅助阴极的至少一部分暴露于 密封件的表面。 通过使导电膜，阳极和辅助阴极与电镀液接触来进行电镀。
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公开(公告)号：US20050155865A1
公开(公告)日：2005-07-21
申请号：US10845429
申请日：2004-05-14
申请人： Koji Mishima , Keisuke Namiki , Masao Hodai , Junji Kunisawa , Natsuki Makino , Yukio Fukunaga
发明人： Koji Mishima , Keisuke Namiki , Masao Hodai , Junji Kunisawa , Natsuki Makino , Yukio Fukunaga
摘要： There is provided an electrolytic processing apparatus and method which can produce products having various specifications with enhanced productivity, thus reducing the production cost, and which can respond flexibly to the movement toward finer interconnects in semiconductor devices. An electrolytic processing apparatus according to the present invention includes: an electrolytic processing unit including a substrate holder for holding a substrate, and a counter electrode plate disposed opposite the substrate held by the substrate holder, said electrolytic processing unit carrying out electrolytic processing by filling the space between the substrate held by the substrate holder and the counter electrode plate with an electrolysis solution while feeding electricity; and a plurality of electrolysis solution supply facilities for supplying different types of electrolysis solutions; wherein the electrolytic processing unit is selectively connectable to one of the plurality of electrolysis solution supply facilities.
摘要翻译： 提供一种电解处理装置和方法，其能够生产具有提高的生产率的各种规格的产品，从而降低生产成本，并且可以灵活地响应于朝向半导体器件中更精细的互连的移动。 根据本发明的电解处理装置包括：电解处理单元，包括用于保持基板的基板保持器和与由基板保持器保持的基板相对设置的对置电极板，所述电解处理单元通过填充电解处理单元进行电解处理 在供电的同时由衬底保持器保持的衬底与电极板之间的电解槽的间隔; 以及用于供给不同种类的电解液的多个电解液供给装置; 其中所述电解处理单元可选择性地连接到所述多个电解溶液供应设备中的一个。
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公开(公告)号：USD633452S1
公开(公告)日：2011-03-01
申请号：US29356456
申请日：2010-02-25
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公开(公告)号：US07156725B2
公开(公告)日：2007-01-02
申请号：US10481591
申请日：2002-07-10
申请人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
发明人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
摘要： There is provided a substrate polishing machine which comprises a polishing surface and a substrate carrier for holding a substrate and bringing it into contact with the polishing surface. The substrate carrier comprises a carrier body, a substrate holding member for holding a substrate with a surface of the substrate to be polished being directed towards the polishing surface. The substrate holding member is mounted on the carrier body in such a manner that the substrate holding member is movable both towards and away from the polishing surface. The substrate polishing machine further comprises a substrate holding member positioning device provided on a side of the substrate holding member opposite to that used for holding the substrate. The substrate holding member positioning device has a flexible member which defines a chamber, and which, upon introduction of a non-compressible fluid, is expanded in a direction towards the polishing surface.
摘要翻译： 提供了一种衬底抛光机，其包括抛光表面和用于保持衬底并使其与抛光表面接触的衬底载体。 基板载体包括载体主体，用于保持待抛光基板的表面朝向抛光表面的基板的基板保持构件。 衬底保持构件以使得衬底保持构件能够朝向和远离抛光表面移动的方式安装在载体主体上。 基板研磨机还包括基板保持部件定位装置，该基板保持部件定位装置设置在基板保持部件的与保持基板相同的一侧。 衬底保持构件定位装置具有限定腔室的柔性构件，并且在引入不可压缩流体时沿朝向抛光表面的方向膨胀。
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公开(公告)号：US07083507B2
公开(公告)日：2006-08-01
申请号：US11028629
申请日：2005-01-05
申请人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
发明人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
IPC分类号： B24B7/22
CPC分类号： B24B37/30 , B24B41/061
摘要： The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for being brought into contact with the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.
摘要翻译： 本发明涉及一种用于保持待抛光的基板并将基板压靠在抛光表面上的基板保持装置。 基板保持装置包括用于保持基板的顶环体，用于与基板接触的弹性垫，以及用于支撑弹性垫的支撑构件。 基板保持装置还包括安装在支撑构件的下表面上并设置在由弹性垫和支撑构件形成的空间中的接触构件。 接触构件具有用于与弹性垫接触的弹性膜。 第一压力室限定在接触构件中，并且第二压力室限定在接触构件的外部。 基板保持装置还包括用于独立地向第一压力室和第二压力室供应流体或产生真空的流体源。
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公开(公告)号：US20060113192A1
公开(公告)日：2006-06-01
申请号：US10543097
申请日：2004-01-22
CPC分类号： C25D5/06 , C25D7/123 , C25D17/001 , C25D17/14 , H01L21/2885
摘要： According to the present invention, there is provided a plating apparatus which can deposit a metal plated film such as a copper layer selectively in fine recesses for interconnects, such as trenches or via holes in a circuit form. The plating apparatus of the present invention includes an electrode head (701) having an anode (704), a plating solution impregnated material (703) for holding a plating solution, and a porous contact member (702) which is brought into contact with a surface of a substrate; a cathode electrode (712) which is brought into contact with the substrate to supply current to the substrate; a pressing mechanism (709) for pressing the porous contact member of the electrode head against the surface of the substrate under a desired pressure; a power source (723) for applying plating voltage between the anode and the cathode electrode; and a control unit (721) for correlating and controlling the state for pressing the porous contact member of the electrode head against the surface of the substrate, and the state of plating voltage applied between the anode and the cathode electrode.
摘要翻译： 根据本发明，提供了一种电镀装置，其可以选择性地在诸如沟槽或电路形式的通孔之间的互连的细小凹槽中沉积诸如铜层的金属电镀膜。 本发明的电镀装置包括具有阳极（704）的电极头（701），用于保持电镀液的电镀液浸渍材料（703）以及与电镀液接触的多孔接触部件（702） 基材表面; 与基板接触以向基板提供电流的阴极电极（712）; 用于在所需压力下将电极头的多孔接触构件压靠在衬底的表面上的按压机构（709） 用于在阳极和阴极之间施加电镀电压的电源（723）; 以及控制单元（721），用于将电极头的多孔接触构件相对于基板的表面按压和控制的状态以及施加在阳极和阴极之间的电镀电压的状态。
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公开(公告)号：US20050072527A1
公开(公告)日：2005-04-07
申请号：US10972579
申请日：2004-10-26
IPC分类号： H01L21/304 , B24B37/30 , B24B37/32 , C23F1/00
摘要： A substrate holding apparatus comprises a substrate holder body having a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of the substrate held by the substrate holder body so that the retainer ring engages with the polishing surface radially outside the substrate as the polishing of the substrate is effected. The substrate holder body is provided with a membrane having inside and outside surfaces. The inside surface cooperates with a surface of the substrate holder body to define a fluid pressure chamber to which a fluid pressure is applied. The outer surface engages with the substrate held by the substrate holder body.
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