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    Plating apparatus
    2.
    发明申请
    Plating apparatus 有权
    电镀装置

    公开(公告)号：US20090095618A1

    公开(公告)日：2009-04-16

    申请号：US11907591

    申请日：2007-10-15

    申请人： Natsuki Makino ,  Keisuke Namiki ,  Kunihito Ide ,  Junji Kunisawa ,  Katsuyuki Musaka

    发明人： Natsuki Makino ,  Keisuke Namiki ,  Kunihito Ide ,  Junji Kunisawa ,  Katsuyuki Musaka

    IPC分类号： C25D17/00

    CPC分类号： C25D17/00 ,  C25D5/52 ,  C25D17/004 ,  C25D17/007 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76877

    摘要： A plating apparatus can form a plated film having a uniform thickness over the entire surface of a substrate without a change of members. The plating apparatus included a substrate holder, a cathode contact for contacting a conductive film formed on the substrate so that the conductive film serves as a cathode, a ring-shaped seal member for covering the cathode contact and bringing its inner circumferential portion into contact with the peripheral portion of the substrate to seal the peripheral portion of the substrate, an anode disposed so as to face the conductive film formed on the substrate, and an auxiliary cathode disposed to the seal member such that at least part of the auxiliary cathode expose on a surface of the seal member. Plating is carried out by bringing the conductive film, the anode and the auxiliary cathode into contact with a plating solution.

    摘要翻译： 电镀装置可以在基板的整个表面上形成均匀厚度的镀膜，而不会改变构件。 电镀装置包括：衬底保持器，用于接触形成在衬底上的导电膜的阴极接触件，使得导电膜用作阴极;环形密封构件，用于覆盖阴极接触并使其内周部分与 基板的周边部分，以密封基板的周边部分，设置成面对形成在基板上的导电膜的阳极和设置在密封部件上的辅助阴极，使得辅助阴极的至少一部分暴露于 密封件的表面。 通过使导电膜，阳极和辅助阴极与电镀液接触来进行电镀。

    Plating apparatus
    3.
    发明授权
    Plating apparatus 有权
    电镀装置

    公开(公告)号：US07901550B2

    公开(公告)日：2011-03-08

    申请号：US11907591

    申请日：2007-10-15

    申请人： Natsuki Makino ,  Keisuke Namiki ,  Kunihito Ide ,  Junji Kunisawa ,  Katsuyuki Musaka

    发明人： Natsuki Makino ,  Keisuke Namiki ,  Kunihito Ide ,  Junji Kunisawa ,  Katsuyuki Musaka

    IPC分类号： C25D17/06

    CPC分类号： C25D17/00 ,  C25D5/52 ,  C25D17/004 ,  C25D17/007 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76877

    摘要： A plating apparatus can form a plated film having a uniform thickness over the entire surface of a substrate without a change of members. The plating apparatus includes a substrate holder, a cathode contact for contacting a conductive film formed on the substrate so that the conductive film serves as a cathode, a ring-shaped seal member for covering the cathode contact and bringing its inner circumferential portion into contact with the peripheral portion of the substrate to seal the peripheral portion of the substrate, an anode disposed so as to face the conductive film formed on the substrate, and an auxiliary cathode disposed with respect to the seal member such that at least part of the auxiliary cathode is exposed on a surface of the seal member. Plating is carried out by bringing the conductive film, the anode and the auxiliary cathode into contact with a plating solution.

    摘要翻译： 电镀装置可以在基板的整个表面上形成均匀厚度的镀膜，而不会改变构件。 镀覆装置包括：基板保持件，用于使形成在基板上的导电膜接触以使导电膜用作阴极的阴极接触件，用于覆盖阴极接触并使其内周部分与其接触的环形密封构件 所述基板的周边部分密封所述基板的周边部分，设置成面对形成在所述基板上的导电膜的阳极和相对于所述密封部件设置的辅助阴极，使得所述辅助阴极的至少一部分 暴露在密封构件的表面上。 通过使导电膜，阳极和辅助阴极与电镀液接触来进行电镀。

    Electroplating apparatus and electroplating method
    7.
    发明申请
    Electroplating apparatus and electroplating method 有权
    电镀设备和电镀方法

    公开(公告)号：US20080029398A1

    公开(公告)日：2008-02-07

    申请号：US11708548

    申请日：2007-02-21

    申请人： Satoru Yamamoto ,  Keiichi Kurashina ,  Takashi Kawakami ,  Tsutomu Nakada ,  Hiroyuki Kanda ,  Junji Kunisawa ,  Kunihito Ide

    发明人： Satoru Yamamoto ,  Keiichi Kurashina ,  Takashi Kawakami ,  Tsutomu Nakada ,  Hiroyuki Kanda ,  Junji Kunisawa ,  Kunihito Ide

    IPC分类号： C25D5/00 ,  C25D17/00

    CPC分类号： C25D17/001 ,  C25D5/18 ,  C25D7/123 ,  C25D17/004 ,  C25D17/008 ,  C25D17/12 ,  H01L21/6723

    摘要： An electroplating apparatus can form a plated film having a more uniform thickness and good film quality over an entire surface of a substrate having a conductive layer (seed layer) whose resistivity is equal to or higher than that of copper. The electroplating apparatus includes: a substrate holder for holding a substrate; a sealing member for contact with a peripheral portion of a surface of a substrate, held by the substrate holder, to seal the peripheral portion; a cathode contact for contact with a conductive layer formed in the surface of the substrate, held by the substrate holder, to feed electricity to the conductive layer; and a housing having therein an anode to be immersed in a plating solution, and a porous structure disposed at an open end facing the substrate held by the substrate holder, said porous structure defining a plating chamber in the housing; wherein the plating chamber is divided into rooms by a partition plate and the porous structure, and the anode is comprised of a plurality of divided anodes, each divided anode being disposed in each room of the plating chamber so that each divided anode can pass an independent plating current.

    摘要翻译： 电镀装置可以在具有等于或高于铜的导电层（种子层）的基板的整个表面上形成具有更均匀的厚度和更好的膜质量的镀膜。 电镀装置包括：用于保持基板的基板保持件; 密封构件，其与由所述基板保持件保持的基板的表面的周边部接触，以密封所述周边部; 阴极接触件，用于与由衬底保持器保持的衬底表面中形成的导电层接触，以将电力馈送到导电层; 以及壳体，其中具有要浸入电镀溶液中的阳极，以及设置在面向由所述基板保持件保持的所述基板的开口端的多孔结构，所述多孔结构在所述壳体中限定电镀室; 其特征在于，通过分隔板和多孔结构将电镀室分为室，阳极由多个分开的阳极组成，每个分隔的阳极设置在电镀室的每个房间中，使得每个分隔的阳极可以通过独立的 电镀电流。

    Electroplating apparatus and electroplating method
    8.
    发明授权
    Electroplating apparatus and electroplating method 有权
    电镀设备和电镀方法

    公开(公告)号：US08029653B2

    公开(公告)日：2011-10-04

    申请号：US11708548

    申请日：2007-02-21

    申请人： Satoru Yamamoto ,  Keiichi Kurashina ,  Takashi Kawakami ,  Tsutomu Nakada ,  Hiroyuki Kanda ,  Junji Kunisawa ,  Kunihito Ide

    发明人： Satoru Yamamoto ,  Keiichi Kurashina ,  Takashi Kawakami ,  Tsutomu Nakada ,  Hiroyuki Kanda ,  Junji Kunisawa ,  Kunihito Ide

    IPC分类号： C25D17/00

    CPC分类号： C25D17/001 ,  C25D5/18 ,  C25D7/123 ,  C25D17/004 ,  C25D17/008 ,  C25D17/12 ,  H01L21/6723

    摘要： An electroplating apparatus can form a plated film having a more uniform thickness and good film quality over an entire surface of a substrate having a conductive layer (seed layer) whose resistivity is equal to or higher than that of copper. The electroplating apparatus includes: a substrate holder for holding a substrate; a sealing member for contact with a peripheral portion of a surface of a substrate, held by the substrate holder, to seal the peripheral portion; a cathode contact for contact with a conductive layer formed in the surface of the substrate, held by the substrate holder, to feed electricity to the conductive layer; and a housing having therein an anode to be immersed in a plating solution, and a porous structure disposed at an open end facing the substrate held by the substrate holder, said porous structure defining a plating chamber in the housing; wherein the plating chamber is divided into rooms by a partition plate and the porous structure, and the anode is comprised of a plurality of divided anodes, each divided anode being disposed in each room of the plating chamber so that each divided anode can pass an independent plating current.

    摘要翻译： 电镀装置可以在具有等于或高于铜的导电层（种子层）的基板的整个表面上形成具有更均匀的厚度和更好的膜质量的镀膜。 电镀装置包括：用于保持基板的基板保持件; 密封构件，其与由所述基板保持件保持的基板的表面的周边部接触，以密封所述周边部; 阴极接触件，用于与由衬底保持器保持的衬底表面中形成的导电层接触，以将电力馈送到导电层; 以及壳体，其中具有要浸入电镀溶液中的阳极，以及设置在面向由所述基板保持件保持的所述基板的开口端的多孔结构，所述多孔结构在所述壳体中限定电镀室; 其特征在于，通过分隔板和多孔结构将电镀室分为室，阳极由多个分开的阳极组成，每个分隔的阳极设置在电镀室的每个房间中，使得每个分隔的阳极可以通过独立的 电镀电流。

    Electrolytic processing apparatus and substrate processing method
    9.
    发明授权
    Electrolytic processing apparatus and substrate processing method 失效
    电解处理装置及基板处理方法

    公开(公告)号：US07374646B2

    公开(公告)日：2008-05-20

    申请号：US10767253

    申请日：2004-01-30

    申请人： Hidenao Suzuki ,  Kazufumi Nomura ,  Kunihito Ide ,  Hiroyuki Kanda ,  Koji Mishima ,  Naoki Mihara ,  Natsuki Makino ,  Seiji Katsuoka

    发明人： Hidenao Suzuki ,  Kazufumi Nomura ,  Kunihito Ide ,  Hiroyuki Kanda ,  Koji Mishima ,  Naoki Mihara ,  Natsuki Makino ,  Seiji Katsuoka

    IPC分类号： C25D17/00 ,  C25D17/02 ,  C25D17/06 ,  C25D7/12

    CPC分类号： H01L21/2885 ,  C25D7/123 ,  C25D17/001 ,  H01L21/76877

    摘要： The present invention provides an electrolytic processing apparatus which is capable of increasing an in-plane uniformity of a film thickness of a plated film by making more uniform an electric field distribution over an entire surface to be processed of a substrate even if the substrate has a large area, and controlling more uniformly a speed, over the entire surface to be processed of the substrate. The electrolytic processing apparatus of this invention includes: a substrate holder for holding a substrate, a first electrode for being brought into contact with the substrate to supply current to a surface, to be processed, of the substrate; a second electrode disposed substantially parallel to the surface, to be processed, of the substrate in a position facing the surface, to be processed, of the substrate held by the substrate holder; a high resistance structure disposed between the substrate held by the substrate holder and the second electrode; an electrolytic solution introducing portion for introducing an electrolytic solution into a region across which the substrate held by the substrate holder and the high resistance structure face each other, from laterally of the high resistance structure; and a power source for applying a voltage between the first electrode and the second electrode.

    摘要翻译： 本发明提供一种电解处理装置，其能够通过使基板的整个表面上的电场分布更均匀，从而提高镀膜的膜厚的面内均匀性， 大面积，并且在基板的整个待处理表面上更均匀地控制速度。 本发明的电解处理装置包括：用于保持基板的基板保持器，用于与基板接触的第一电极，以将基板的待加工表面供给电流; 基板平行于被处理面的基板平面的第二电极，所述第一电极与所述基板保持器保持的所述基板面对所述要被处理的表面的位置; 设置在由衬底保持器保持的衬底和第二电极之间的高电阻结构; 电解液引入部分，用于将电解溶液引入到由所述衬底保持器保持的所述衬底和所述高电阻结构面对的区域中，从所述高电阻结构的侧面引出; 以及用于在第一电极和第二电极之间施加电压的电源。

    Apparatus and method for processing a substrate
    10.
    发明申请
    Apparatus and method for processing a substrate 审中-公开
    用于处理衬底的装置和方法

    公开(公告)号：US20050000820A1

    公开(公告)日：2005-01-06

    申请号：US10854252

    申请日：2004-05-27

    申请人： Koji Mishima ,  Kunihito Ide ,  Hidenao Suzuki ,  Kazufumi Nomura ,  Hiroyuki Kanda

    发明人： Koji Mishima ,  Kunihito Ide ,  Hidenao Suzuki ,  Kazufumi Nomura ,  Hiroyuki Kanda

    IPC分类号： C25D7/12 ,  C25C7/00 ,  C25D5/00 ,  C25D17/00 ,  C25D21/04 ,  C25D21/12 ,  C25D21/14 ,  H01L21/288 ,  H01L21/445

    CPC分类号： C25D17/002 ,  C25D17/001 ,  C25D21/04 ,  H01L21/2885

    摘要： A method and apparatus are set forth capable of processing a substrate with a high uniformity within the surface area even for a thin feeding layer. The method comprises arranging a counter electrode and the substrate to confront each other; providing a membrane between the counter electrode and the substrate to define a substrate side region and a counter electrode side region. The substrate side region and the counter electrode side region are capable of accommodating respective electrolytes. The substrate side region and the counter electrode side region are supplied with respective electrolytes having different specific resistances. A processing current is also supplied between the substrate and the counter electrode.

    摘要翻译： 提出了一种方法和装置，即使对于薄的进料层，也能够在表面积内处理高均匀性的基板。 该方法包括将对置电极和基板相互对置布置; 在对电极和基板之间提供膜以限定基板侧区域和对电极侧区域。 基板侧区域和对置电极侧区域能够容纳各种电解质。 向基板侧区域和对电极侧区域供给具有不同比电阻的各电解质。 在基板和对置电极之间也提供处理电流。