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    Thermal Flow Meter
    2.
    发明申请
    Thermal Flow Meter 有权
    热流量计

    公开(公告)号：US20150122012A1

    公开(公告)日：2015-05-07

    申请号：US14407730

    申请日：2012-06-15

    申请人： Noboru Tokuyasu ,  Shinobu Tashiro ,  Keiji Hanzawa ,  Takeshi Morino ,  Ryosuke Doi ,  Akira Uenodan

    发明人： Noboru Tokuyasu ,  Shinobu Tashiro ,  Keiji Hanzawa ,  Takeshi Morino ,  Ryosuke Doi ,  Akira Uenodan

    IPC分类号： G01F1/684

    CPC分类号： G01F1/684 ,  G01F1/6842 ,  G01F1/6845 ,  G01F1/6965 ,  G01F15/14

    摘要： The present invention has been made to improve measurement accuracy of a thermal flow meter. In the thermal flowmeter according to the invention, a circuit package (400) that measures a flow rate is molded in a first resin molding process. In a second resin molding process, a housing (302) having an inlet trench (351), a bypass passage trench on frontside (332), an outlet trench (353), and the like are formed through resin molding, and an outer circumferential surface of the circuit package (400) produced in the first resin molding process is enveloped by a resin in the second resin molding process to fix the circuit package (400) to the housing (302).

    摘要翻译： 本发明是为了提高热式流量计的测量精度。 在根据本发明的热流量计中，在第一树脂模塑工艺中模制测量流速的电路封装（400）。 在第二树脂模制工艺中，通过树脂模制形成具有入口沟槽（351），前侧旁路通道沟槽（332），出口沟槽（353）等的外壳（302），外周 在第二树脂成型工序中，在第一树脂成形工序中制作的电路封装（400）的表面被树脂包围，将电路封装（400）固定在壳体（302）上。

    Airflow measuring apparatus including a ventilation hole between a connector part and a circuit chamber
    3.
    发明授权
    Airflow measuring apparatus including a ventilation hole between a connector part and a circuit chamber 有权
    气流测量装置包括连接器部分和电路室之间的通气孔

    公开(公告)号：US09587970B2

    公开(公告)日：2017-03-07

    申请号：US14363235

    申请日：2011-12-07

    申请人： Takeshi Morino ,  Shinobu Tashiro ,  Noboru Tokuyasu ,  Ryosuke Doi ,  Keiji Hanzawa

    发明人： Takeshi Morino ,  Shinobu Tashiro ,  Noboru Tokuyasu ,  Ryosuke Doi ,  Keiji Hanzawa

    IPC分类号： G01F1/68 ,  G01F1/684 ,  G01F1/692 ,  G01F5/00 ,  F02D41/18 ,  H01L35/34

    CPC分类号： G01F1/6842 ,  F02D41/187 ,  G01F1/6845 ,  G01F1/692 ,  G01F5/00 ,  H01L35/34

    摘要： An airflow measuring apparatus includes a sub-passage that takes in part of flow of fluid flowing through an intake pipe, a sensor element disposed in the sub-passage to measure the flow of fluid, a circuit part converting the flow of fluid detected by the sensor element into an electric signal, a connector part connected to the circuit part to output a signal externally, and a casing supporting the sensor element and the circuit part. The sensor element is disposed in the intake pipe, and includes a cavity disposed at a semiconductor substrate and a diaphragm including a thin film part that covers the cavity. The sensor element on a lead frame has surfaces that are mold-packaged with resin so that the diaphragm and part of the lead frame are exposed. One hole is disposed at the lead frame for communication between the cavity and exterior.

    摘要翻译： 一种气流测量装置，包括：副通路，其采取流过进气管的流体的一部分流动;设置在该通路中的传感器元件，以测量流体的流动;电路部分， 传感器元件变成电信号，连接到电路部分的连接器部分，以在外部输出信号，以及支撑传感器元件和电路部分的壳体。 传感器元件设置在进气管中，并且包括设置在半导体基板处的空腔和包括覆盖空腔的薄膜部分的隔膜。 引线框架上的传感器元件具有用树脂模制包装的表面，使得隔膜和引线框架的一部分被暴露。 一个孔设置在引线框架处，用于在空腔和外部之间连通。

    AIRFLOW MEASURING APPARATUS
    4.
    发明申请
    AIRFLOW MEASURING APPARATUS 有权
    气流测量装置

    公开(公告)号：US20140352424A1

    公开(公告)日：2014-12-04

    申请号：US14363235

    申请日：2011-12-07

    申请人： Takeshi Morino ,  Shinobu Tashiro ,  Noboru Tokuyasu ,  Ryosuke Doi ,  Keiji Hanzawa

    发明人： Takeshi Morino ,  Shinobu Tashiro ,  Noboru Tokuyasu ,  Ryosuke Doi ,  Keiji Hanzawa

    IPC分类号： G01F1/684 ,  H01L35/34 ,  G01F1/692

    CPC分类号： G01F1/6842 ,  F02D41/187 ,  G01F1/6845 ,  G01F1/692 ,  G01F5/00 ,  H01L35/34

    摘要： Airflow measuring apparatus compring: sub-passage that takes in part of flow of fluid flowing through an intake pipe; sensor element that is disposed in the sub-passage to measure the flow of fluid; a circuit part that converts the flow of fluid detected by the sensor element into an electric signal; connector part connected to the circuit part to output a signal externally; and casing that supports the sensor element and the circuit part, the sensor element being disposed in the intake pipe. The sensor element includes a cavity disposed at a semiconductor substrate, a diaphragm including a thin film part that covers the cavity. The sensor element on a lead frame have surfaces that are mold-packaged with resin so that a diaphragm of the sensor element and part of the lead frame are exposed. One hole is disposed at the lead frame for communication between the cavity and exterior.

    摘要翻译： 气流测量装置包括：部分流过进气管的流体流动的副通道; 传感器元件，设置在子通道中以测量流体的流动; 电路部，其将由所述传感器元件检测出的流体流转换为电信号; 连接器部分连接到电路部分以从外部输出信号; 以及支撑传感器元件和电路部分的壳体，传感器元件设置在进气管中。 传感器元件包括设置在半导体衬底处的腔体，隔膜包括覆盖空腔的薄膜部分。 引线框架上的传感器元件具有用树脂模制包装的表面，使得传感器元件的膜片和引线框架的一部分被暴露。 一个孔设置在引线框架处，用于在空腔和外部之间连通。

    Flow sensor and manufacturing method of the same and flow sensor module and manufacturing method of the same
    5.
    发明授权
    Flow sensor and manufacturing method of the same and flow sensor module and manufacturing method of the same 有权
    流量传感器及其制造方法和流量传感器模块及其制造方法相同

    公开(公告)号：US08640538B2

    公开(公告)日：2014-02-04

    申请号：US13393155

    申请日：2011-09-13

    申请人： Tsutomu Kono ,  Keiji Hanzawa ,  Takeshi Morino ,  Yuki Okamoto ,  Noboru Tokuyasu ,  Shinobu Tashiro

    发明人： Tsutomu Kono ,  Keiji Hanzawa ,  Takeshi Morino ,  Yuki Okamoto ,  Noboru Tokuyasu ,  Shinobu Tashiro

    IPC分类号： G01F1/68

    CPC分类号： G01F1/383 ,  G01F1/34 ,  G01F1/6845 ,  G01F1/692 ,  G01F1/698 ,  G01F5/00 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/10157 ,  H01L2924/15151 ,  H01L2924/15153

    摘要： Technique of suppressing performance variations for each flow sensor is provided. In a flow sensor FS1 of the present invention, a part of a semiconductor chip CHP1 is configured to be covered with resin (MR) in a state in which a flow sensing unit (FDU) formed on a semiconductor chip CHP1 is exposed. Since an upper surface SUR(MR) of the resin (MR) is higher than an upper surface SUR(CHP) of the semiconductor chip (CHP1) by sealing the resin (MR) on a part of the upper surface SUR(CHP) of the semiconductor chip CHP1 in a direction parallel to an air flow direction, the air flow around the flow sensing unit (FDU) can be stabilized. Further, interface peeling between the semiconductor chip (CHP1) and the resin (MR) can be prevented by an increase of contact area between the semiconductor chip (CHP1) and the resin (MR).

    摘要翻译： 提供了抑制每个流量传感器的性能变化的技术。 在本发明的流量传感器FS1中，半导体芯片CHP1的一部分被配置为在形成在半导体芯片CHP1上的流量检测单元（FDU）暴露的状态下被树脂（MR）覆盖。 由于树脂（MR）的上表面SUR（MR）高于半导体芯片（CHP1）的上表面SUR（CHP），所以通过在上表面SUR（CHP）的一部分上密封树脂 半导体芯片CHP1在与空气流动方向平行的方向上，可以使流量检测单元（FDU）周围的空气流稳定。 此外，通过增加半导体芯片（CHP1）和树脂（MR）之间的接触面积，可以防止半导体芯片（CHP1）和树脂（MR）之间的界面剥离。

    Flow Sensor and Manufacturing Method of the Same and Flow Sensor Module and Manufacturing Method of the Same
    6.
    发明申请
    Flow Sensor and Manufacturing Method of the Same and Flow Sensor Module and Manufacturing Method of the Same 有权
    流量传感器及其制造方法及其流程传感器模块及其制造方法

    公开(公告)号：US20130192388A1

    公开(公告)日：2013-08-01

    申请号：US13393155

    申请日：2011-09-13

    申请人： Tsutomu Kono ,  Keiji Hanzawa ,  Takeshi Morino ,  Yuki Okamoto ,  Noboru Tokuyasu ,  Shinobu Tashiro

    发明人： Tsutomu Kono ,  Keiji Hanzawa ,  Takeshi Morino ,  Yuki Okamoto ,  Noboru Tokuyasu ,  Shinobu Tashiro

    IPC分类号： G01F1/34

    CPC分类号： G01F1/383 ,  G01F1/34 ,  G01F1/6845 ,  G01F1/692 ,  G01F1/698 ,  G01F5/00 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/10157 ,  H01L2924/15151 ,  H01L2924/15153

    摘要： Technique of suppressing performance variations for each flow sensor is provided. In a flow sensor FS1 of the present invention, a part of a semiconductor chip CHP1 is configured to be covered with resin (MR) in a state in which a flow sensing unit (FDU) formed on a semiconductor chip CHP1 is exposed. Since an upper surface SUR(MR) of the resin (MR) is higher than an upper surface SUR(CHP) of the semiconductor chip (CHP1) by sealing the resin (MR) on a part of the upper surface SUR(CHP) of the semiconductor chip CHP1 in a direction parallel to an air flow direction, the air flow around the flow sensing unit (FDU) can be stabilized. Further, interface peeling between the semiconductor chip (CHP1) and the resin (MR) can be prevented by an increase of contact area between the semiconductor chip (CHP1) and the resin (MR).

    摘要翻译： 提供了抑制每个流量传感器的性能变化的技术。 在本发明的流量传感器FS1中，半导体芯片CHP1的一部分被配置为在形成在半导体芯片CHP1上的流量检测单元（FDU）暴露的状态下被树脂（MR）覆盖。 由于树脂（MR）的上表面SUR（MR）高于半导体芯片（CHP1）的上表面SUR（CHP），所以通过在上表面SUR（CHP）的一部分上密封树脂 半导体芯片CHP1在与空气流动方向平行的方向上，可以使流量检测单元（FDU）周围的空气流稳定。 此外，通过增加半导体芯片（CHP1）和树脂（MR）之间的接触面积，可以防止半导体芯片（CHP1）和树脂（MR）之间的界面剥离。

    Heating resistor-type gas flowmeter
    7.
    发明授权
    Heating resistor-type gas flowmeter 有权
    加热电阻式气体流量计

    公开(公告)号：US07677097B2

    公开(公告)日：2010-03-16

    申请号：US12128323

    申请日：2008-05-28

    申请人： Noboru Tokuyasu ,  Hiroaki Hoshika ,  Kaori Kashio ,  Keiji Hanzawa

    发明人： Noboru Tokuyasu ,  Hiroaki Hoshika ,  Kaori Kashio ,  Keiji Hanzawa

    IPC分类号： G01F1/68

    CPC分类号： G01F1/699 ,  G01F1/688

    摘要： In a gas flowmeter in which a rod and a sensor element are formed as a single body, for preventing heat of the sensor element from flowing into a sensor probe through a substrate (rod) so as to suppress considerable power consumption, and for obtaining a necessary response speed with respect to a flow rate of gas to be measured or a change in temperature, the gas column (rod) is made of an insulating material on a center axis of the sensing probe and is formed with a conductor pattern on its surface, and the sensing probe connects the sensor element disposed in a pipe through which the gas to be measured flows and a harness terminal through the conductor on the surface of the rod, so as to measure a gas flow rate by using the sensing prove.

    摘要翻译： 在其中杆和传感器元件形成为单体的气体流量计中，为了防止传感器元件通过基板（棒）流入传感器探针中的热量，以便抑制相当大的功率消耗，并且为了获得 相对于待测气体的流量或温度变化的必要响应速度，气柱（棒）由感测探针的中心轴上的绝缘材料制成，并且在其表面上形成有导体图案 并且感测探头将设置在待测气体的管道中的传感器元件和通过杆表面上的导体的线束端子连接，以便通过使用感测证明来测量气体流量。

    Thermal Air Flow Sensor
    9.
    发明申请
    Thermal Air Flow Sensor 有权
    热空气流量传感器

    公开(公告)号：US20120055245A1

    公开(公告)日：2012-03-08

    申请号：US13209883

    申请日：2011-08-15

    申请人： Ryosuke DOI ,  Keiji Hanzawa

    发明人： Ryosuke DOI ,  Keiji Hanzawa

    IPC分类号： G01F1/68

    CPC分类号： G01F1/6845 ,  G01F1/6842 ,  G01F1/692 ,  G01F5/00 ,  G01F15/10 ,  G01F15/105

    摘要： In a thermal air flow sensor according to the invention, a hollow formed in a detecting element is communicated with a circuit chamber, in which driving circuit parts of the detecting element are mounted, or an intake duct exterior. Thereby, pressure in the hollow balances with pressure on the outside. Also, since the circuit chamber is provided to be isolated from a detection chamber, in which a detecting part of the detecting element is arranged, that is, a passage chamber, through which air being a measuring object flows, air flowing in the passage chamber can be restrained from flowing into the hollow to have an influence on flow output characteristics.

    摘要翻译： 在根据本发明的热空气流量传感器中，形成在检测元件中的中空与安装有检测元件的驱动电路部分的电路室或进气管外部连通。 因此，空心中的压力与外部的压力平衡。 此外，由于电路室被设置为与检测元件的检测部分配置的检测室隔离，即，作为测量对象的空气流过的通道室，在通道室中流动的空气 可以抑制流入中空部分以对流量输出特性产生影响。