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    Substrate polishing method and device
    1.
    发明授权
    Substrate polishing method and device 有权
    基材抛光方法及装置

    公开(公告)号：US08814635B2

    公开(公告)日：2014-08-26

    申请号：US13015016

    申请日：2011-01-27

    申请人： Nobukazu Hosokai ,  Isamu Oguro ,  Jun Watanabe ,  Tetsujiro Tada

    发明人： Nobukazu Hosokai ,  Isamu Oguro ,  Jun Watanabe ,  Tetsujiro Tada

    IPC分类号： B24B21/02

    CPC分类号： B24B9/065

    摘要： A substrate polishing method includes starting to rotate a circular substrate and polishing an inner peripheral edge surface of a center circular hole formed in the circular substrate into a chamfered or rounded surface by pressing the inner peripheral edge surface against a bypass polishing part of a polishing tape that is conveyed intermittently or continuously and by oscillating the bypass polishing part of the polishing tape about a direction perpendicular to a direction that the center circular hole penetrates through the circular substrate. The polishing tape is guided so as to have an advancing portion advancing toward the circular substrate, a returning portion returning from the circular substrate, and a turning-back portion between the advancing portion and the returning portion guided along a side bypass. The bypass polishing part of the polishing tape is the turning-back portion of the polishing tape.

    摘要翻译： 衬底抛光方法包括：开始旋转圆形衬底并将形成在圆形衬底中的中心圆形孔的内周缘表面通过将内周边表面压靠在抛光带的旁路抛光部分上来研磨成倒角或圆形表面 间歇地或连续地传送，并且通过围绕与中心圆孔穿过圆形基底的方向垂直的方向摆动抛光带的旁路抛光部分。 该抛光带被引导为具有朝向圆形基板前进的前进部分，从圆形基板返回的返回部分和沿着旁路引导引导的前进部分和返回部分之间的回转部分。 研磨带的旁路抛光部是研磨带的折回部。

    Apparatus for and method of smoothing substrate surface
    4.
    发明授权
    Apparatus for and method of smoothing substrate surface 有权
    衬底表面平滑的方法和方法

    公开(公告)号：US06908369B2

    公开(公告)日：2005-06-21

    申请号：US10616574

    申请日：2003-07-09

    申请人： Tetsujiro Tada

    发明人： Tetsujiro Tada

    IPC分类号： B24B7/17 ,  B24B21/00 ,  B24B21/04 ,  B24B7/30

    CPC分类号： B24B21/04 ,  B24B7/17 ,  B24B21/004

    摘要： An apparatus for smoothing a surface of a rotatably supported substrate includes a base plate, a block having an extending arm structure and being attached to the base plate so as to be movable along the surface of the base plate, a roller attached to a tip portion of the arm structure in a direction perpendicular to the base plate, a mobile member attached to the arm structure so as to be movable perpendicularly to the axial direction of the roller, a tape-running device attached to the base plate for feeding and taking up a polishing tape through the roller so as to advance the tape around the mobile member, and a moving device attached to the arm structure of the block for moving the mobile member.

    摘要翻译： 用于使可旋转支撑的基板的表面平滑的装置包括基板，具有延伸臂结构的块，并且被附接到基板，以便能够沿着基板的表面移动，安装到末端部分的辊 所述臂结构沿垂直于所述基板的方向移动;移动构件，其附接到所述臂结构以能够垂直于所述辊的轴向移动;带运行装置，安装在所述基板上用于进给和卷取 通过辊子的抛光带，以使胶带围绕可移动部件前进;以及移动装置，附接到块的臂结构，用于移动移动部件。