公开(公告)号：US20150092364A1

公开(公告)日：2015-04-02

申请号：US14497705

申请日：2014-09-26

Applicant: Nokia Corporation

Inventor： Romeo Dumpit ,  Rolf G. Laido ,  Mikko J. Timperi ,  Vincent Phan ,  Toni Kyroenlampi ,  Jani Haapamaki ,  Tim McGaffigan

IPC: H05K1/02 ,  H05K3/30

CPC classification number: H05K1/0215 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q1/48 ,  H05K1/0237 ,  H05K1/028 ,  H05K3/30 ,  H05K7/14 ,  H05K2201/0999 ,  H05K2201/10386 ,  Y10T29/49149 ,  Y10T29/53174

Abstract: A method comprises mounting a grounding clip to a planar flexible printed circuit transmission line; clamping the grounding clip to an inner wall of a chassis of an electronic device; and operating a laser beam to weld the grounding clip to the chassis to route the flexible printed circuit transmission line along the inner wall. Welding the grounding clip to the chassis causes the grounding clip to remain in contact with the planar flexible printed circuit transmission line to ground the planar flexible printed circuit transmission line to the chassis.

Abstract translation: 一种方法包括将接地夹安装到平面柔性印刷电路传输线上; 将接地夹夹持到电子设备的机壳的内壁; 并且操作激光束以将接地夹焊接到机架以使柔性印刷电路传输线沿着内壁布线。 将接地夹焊接到机箱会导致接地夹与平面柔性印刷电路传输线保持接触，以将平面柔性印刷电路传输线接地到机箱。

公开(公告)号：US09730312B2

公开(公告)日：2017-08-08

申请号：US14497705

申请日：2014-09-26

Applicant: Nokia Corporation

Inventor： Romeo Dumpit ,  Rolf G. Laido ,  Mikko J. Timperi ,  Vincent Phan ,  Toni Kyroenlampi ,  Jani Haapamaki ,  Tim McGaffigan

IPC: H05K1/00 ,  H05K1/02 ,  H05K3/30 ,  H05K7/14

CPC classification number: H05K1/0215 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q1/48 ,  H05K1/0237 ,  H05K1/028 ,  H05K3/30 ,  H05K7/14 ,  H05K2201/0999 ,  H05K2201/10386 ,  Y10T29/49149 ,  Y10T29/53174

Abstract: A method comprises mounting a grounding clip to a planar flexible printed circuit transmission line; clamping the grounding clip to an inner wall of a chassis of an electronic device; and operating a laser beam to weld the grounding clip to the chassis to route the flexible printed circuit transmission line along the inner wall. Welding the grounding clip to the chassis causes the grounding clip to remain in contact with the planar flexible printed circuit transmission line to ground the planar flexible printed circuit transmission line to the chassis.