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公开(公告)号：US07547577B2
公开(公告)日：2009-06-16
申请号：US11598647
申请日：2006-11-14
IPC分类号： H01L21/44
CPC分类号： H05K3/4614 , H01L2224/05001 , H01L2224/05023 , H01L2224/0508 , H01L2224/05147 , H01L2224/05155 , H01L2224/05568 , H01L2224/05644 , H01L2224/16225 , H05K3/3484 , H05K2203/061 , H05K2203/063 , H05K2203/1572 , Y10T29/49126 , Y10T29/49147 , Y10T29/49158 , H01L2924/00014 , H01L2924/013
摘要： A method of making a circuitized substrate assembly in which two or more subassemblies are aligned and bonded together. The bonding, preferably using lamination, results in effective electrical connections being formed between respective pairs of conductors of the subassemblies in such a manner that the metallurgies of the conductors, and those of an interim metallic solder paste, are effectively mixed and the flowable interim dielectric used between the mating subassemblies is forced to flow to engage and surround the conductor coupling, without adversely affecting the electrical connection formed.
摘要翻译： 一种制造电路化基板组件的方法，其中两个或更多个子组件对准并结合在一起。 优选使用层压的结合导致在子组件的各对导体之间形成有效的电连接，使得导体和中间金属焊膏的导体的冶金被有效地混合，并且可流动的中间电介质 在配合子组件之间使用的流体被迫流动以接合和围绕导体耦合，而不会不利地影响形成的电连接。
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公开(公告)号：US20080110016A1
公开(公告)日：2008-05-15
申请号：US11598647
申请日：2006-11-14
CPC分类号： H05K3/4614 , H01L2224/05001 , H01L2224/05023 , H01L2224/0508 , H01L2224/05147 , H01L2224/05155 , H01L2224/05568 , H01L2224/05644 , H01L2224/16225 , H05K3/3484 , H05K2203/061 , H05K2203/063 , H05K2203/1572 , Y10T29/49126 , Y10T29/49147 , Y10T29/49158 , H01L2924/00014 , H01L2924/013
摘要： A method of making a circuitized substrate assembly in which two or more subassemblies are aligned and bonded together. The bonding, preferably using lamination, results in effective electrical connections being formed between respective pairs of conductors of the subassemblies in such a manner that the metallurgies of the conductors, and those of an interim metallic solder paste, are effectively mixed and the flowable interim dielectric used between the mating subassemblies is forced to flow to engage and surround the conductor coupling, without adversely affecting the electrical connection formed.
摘要翻译： 一种制造电路化基板组件的方法，其中两个或更多个子组件对准并结合在一起。 优选使用层压的结合导致在子组件的各对导体之间形成有效的电连接，使得导体和中间金属焊膏的导体的冶金被有效地混合，并且可流动的中间电介质 在配合子组件之间使用的流体被迫流动以接合和围绕导体耦合，而不会不利地影响形成的电连接。
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3.发明授权公开(公告)号：US06845557B2
公开(公告)日：2005-01-25
申请号：US10225862
申请日：2002-08-22
CPC分类号： H05K3/4623 , H01L23/49822 , H01L23/66 , H01L2924/0002 , H01L2924/3011 , H05K1/0237 , H05K3/246 , H05K3/4069 , H05K3/4652 , H05K2201/0347 , H05K2201/0352 , H05K2201/0355 , H05K2203/0554 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要： A method for creating an impedance controlled printing wiring board, particularly the formation of a structure for high speed printed wiring boards incorporating multiple differential impedance controlled layers. Furthermore, disclosed is the provision of a method for producing an impedance controlled printed circuit wiring board. Also, there is the provision of a method for producing high speed printed wiring boards with multiple differential impedance controlled layers.
摘要翻译： 一种用于产生阻抗控制印刷线路板的方法，特别是形成包含多个差分阻抗控制层的高速印刷线路板的结构。 此外，公开了提供一种制造阻抗控制印刷电路布线板的方法。 此外，提供了一种用于生产具有多个差分阻抗控制层的高速印刷线路板的方法。
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公开(公告)号：US07615477B2
公开(公告)日：2009-11-10
申请号：US11566956
申请日：2006-12-05
IPC分类号： H01L31/058 , H01L23/495 , H01L23/48 , H01L21/44
CPC分类号： H05K1/0271 , H01L23/49866 , H01L2924/0002 , H05K1/111 , H05K3/384 , H05K3/4092 , H05K2201/0133 , H05K2201/0355 , H05K2203/0307 , H05K2203/1152 , H01L2924/00
摘要： Ball Grid Array packages having decreased adhesion of the BGA pad to the laminate surface and methods for producing same are provided.
摘要翻译： 提供了具有降低的BGA焊盘与层压体表面的粘附性的球栅阵列封装及其制造方法。
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公开(公告)号：US07148566B2
公开(公告)日：2006-12-12
申请号：US09817843
申请日：2001-03-26
IPC分类号： H01L21/44
CPC分类号： H05K1/0271 , H01L23/49866 , H01L2924/0002 , H05K1/111 , H05K3/384 , H05K3/4092 , H05K2201/0133 , H05K2201/0355 , H05K2203/0307 , H05K2203/1152 , H01L2924/00
摘要： Ball Grid Array packages having decreased adhesion of the BGA pad to the laminate surface and methods for producing same are provided.
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6.发明授权Structure for high speed printed wiring boards with multiple differential impedance-controlled layers 失效具有多个差分阻抗控制层的高速印刷线路板的结构公开(公告)号：US06469256B1
公开(公告)日：2002-10-22
申请号：US09495628
申请日：2000-02-01
IPC分类号： H05K103
CPC分类号： H05K3/4623 , H01L23/49822 , H01L23/66 , H01L2924/0002 , H01L2924/3011 , H05K1/0237 , H05K3/246 , H05K3/4069 , H05K3/4652 , H05K2201/0347 , H05K2201/0352 , H05K2201/0355 , H05K2203/0554 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要： A method for creating an impedance controlled printing wiring board, particularly the formation of a structure for high speed printed wiring boards incorporating multiple differential impedance controlled layers. Furthermore, disclosed is the provision of a method for producing an impedance controlled printed circuit wiring board. Also, there is the provision of a method for producing high speed printed wiring boards with multiple differential impedance controlled layers.
摘要翻译： 一种用于产生阻抗控制印刷线路板的方法，特别是形成包含多个差分阻抗控制层的高速印刷线路板的结构。 此外，公开了提供一种制造阻抗控制印刷电路布线板的方法。 此外，提供了一种用于生产具有多个差分阻抗控制层的高速印刷线路板的方法。
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7.发明申请METHOD AND SYSTEM FOR WIRELESS USB TRANSFER OF ISOCHRONOUS DATA USING BULK DATA TRANSFER TYPE 审中-公开使用大容量数据传输类型进行无缝数据传输的方法和系统公开(公告)号：US20100198999A1
公开(公告)日：2010-08-05
申请号：US12366591
申请日：2009-02-05
申请人： Anoop Nair , Criag Smith , Greg Christison , Thomas R. Miller
发明人： Anoop Nair , Criag Smith , Greg Christison , Thomas R. Miller
IPC分类号： G06F13/14
CPC分类号： G06F13/387 , G06F13/4282 , G06F2213/3814
摘要： A method and system for transferring data in a wireless USB system having a first USB enabled device and a second USB enabled device are provided. The method includes providing a first data having a first data transfer type, converting the first data to a second data having a second data transfer type, wirelessly transferring the second data from the first USB enabled device to the second USB enabled device using the second data transfer type, and converting the wirelessly transferred second data to a third data having the first data transfer type.
摘要翻译： 提供了一种用于在具有第一USB启用设备和第二USB启用设备的无线USB系统中传送数据的方法和系统。 该方法包括提供具有第一数据传输类型的第一数据，将第一数据转换为具有第二数据传输类型的第二数据，使用第二数据将第二数据从第一USB启用设备无线地传送到第二USB使能设备 传输类型，并将无线传送的第二数据转换为具有第一数据传输类型的第三数据。
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8.发明申请公开(公告)号：US20080301933A1
公开(公告)日：2008-12-11
申请号：US11808140
申请日：2007-06-07
CPC分类号： H05K1/117 , H05K3/4611 , H05K2201/09127 , H05K2201/09845 , H05K2203/061 , H05K2203/1147 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49133 , Y10T29/49155 , Y10T29/49156 , Y10T29/49163 , Y10T29/49165
摘要： A method of making a printed circuit board in which at least two circuitized substrates are aligned and bonded together (e.g., using lamination). A gasket is provided on one of these and a facing circuitized portion on the other. The gasket forms an effective seal about the circuitized portion to prevent heated dielectric material from contacting the circuitry. After bonding, parts of the bonded structure, including the gasket, are removed to leave a projecting edge portion having circuitry thereon. This edge portion is then adapted for being positioned within an edge connector.
摘要翻译： 制造印刷电路板的方法，其中至少两个电路化基板对准并结合在一起（例如，使用层压）。 在其中一个和另一个面上的电路部分上设有垫片。 垫圈围绕电路部分形成有效的密封，以防止加热的电介质材料接触电路。 在粘合之后，去除包括垫圈的粘合结构的部分，以留下其上具有电路的突出边缘部分。 然后该边缘部分适于定位在边缘连接器内。
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公开(公告)号：US06840391B2
公开(公告)日：2005-01-11
申请号：US10291918
申请日：2002-11-11
申请人： Thomas R. Miller , William J. Hale
发明人： Thomas R. Miller , William J. Hale
CPC分类号： B65D73/0028 , A47F2005/0012
摘要： A display strip for packages includes an elongated backing member and transverse adhesive strips that extend completely across the backing member for adheringly holding individual packages. A plurality of the display strips are adhered transversely to a roll of release paper in a side-by-side arrangement. This allows the adhesive strips to form a substantially continuous strip of adhesive running parallel the length of the roll, and also allows the display strips to be presented one by one as the roll is unwound a short distance equal to a width of the display strips. Due to the short distance of the roll as it is unwound, the display strips are easily removed one at a time off an end of the roll.
摘要翻译： 用于包装的显示条包括细长背衬构件和横向粘合剂条，其完全延伸穿过背衬构件，以便于保持单独的包装。 多个显示条以并排布置横向粘附到一卷脱模纸上。 这允许粘合剂条形成平行于辊的长度的基本上连续的粘合带，并且还允许显示条一个接一个地放置，因为卷展开等于显示条的宽度的短距离。 由于卷筒退绕的距离很短，所以显示条可以容易地从辊的端部一次移除。
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公开(公告)号：US06613162B1
公开(公告)日：2003-09-02
申请号：US09696626
申请日：2000-10-25
申请人： Partha S. Dutta , Thomas R. Miller
发明人： Partha S. Dutta , Thomas R. Miller
IPC分类号： C30B2940
CPC分类号： C30B11/002 , C30B29/40
摘要： The present application discloses a method for preparing a homogeneous ternary or quaternary alloy from a quaternary melt. The method includes providing a family of phase diagrams for the quaternary melt which shows (i) composition/temperature data, (ii) tie lines connecting equilibrium liquid and solid compositions, and (iii) isotherms representing boundaries of a miscibility gap. Based on the family of phase diagrams, a quaternary melt composition and an alloy growth temperature is selected. A quaternary melt having the selected quaternary melt composition is provided and a ternary or quaternary alloy is grown from the quaternary melt at the selected alloy growth temperature. A method for making homogeneous ternary or quaternary alloy from a ternary or quaternary melt is also disclosed, as are homogeneous quaternary single-crystal alloys which are substantially free from crystal defects and which have the formula AxB1−xCyD1−y, x and y being the same or different and in the range of 0.001 to 0.999.
摘要翻译： 本申请公开了一种从四次熔体制备均匀的三元或四元合金的方法。 该方法包括为四元熔体提供一系列相图，其显示（i）组成/温度数据，（ii）连接平衡液体和固体组合物的连接线，以及（iii）表示混合间隙的边界的等温线。 基于相图系列，选择四次熔体组成和合金生长温度。 提供具有所选择的四级熔融组合物的四级熔体，并且在所选择的合金生长温度下从季熔体生长三元或四元合金。 还公开了从三元或四元熔体制备均匀的三元或四元合金的方法，以及基本上没有晶体缺陷并且具有式AxB1-xCyD1-y的均匀的四元单晶合金，x和y是 相同或不同，在0.001至0.999的范围内。
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