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公开(公告)号：US11229090B2
公开(公告)日：2022-01-18
申请号：US16409107
申请日：2019-05-10
Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION
Inventor： Michael T. Barako , Jesse B. Tice , Max H. Kuciej
IPC: B23K20/02 , H05B3/34 , B32B5/02 , B32B5/12 , B32B5/26 , C25D5/34 , H01L23/373 , H05B3/00 , H05K7/20
Abstract: A method for fabricating a multilayered metal nanowire array including providing a metal seed layer, stacking a plurality of porous templates on the seed layer so that a gap forms between each adjacent pair of templates, depositing by electroplating a metal in the pores so that the metal produces nanowires in the templates and lateral interposers in the gaps between the templates, and dissolving the templates so as to produce the multilayered nanowire array including the lateral interposers. The layers between the interposers can have the same or different thicknesses, the diameter and density of the pores in each layer can be the same or different and the metal deposited in the pores of the layers can be the same or different.
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公开(公告)号：US10211497B1
公开(公告)日：2019-02-19
申请号：US15601327
申请日：2017-05-22
Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION
Inventor： Jimmy G. Hester , Evan P. Nguyen , Vesna Radisic , Jesse B. Tice , Andrew D. Smith
Abstract: A microstrip transmission line comprising a dielectric substrate including a series of periodic sinusoidal undulation portions defining spaced apart peaks and troughs, where a distance between the peaks and troughs defines a period of the microstrip line, and where each peak defines a maximum height of the substrate and each trough defines a minimum height of the substrate. The transmission line further includes a conductive strip formed to a surface of the substrate so that the conductive strip follows the undulation portions. The conductive strip includes a modulation portion in a width direction of the conductive strip perpendicular to a signal propagation direction along the strip, where the modulation portion includes a minimum width portion provided at each peak and a maximum width portion provided at each trough so that a variation of a ratio between the width of the conductive strip and the height of the substrate is maximized.
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公开(公告)号：US09482477B2
公开(公告)日：2016-11-01
申请号：US14444095
申请日：2014-07-28
Applicant: Northrop Grumman Systems Corporation
Inventor： John A. Starkovich , Jesse B. Tice , Edward M. Silverman , Hsiao H. Peng
IPC: H01L23/42 , F28F21/08 , C09K5/14 , H01L23/373 , F28F13/00
CPC classification number: F28F21/085 , C09K5/14 , F28F2013/006 , F28F2255/20 , H01L23/373 , H01L23/3737 , H01L23/42 , H01L2924/00 , H01L2924/0002
Abstract: A thermal interface material (TIM) using high thermal conductivity nano-particles, particularly ones with large aspect ratios, for enhancing thermal transport across boundary or interfacial layers that exist at bulk material interfaces is disclosed. The nanoparticles do not need to be used in a fluid carrier or as filler material within a bonding adhesive to enhance thermal transport, but simply in a dry solid state. The nanoparticles may be equiaxed or acicular in shape with large aspect ratios like nanorods and nanowires.
Abstract translation: 公开了一种使用高导热性纳米颗粒（特别是具有大纵横比的纳米颗粒）的热界面材料（TIM），用于增强在散装材料界面上存在的边界或界面层的热传递。 纳米颗粒不需要用于流体载体或作为粘合粘合剂中的填料材料以增强热传递，而是简单地在干燥的固体状态。 纳米颗粒可以是等轴或针状的具有大的纵横比的纳米棒和纳米线。
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公开(公告)号：US20160250710A1
公开(公告)日：2016-09-01
申请号：US15006658
申请日：2016-01-26
Applicant: Northrop Grumman Systems Corporation , The Board of Trustees of the Leland Stanford Junior University
Inventor： John A. Starkovich , Edward M. Silverman , Jesse B. Tice , Hsiao-Hu Peng , Michael T. Barako , Kenneth E. Goodson
CPC classification number: F28F3/022 , B23K1/0012 , B23K20/023 , B23K2101/14 , B23P15/26 , B82Y30/00 , C25D3/30 , C25D3/48 , C25D5/02 , C25D5/48 , C25D7/0607 , C25D9/02 , F28F2255/20 , H01L23/373 , H01L23/3736 , H01L23/3737 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/27462 , H01L2224/27466 , H01L2224/29078 , H01L2224/29211 , H01L2224/29244 , H01L2224/83203 , H01L2224/83232 , H01L2224/83238
Abstract: A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.
Abstract translation: 用于将金属纳米线（MNW）阵列附着到相邻表面的导热和机械坚固的接合方法包括以下步骤：从MNW去除模板膜; 用粘接材料渗透MNW; 将接合材料放置在相邻表面上; 使相邻表面与MNW的顶表面接触，同时粘合材料是可结合的; 并且允许接合材料冷却并在MNW和相邻表面之间形成固体结合。 用于将金属纳米线（MNW）阵列附着到相邻表面的导热和机械稳定的接合方法包括以下步骤：基于期望的接合工艺选择接合材料; 并且不从填充MNW的间隙体积的模板膜移除MNW，将粘合材料沉积到MNW的尖端上。
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公开(公告)号：US10091888B2
公开(公告)日：2018-10-02
申请号：US15013093
申请日：2016-02-02
Applicant: Northrop Grumman Systems Corporation
Inventor： Xing Lan , Daniel R. Scherrer , Jesse B. Tice , Patrick J. Case , Xianglin Zeng
Abstract: A method of manufacturing electronics using a nanoparticle ink printing method includes: synthesizing a phase change material (PCM) ink composition using hot injection to develop nanoparticles of the PCM; suspending the nanoparticles with a solvent; and printing a reconfigurable component using the PCM ink composition in additive manufacturing. Electronics includes: a substrate layer; an insulator layer printed on top of the substrate layer; a heater layer printed on top of the insulator layer; a barrier layer printed on top of one or more of the insulator layer and the heater layer; a phase change material (PCM) printed on top of the barrier layer; a connectivity layer printed on top of the PCM; and a passivation layer printed on top of one or more of the PCM and the connectivity layer.
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公开(公告)号：US09920178B2
公开(公告)日：2018-03-20
申请号：US14966746
申请日：2015-12-11
Applicant: Northrop Grumman Systems Corporation
Inventor： John A. Starkovich , Jesse B. Tice , Edward M. Silverman , Hsiao-Hu Peng
CPC classification number: C08J9/35 , C08J9/008 , C08J9/0085 , C08J2205/06 , C08J2375/04 , C08J2383/04 , C09K5/14 , Y10T428/30
Abstract: A compressible, thermally-conductive, removable nanocomposite gasket includes: a nanocomposite foam; and a nanoparticle filler, wherein the nanocomposite foam has a filler loading of less than approximately 20%. A compressible, thermally-conductive, removable nanocomposite gasket includes: a nanocomposite foam; a nanoparticle filler; and a metallic mesh embedded in the foam wherein the nanocomposite foam has a filler loading of less than approximately 20%.
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公开(公告)号：US09601452B2
公开(公告)日：2017-03-21
申请号：US15249535
申请日：2016-08-29
Applicant: Northrop Grumman Systems Corporation , The Board of Trustees of the Leland Stanford Junior University
Inventor： John A. Starkovich , Edward M. Silverman , Jesse B. Tice , Hsiao-Hu Peng , Michael T. Barako , Kenneth E. Goodson
IPC: H01L23/00 , B23K1/00 , B23K20/02 , C25D3/30 , C25D3/48 , C25D5/02 , C25D5/48 , C25D7/06 , C25D9/02 , B82Y30/00 , H01L23/373
CPC classification number: F28F3/022 , B23K1/0012 , B23K20/023 , B23K2101/14 , B23P15/26 , B82Y30/00 , C25D3/30 , C25D3/48 , C25D5/02 , C25D5/48 , C25D7/0607 , C25D9/02 , F28F2255/20 , H01L23/373 , H01L23/3736 , H01L23/3737 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/27462 , H01L2224/27466 , H01L2224/29078 , H01L2224/29211 , H01L2224/29244 , H01L2224/83203 , H01L2224/83232 , H01L2224/83238
Abstract: A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.
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公开(公告)号：US09468989B2
公开(公告)日：2016-10-18
申请号：US15006658
申请日：2016-01-26
Applicant: Northrop Grumman Systems Corporation , The Board of Trustees of the Leland Stanford Junior University
Inventor： John A. Starkovich , Edward M. Silverman , Jesse B. Tice , Hsiao-Hu Peng , Michael T. Barako , Kenneth E. Goodson
IPC: B23K31/02 , B23K20/02 , C25D9/02 , C25D7/06 , C25D3/30 , C25D3/48 , C25D5/48 , C25D5/02 , B23K1/00
CPC classification number: F28F3/022 , B23K1/0012 , B23K20/023 , B23K2101/14 , B23P15/26 , B82Y30/00 , C25D3/30 , C25D3/48 , C25D5/02 , C25D5/48 , C25D7/0607 , C25D9/02 , F28F2255/20 , H01L23/373 , H01L23/3736 , H01L23/3737 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/27462 , H01L2224/27466 , H01L2224/29078 , H01L2224/29211 , H01L2224/29244 , H01L2224/83203 , H01L2224/83232 , H01L2224/83238
Abstract: A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.
Abstract translation: 用于将金属纳米线（MNW）阵列附着到相邻表面的导热和机械坚固的接合方法包括以下步骤：从MNW去除模板膜; 用粘接材料渗透MNW; 将接合材料放置在相邻表面上; 使相邻表面与MNW的顶表面接触，同时粘合材料是可结合的; 并且允许接合材料冷却并在MNW和相邻表面之间形成固体结合。 用于将金属纳米线（MNW）阵列附着到相邻表面的导热和机械稳定的接合方法包括以下步骤：基于期望的接合工艺选择接合材料; 并且不从填充MNW的间隙体积的模板膜移除MNW，将粘合材料沉积到MNW的尖端上。
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9.发明申请THERMAL INTERFACE MATERIALS USING METAL NANOWIRE ARRAYS AND SACRIFICIAL TEMPLATES 审中-公开使用金属纳米阵列和非常模板的热界面材料
公开(公告)号：US20160251769A1
公开(公告)日：2016-09-01
申请号：US15006597
申请日：2016-01-26
Applicant: Northrop Grumman Systems Corporation , The Board of Trustees of the Leland Stanford Junior University
Inventor： Edward M. Silverman , John A. Starkovich , Hsiao-Hu Peng , Jesse B. Tice , Michael T. Barako , Conor E. Coyan , Kenneth E. Goodson
Abstract: A method for making a thermal interface material (TIM) comprises the steps of: depositing a seed layer onto a substrate; attaching a template membrane to the substrate; depositing metal into one or more of the pores of the template membrane, substantially filling the template membrane to create a vertically-aligned metal nanowire (MNW) array comprising a plurality of nanowires that grow upward from the seed layer; and after the template membrane is substantially filled with the deposited metal, removing the template membrane, leaving the plurality of nanowires attached to the seed layer. A TIM comprises: a vertically-aligned MNW array comprising a plurality of nanowires that grow upward from a seed layer deposited on the surface of a template membrane, and the template membrane being removed after MNW growth.
Abstract translation: 制备热界面材料（TIM）的方法包括以下步骤：将种子层沉积到基底上; 将模板膜附着到基底上; 将金属沉积到模板膜的一个或多个孔中，基本上填充模板膜以产生垂直排列的金属纳米线（MNW）阵列，其包括从种子层向上生长的多个纳米线; 并且在模板膜基本上被沉积的金属填充之后，去除模板膜，留下多个纳米线附着到晶种层上。 TIM包括：垂直对齐的MNW阵列，其包括从沉积在模板膜的表面上的种子层向上生长的多个纳米线，并且在MNW生长之后去除模板膜。
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公开(公告)号：US11800602B1
公开(公告)日：2023-10-24
申请号：US17456965
申请日：2021-11-30
Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION
Inventor： Michael T. Barako , Jesse B. Tice , Max H. Kuciej
IPC: B23K20/02 , H05B3/34 , B32B5/02 , B32B5/12 , B32B5/26 , C25D5/34 , H01L23/373 , H05B3/00 , H05K7/20
CPC classification number: H05B3/34 , B32B5/028 , B32B5/12 , B32B5/26 , C25D5/34 , H01L23/3735 , H05B3/0004 , H05K7/2039 , B32B2262/103 , H05B2203/007 , H05B2203/014 , H05B2203/017 , H05B2214/04
Abstract: A multilayered metal nanowire array including a plurality of stacked and separated nanowire array layers each including a plurality of vertically aligned metal nanowires, and a lateral interposer positioned in a gap between each pair of adjacent nanowire array layers and being thermally coupled to the nanowires in the adjacent layers so that the lateral interposers provide thermal conduction between the nanowire array layers and laterally across each nanowire array layer. The nanowire array layers between the interposers can have the same or different thicknesses, the diameter and density of the nanowires can be the same or different, and the nanowire metal can be the same or different.
