DUAL-ENERGY DETECTION APPARATUS AND METHOD THEREOF

    公开(公告)号:US20190302281A1

    公开(公告)日:2019-10-03

    申请号:US16365910

    申请日:2019-03-27

    Abstract: The present disclosure provides a dual-energy detection apparatus and method. The dual-energy detection apparatus includes an X-ray source configured to send a first X-ray beam to an object to be measured; a scintillation detector configured to work in an integration mode, and receive a second X-ray beam penetrating through the object to be measured to generate a first electrical signal; a Cherenkov detector configured to be located behind the scintillation detector, work in a counting mode, and receive a third X-ray beam penetrating through the scintillation detector to generate a second electrical signal; and a processor configured to output image, thickness and material information of the object to be measured according to the first electrical signal and the second electrical signal. The dual-energy detection method provided by the present disclosure may acquire an image of the object to be measured that is clearer and contains more information.

    RADIATION DETECTOR ASSEMBLY AND METHOD OF MAKING THE SAME

    公开(公告)号:US20180188388A1

    公开(公告)日:2018-07-05

    申请号:US15856303

    申请日:2017-12-28

    Abstract: A radiation detector assembly and a method of manufacturing the same are provided. The radiation detector assembly includes a base and an outer encapsulation layer. The base includes a scintillator having a light-entering surface and a light-exiting surface on both ends thereof, respectively; a reflection layer provided on the light-entering surface and an outer peripheral surface of the scintillator; a photosensor comprising a photosensitive surface and an encapsulation housing, the photosensitive surface is coupled to the light-exiting surface via an optical adhesive; and an inner encapsulation layer adhered to an outer surface of the reflection layer and hermetically encapsulates a coupling portion where the scintillator and the photosensor connected with each other. the outer encapsulation layer is provided on the outer surface of the base.

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