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公开(公告)号：US20180358509A1
公开(公告)日：2018-12-13
申请号：US15779251
申请日：2016-11-30
发明人： Sophia Huppmann , Simeon Katz , Marcus Zenger , Dominik Scholz
CPC分类号： H01L33/0079 , H01L33/22 , H01L33/382 , H01L33/62 , H01L2933/0033
摘要： A method for producing a plurality of components and a component are disclosed. In an embodiment the method includes providing a carrier composite comprising a base body and a planar connecting surface, providing a wafer composite comprising a semiconductor body composite and a planar contact surface, connecting the wafer composite to the carrier composite thereby forming a joint composite so that the planar contact surface and the planar connecting surface are joined forming a joint boundary surface. The method further includes reducing inner mechanical stress in the joint composite so that a material of the carrier composite is removed in places, wherein the joint composite is thermally treated in order to form a permanent mechanically-stable connection between the wafer composite and the carrier composite, and wherein reducing inner stress is effected prior to the thermal treatment.
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公开(公告)号：US20160365699A1
公开(公告)日：2016-12-15
申请号：US15118041
申请日：2015-02-16
发明人： Alfred Lell , Sebastian Taeger , Sophia Huppmann
CPC分类号： H01S5/0282 , H01S5/02469 , H01S5/028
摘要： A laser diode chip has a laser facet, which includes a coating. The coating includes an inorganic layer and an organic layer. In one example, the coating has a number of inorganic layers, including a heat-conductive layer. For example, the inorganic layers may form a reflection-increasing or reflection-decreasing layer sequence.
摘要翻译： 激光二极管芯片具有激光刻面，其包括涂层。 涂层包括无机层和有机层。 在一个实例中，涂层具有许多无机层，包括导热层。 例如，无机层可以形成反射增加或反射减少层序列。
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公开(公告)号：US20220376133A1
公开(公告)日：2022-11-24
申请号：US17773331
申请日：2020-10-26
IPC分类号： H01L33/00 , H01L21/673 , H01L33/50 , H01L33/62 , H01L31/18 , H01L31/0232
摘要： In an embodiment a method includes arranging a plurality of semiconductor chips on a carrier, arranging an auxiliary carrier on sides of the semiconductor chips facing away from the carrier, removing the carrier, separating the auxiliary carrier between the semiconductor chips to form auxiliary carrier-chip units, each of the auxiliary carrier-chip units has at least one semiconductor chip and an auxiliary carrier part adjoining the semiconductor chip, arranging each of the auxiliary carrier-chip units on a connecting carrier and removing the auxiliary carrier parts from each auxiliary carrier-chip unit.
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公开(公告)号：US10475955B2
公开(公告)日：2019-11-12
申请号：US15779251
申请日：2016-11-30
发明人： Sophia Huppmann , Simeon Katz , Marcus Zenger , Dominik Scholz
摘要： A method for producing a plurality of components and a component are disclosed. In an embodiment the method includes providing a carrier composite comprising a base body and a planar connecting surface, providing a wafer composite comprising a semiconductor body composite and a planar contact surface, connecting the wafer composite to the carrier composite thereby forming a joint composite so that the planar contact surface and the planar connecting surface are joined forming a joint boundary surface. The method further includes reducing inner mechanical stress in the joint composite so that a material of the carrier composite is removed in places, wherein the joint composite is thermally treated in order to form a permanent mechanically-stable connection between the wafer composite and the carrier composite, and wherein reducing inner stress is effected prior to the thermal treatment.
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公开(公告)号：US20190245323A1
公开(公告)日：2019-08-08
申请号：US16386879
申请日：2019-04-17
发明人： Alfred Lell , Sebastian Taeger , Sophia Huppmann
CPC分类号： H01S5/0282 , H01S5/02469 , H01S5/028
摘要： A laser diode chip has a laser facet, which includes a coating. The coating includes an inorganic layer and an organic layer. In one example, the coating has a number of inorganic layers, including a heat-conductive layer. For example, the inorganic layers may form a reflection-increasing or reflection-decreasing layer sequence.
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公开(公告)号：US11694977B2
公开(公告)日：2023-07-04
申请号：US17046209
申请日：2019-05-08
发明人： Simeon Katz , Sophia Huppmann , Michael Hoenle , Thorsten Wagner , Kurt Hingerl
CPC分类号： H01L24/05 , H01L24/03 , H01L24/80 , H01L2224/05025 , H01L2224/05551 , H01L2224/80896 , H01L2224/80904
摘要： In an embodiment a method includes providing the first component part with a partially exposed first insulating layer, a plurality of first through-vias and an exposed first contact layer structured in places and planarized in places, wherein the first through-vias are each laterally enclosed by the first insulating layer, and wherein the first contact layer partially covers the first insulating layer and completely covers the first through-vias; providing the second component part with a partially exposed second insulating layer, a plurality of second through-vias and an exposed second contact layer structured in places and planarized in places, wherein the second through-vias are each laterally enclosed by the second insulating layer, and wherein the second contact layer partially covers the second insulating layer and completely covers the second through-vias and joining the component parts such that the contact layers overlap each other thereby mechanically and electrically connecting the component parts to each other by a direct bonding process at the contact layers.
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公开(公告)号：US20210035934A1
公开(公告)日：2021-02-04
申请号：US17046209
申请日：2019-05-08
发明人： Simeon Katz , Sophia Huppmann , Michael Hoenle , Thorsten Wagner , Kurt Hingerl
IPC分类号： H01L23/00
摘要： In an embodiment a method includes providing the first component part with a partially exposed first insulating layer, a plurality of first through-vias and an exposed first contact layer structured in places and planarized in places, wherein the first through-vias are each laterally enclosed by the first insulating layer, and wherein the first contact layer partially covers the first insulating layer and completely covers the first through-vias; providing the second component part with a partially exposed second insulating layer, a plurality of second through-vias and an exposed second contact layer structured in places and planarized in places, wherein the second through-vias are each laterally enclosed by the second insulating layer, and wherein the second contact layer partially covers the second insulating layer and completely covers the second through-vias and joining the component parts such that the contact layers overlap each other thereby mechanically and electrically connecting the component parts to each other by a direct bonding process at the contact layers.
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公开(公告)号：US11695251B2
公开(公告)日：2023-07-04
申请号：US16386879
申请日：2019-04-17
发明人： Alfred Lell , Sebastian Taeger , Sophia Huppmann
CPC分类号： H01S5/0283 , H01S5/028 , H01S5/0281 , H01S5/0282 , H01S5/0287 , H01S5/02469
摘要： A laser diode chip has a laser facet, which includes a coating. The coating includes an inorganic layer and an organic layer. In one example, the coating has a number of inorganic layers, including a heat-conductive layer. For example, the inorganic layers may form a reflection-increasing or reflection-decreasing layer sequence.
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公开(公告)号：US20190229240A1
公开(公告)日：2019-07-25
申请号：US16256897
申请日：2019-01-24
摘要： An optoelectronic device and a method are disclosed. In an embodiment an optoelectronic device includes a semiconductor body having a layer sequence with an active region configured to generate radiation, a first dielectric layer arranged on the layer sequence having a plurality of first areas and a second area, a first contact via in each area of the plurality of first areas for contacting a first side of the active region, a second contact via in the second area for contacting a second side of the active region and a conductive layer comprising a plurality of first regions and a second region surrounding the plurality of first regions and electrically isolated from the plurality of first regions, the conductive layer having a substantially planar surface and being arranged planar onto the plurality of first areas and the second area such that each of the plurality of first regions of the conductive layer is in contact with the first contact via in the respective area of the plurality of first areas and the second region of the conductive layer is in contact with the second contact via of the first dielectric layer.
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