Composition For Production Flame Retardant Insulating Material of Halogen Free Type Using Nano-Technology
    1.
    发明申请
    Composition For Production Flame Retardant Insulating Material of Halogen Free Type Using Nano-Technology 审中-公开
    使用纳米技术生产无卤型阻燃绝缘材料

    公开(公告)号:US20080161466A1

    公开(公告)日:2008-07-03

    申请号:US11814888

    申请日:2005-05-27

    IPC分类号: C08K3/38 C08K3/22

    CPC分类号: C08K3/346 C08K9/02

    摘要: Disclosed is a composition for producing a halogen-free flame-retardant insulating material using nano-technology. The present invention provides a composition for producing a halogen-free flame-retardant insulating material using nano-technology, including metal hydroxide treated with nanoboric acid; nano clay which is a compatibility enhancer of a base resin; a metal compound which is a flame-retardant formulation; and an antioxidant, based on the total weight of the polyolefin resin. The composition of the present invention has advantages that, if it is used for the flame-retardant insulating material, especially the insulating coating layer for wire, it maintains the equivalent physical properties such as the tensile strength or the elongation against the mechanical strength in comparison to the conventional products, and also is more environment-friendly than the conventional halogen-containing products, and also ensures the flame retardancy suitable for the standard of the grade VW-I of High Flame Retardance.

    摘要翻译: 公开了一种使用纳米技术制造无卤阻燃绝缘材料的组合物。 本发明提供一种使用纳米技术制造无卤阻燃绝缘材料的组合物,其包括用纳米硼酸处理的金属氢氧化物; 纳米粘土,其为基础树脂的相容性增强剂; 作为阻燃剂的金属化合物; 和基于聚烯烃树脂的总重量的抗氧化剂。 本发明的组合物具有以下优点:如果用于阻燃绝缘材料,特别是用于电线的绝缘涂层,则其相对于相对于机械强度的抗拉强度或拉伸强度等抗拉强度或伸长率保持等效的物理性能 对常规产品,并且比常规含卤素产品更环保,并且还确保适合于高阻燃等级VW-I的标准的阻燃性。

    SEMICONDUCTIVE PEELABLE CROSSLINKED RESIN COMPOSITION AND INSULATING CABLE MANUFACTURED USING THE SAME
    2.
    发明申请
    SEMICONDUCTIVE PEELABLE CROSSLINKED RESIN COMPOSITION AND INSULATING CABLE MANUFACTURED USING THE SAME 审中-公开
    半导体交联树脂组合物和使用其制造的绝缘电缆

    公开(公告)号:US20100307788A1

    公开(公告)日:2010-12-09

    申请号:US12867074

    申请日:2008-06-26

    IPC分类号: H01B9/02 H01B1/24

    CPC分类号: C08K5/20 C08K3/04 C08K5/54

    摘要: The present invention relates to a peelable and water-crosslinked semiconductive resin composition. The peelable and water-crosslinked semiconductive resin composition includes 100 parts by weight of a basic resin; 20 to 80 parts by weight of carbon black based on weight of the basic resin; and 0.05 to 5.0 parts by weight of an amide-based lubricant based on weight of the basic resin, wherein the basic resin is a mixed resin including 60 to 80 weight % of an ethylene-based copolymer resin that is bonded with an unsaturated organic silane and has a melting point of 80° C. or above; 5 to 20 weight % of an ethylene-acrylic acid copolymer or its alkali metal salt; and 5 to 40 parts by weight of an ethylene propylene copolymer containing 5 to 20 weight % of ethylene, or a propylene rein.

    摘要翻译: 本发明涉及一种可剥离和水交联的半导体树脂组合物。 可剥离和水交联的半导体树脂组合物包括100重量份的碱性树脂; 20〜80重量份基于树脂重量的炭黑; 和0.05-5.0重量份基于碱性树脂重量的酰胺类润滑剂,其中所述碱性树脂是包含60-80重量%的与不饱和有机硅烷键合的乙烯类共聚物树脂的混合树脂 并具有80℃以上的熔点; 5〜20重量%的乙烯 - 丙烯酸共聚物或其碱金属盐; 和5至40重量份的含有5至20重量%乙烯或丙烯的乙烯丙烯共聚物。