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    Solder bonding method and solder bonding device
    1.
    发明授权
    Solder bonding method and solder bonding device 有权
    焊接方法和焊接接合装置

    公开(公告)号：US07276673B2

    公开(公告)日：2007-10-02

    申请号：US10947294

    申请日：2004-09-23

    申请人： Osamu Shindo ,  Toru Mizuno ,  Satoshi Yamaguchi

    发明人： Osamu Shindo ,  Toru Mizuno ,  Satoshi Yamaguchi

    IPC分类号： B23K26/00

    CPC分类号： H05K3/3494 ,  B23K1/0056 ,  H01L2224/11003 ,  H01L2224/742 ,  H05K3/3442 ,  H05K2203/041 ,  H05K2203/107

    摘要： A solder bonding method and a solder bonding device are provided, in which solder is melted, and heating of electrode portions is performed by irradiating laser light to an inner side of a region where electrodes portions are provided, making the temperature difference between the electrode portions and the melted solder smaller to improve the wettability of the solder and increase bonding reliability. The solder bonding method and the solder bonding device perform bonding of the electrode portions that are formed on an object to be bonded by melting the solder. After supplying the solder onto the electrode portions before melting, a laser is irradiated to the solder and to the electrode portions in the periphery of the solder. The solder melts, and the electrode portions are heated. The wettability of the solder with respect to the electrode portions thus improves, and the reliability of an electrical connection between the electrode portions can be increased.

    摘要翻译： 提供焊料接合方法和焊接接合装置，其中焊料熔化，并且通过向设置有电极部分的区域的内侧照射激光来进行电极部分的加热，使得电极部分之间的温度差 并且熔化的焊料更小以改善焊料的润湿性并增加焊接可靠性。 焊接接合方法和焊接接合装置通过熔化焊料进行形成在待接合物体上的电极部分的接合。 在熔融之前将焊料供应到电极部分之后，激光照射到焊料和焊料周围的电极部分。 焊料熔化，电极部分被加热。 因此焊料相对于电极部的润湿性提高，可以提高电极部之间的电连接的可靠性。

    Solder ball bonding method and bonding device
    2.
    发明授权
    Solder ball bonding method and bonding device 有权
    焊球接合方法和接合装置

    公开(公告)号：US07164097B2

    公开(公告)日：2007-01-16

    申请号：US10936747

    申请日：2004-09-09

    申请人： Osamu Shindo ,  Toru Mizuno ,  Youichi Andoh ,  Satoshi Yamaguchi

    发明人： Osamu Shindo ,  Toru Mizuno ,  Youichi Andoh ,  Satoshi Yamaguchi

    IPC分类号： B23K1/005

    CPC分类号： B23K1/0056 ,  B23K1/0016 ,  B23K3/0623 ,  B23K2101/36 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/742 ,  H05K3/3442 ,  H05K3/3478 ,  H05K3/3494 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/082 ,  H05K2203/107

    摘要： Provided are a solder ball bonding method and a solder ball bonding device for performing bonding of a plurality of electrode portions formed on objects to be bonded by melting solder balls. The solder balls are suctioned by using a plurality of suction nozzles that follow the electrode portions of the objects to be bonded, and conveyed onto the electrode portions. A laser irradiation portion that is positioned above the suction nozzles is then moved in a direction along which the suction nozzles are arranged, while the solder balls are irradiated with laser light passing through suction openings of the suction nozzles by using the laser irradiation portion. Accordingly, it is possible to melt the plurality of solder balls on the electrode portions by using only a single laser irradiation portion.

    摘要翻译： 提供了一种焊球接合方法和焊球接合装置，用于通过熔化焊球进行形成在待接合物体上的多个电极部分的接合。 通过使用跟随待接合物体的电极部分的多个吸嘴来吸引焊球，并将其输送到电极部分上。 然后，在吸引喷嘴上方的激光照射部分沿吸引喷嘴排列的方向移动，同时通过使用激光照射部分通过吸嘴的吸入口的激光照射焊球。 因此，可以仅使用单个激光照射部来熔化电极部上的多个焊球。

    Solder ball supplying method and supplying device
    3.
    发明授权
    Solder ball supplying method and supplying device 有权
    焊球供料方式及供料装置

    公开(公告)号：US07357295B2

    公开(公告)日：2008-04-15

    申请号：US10933389

    申请日：2004-09-03

    申请人： Osamu Shindo ,  Toru Mizuno ,  Youichi Andoh ,  Satoshi Yamaguchi

    发明人： Osamu Shindo ,  Toru Mizuno ,  Youichi Andoh ,  Satoshi Yamaguchi

    IPC分类号： B23K31/02 ,  B23K37/00

    CPC分类号： B23K3/0623 ,  H05K3/3478

    摘要： After introducing a solder ball from a hopper into a receiving hole of a ball separator, the ball separator is slid between blocks, and the solder ball is sent out to a portion outside of the blocks. By suctioning the solder ball from within a projected region on a lower block which is situated inside of the receiving hole at a time when the solder ball is taken into the receiving hole and surrounds a rolling trajectory of the solder ball that has been taken into the receiving hole, the solder ball is forcibly introduced into the receiving hole.

    摘要翻译： 在将料斗中的焊球引入球分离器的接收孔中之后，球分离器在块之间滑动，并将焊球送出到块外部的部分。 通过在焊球被放入接收孔中并且包围已经被引入到接收孔中的焊球的滚动轨迹时，从位于接收孔内部的下部块上的投影区域内吸入焊球 接收孔，焊球被强制引入接收孔。

    Solder ball supplying method and supplying device
    5.
    发明申请
    Solder ball supplying method and supplying device 有权
    焊球供料方式及供料装置

    公开(公告)号：US20050045701A1

    公开(公告)日：2005-03-03

    申请号：US10933389

    申请日：2004-09-03

    申请人： Osamu Shindo ,  Toru Mizuno ,  Youichi Andoh ,  Satoshi Yamaguchi

    发明人： Osamu Shindo ,  Toru Mizuno ,  Youichi Andoh ,  Satoshi Yamaguchi

    IPC分类号： H05K3/34 ,  B23K3/06 ,  B23K35/12

    CPC分类号： B23K3/0623 ,  H05K3/3478

    摘要： After introducing a solder ball from a hopper into a receiving hole of a ball separator, the ball separator is slid between blocks, and the solder ball is sent out to a portion outside of the blocks. By suctioning the solder ball from within a projected region on a lower block which is situated inside of the receiving hole at a time when the solder ball is taken into the receiving hole and surrounds a rolling trajectory of the solder ball that has been taken into the receiving hole, the solder ball is forcibly introduced into the receiving hole.

    摘要翻译： 在将料斗中的焊球引入球分离器的接收孔中之后，球分离器在块之间滑动，并将焊球送出到块外部的部分。 通过在焊球被放入接收孔中并且包围已经被引入到接收孔中的焊球的滚动轨迹时，从位于接收孔内部的下部块上的投影区域内吸入焊球 接收孔，焊球被强制引入接收孔。

    Conductive ball bonding method and conductive ball bonding apparatus
    6.
    发明授权
    Conductive ball bonding method and conductive ball bonding apparatus 有权
    导电球接合法和导电球接合装置

    公开(公告)号：US07649152B2

    公开(公告)日：2010-01-19

    申请号：US11233090

    申请日：2005-09-23

    申请人： Osamu Shindo ,  Toru Mizuno ,  Satoshi Yamaguchi

    发明人： Osamu Shindo ,  Toru Mizuno ,  Satoshi Yamaguchi

    IPC分类号： B23K26/00 ,  B23K3/00

    CPC分类号： B23K3/0623 ,  B23K1/0056 ,  H01L2224/742 ,  H05K3/3442 ,  H05K3/3478 ,  H05K3/3494 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/082 ,  H05K2203/107

    摘要： The present invention provides a solder ball bonding method and a solder ball bonding apparatus, which can enhance efficiency of bonding processing and in which plural electrodes formed on objects to be bonded are bonded to each other by melting a solder ball. In the present invention, the solder balls are picked up by a pick-up nozzle having a plurality of pick-up openings corresponding to electrode areas on the objects to be bonded and the solder balls are conveyed on the electrode areas. A laser radiating unit disposed independently above the pick-up nozzle is shifted along an arrangement direction of the pick-up openings and a laser beam from the laser radiating unit is irradiated onto the solder ball through a transparent member of the pick-up nozzle and through the pick-up opening of the pick-up nozzle, thereby melting the solder ball on the electrode area.

    摘要翻译： 本发明提供一种焊球接合方法和焊球接合装置，其可以提高接合处理的效率，并且通过熔化焊球将形成在待接合物体上的多个电极彼此接合。 在本发明中，焊球由具有对应于待接合物体上的电极区域的多个拾取开口的拾取喷嘴拾取，并且焊球在电极区域上传送。 独立于拾取喷嘴上方设置的激光辐射单元沿着拾取开口的排列方向移动，并且来自激光辐射单元的激光束通过拾取喷嘴的透明构件照射到焊球上， 通过拾取喷嘴的拾取开口，从而熔化电极区域上的焊球。

    Conductive ball bonding method and conductive ball bonding apparatus
    7.
    发明申请
    Conductive ball bonding method and conductive ball bonding apparatus 有权
    导电球接合法和导电球接合装置

    公开(公告)号：US20060065641A1

    公开(公告)日：2006-03-30

    申请号：US11233090

    申请日：2005-09-23

    申请人： Osamu Shindo ,  Toru Mizuno ,  Satoshi Yamaguchi

    发明人： Osamu Shindo ,  Toru Mizuno ,  Satoshi Yamaguchi

    IPC分类号： B23K26/20

    CPC分类号： B23K3/0623 ,  B23K1/0056 ,  H01L2224/742 ,  H05K3/3442 ,  H05K3/3478 ,  H05K3/3494 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/082 ,  H05K2203/107

    摘要： The present invention provides a solder ball bonding method and a solder ball bonding apparatus, which can enhance efficiency of bonding processing and in which plural electrodes formed on objects to be bonded are bonded to each other by melting a solder ball. In the present invention, the solder balls are picked up by a pick-up nozzle having a plurality of pick-up openings corresponding to electrode areas on the objects to be bonded and the solder balls are conveyed on the electrode areas. A laser radiating unit disposed independently above the pick-up nozzle is shifted along an arrangement direction of the pick-up openings and a laser beam from the laser radiating unit is irradiated onto the solder ball through a transparent member of the pick-up nozzle and through the pick-up opening of the pick-up nozzle, thereby melting the solder ball on the electrode area.

    摘要翻译： 本发明提供一种焊球接合方法和焊球接合装置，其可以提高接合处理的效率，并且通过熔化焊球将形成在待接合物体上的多个电极彼此接合。 在本发明中，焊球由具有对应于待接合物体上的电极区域的多个拾取开口的拾取喷嘴拾取，并且焊球在电极区域上传送。 独立于拾取喷嘴上方设置的激光辐射单元沿着拾取开口的排列方向移动，并且来自激光辐射单元的激光束通过拾取喷嘴的透明构件照射到焊球上， 通过拾取喷嘴的拾取开口，从而熔化电极区域上的焊球。

    Solder bonding method and solder bonding device
    8.
    发明申请
    Solder bonding method and solder bonding device 有权
    焊接方法和焊接接合装置

    公开(公告)号：US20050067395A1

    公开(公告)日：2005-03-31

    申请号：US10947294

    申请日：2004-09-23

    申请人： Osamu Shindo ,  Toru Mizuno ,  Satoshi Yamaguchi

    发明人： Osamu Shindo ,  Toru Mizuno ,  Satoshi Yamaguchi

    IPC分类号： B23K1/005 ,  H05K3/34

    CPC分类号： H05K3/3494 ,  B23K1/0056 ,  H01L2224/11003 ,  H01L2224/742 ,  H05K3/3442 ,  H05K2203/041 ,  H05K2203/107

    摘要： A solder bonding method and a solder bonding device are provided, in which solder is melted, and heating of electrode portions is performed by irradiating laser light to an inner side of a region where electrodes portions are provided, making the temperature difference between the electrode portions and the melted solder smaller to improve the wettability of the solder and increase bonding reliability. The solder bonding method and the solder bonding device perform bonding of the electrode portions that are formed on an object to be bonded by melting the solder. After supplying the solder onto the electrode portions before melting, a laser is irradiated to the solder and to the electrode portions in the periphery of the solder. The solder melts, and the electrode portions are heated. The wettability of the solder with respect to the electrode portions thus improves, and the reliability of an electrical connection between the electrode portions can be increased.

    摘要翻译： 提供焊料接合方法和焊接接合装置，其中焊料熔化，并且通过向设置有电极部分的区域的内侧照射激光来进行电极部分的加热，使得电极部分之间的温度差 并且熔化的焊料更小以改善焊料的润湿性并增加焊接可靠性。 焊接接合方法和焊接接合装置通过熔化焊料进行形成在待接合物体上的电极部分的接合。 在熔融之前将焊料供应到电极部分之后，激光照射到焊料和焊料周围的电极部分。 焊料熔化，电极部分被加热。 因此焊料相对于电极部的润湿性提高，可以提高电极部之间的电连接的可靠性。

    SOLDER DISPENSER
    9.
    发明申请
    SOLDER DISPENSER 有权
    焊接分配器

    公开(公告)号：US20060237514A1

    公开(公告)日：2006-10-26

    申请号：US11279693

    申请日：2006-04-13

    申请人： Tatsuya WAGOU ,  Toru Mizuno ,  Osamu Shindo

    发明人： Tatsuya WAGOU ,  Toru Mizuno ,  Osamu Shindo

    IPC分类号： B23K1/08

    CPC分类号： B23K3/0615 ,  H01L2224/11 ,  H05K3/3478

    摘要： A solder dispenser provides a cylindrical dispensing container which has a solder inlet for introducing the above-mentioned solder member, and an opening portion for discharging the above-mentioned solder member to the external, and forms an internal space where the solder member can fall between the above-mentioned solder inlet and the above-mentioned opening portion, and a solder supply portion which is detachably mounted in the dispensing container and holds the solder member, wherein, in a state that the above-mentioned lid member is mounted in the above-mentioned dispensing container, the above-mentioned solder supply portion holds the above-mentioned solder member in the opening region of the above-mentioned solder inlet and the above-mentioned internal space becomes a closed space except the above-mentioned opening portion, and wherein, when holding of the solder member is released, the solder member falls inside a closed space to arrive at the opening portion.

    摘要翻译： 焊料分配器提供圆柱形分配容器，其具有用于引入上述焊料构件的焊料入口和用于将上述焊料部件排出到外部的开口部分，并形成内部空间，焊料部件可以落在 上述焊料入口和上述开口部分，以及可拆卸地安装在分配容器中并保持焊料构件的焊料供应部分，其中，在上述盖构件安装在上述状态下 上述焊料供给部将上述焊料保持在上述焊料入口的开口区域中，上述内部空间成为除上述开口部以外的封闭空间， 其中，当焊料部件的保持被释放时，焊料部件落入封闭空间内以到达开口部分。