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1.
公开(公告)号:US20050284770A1
公开(公告)日:2005-12-29
申请号:US11215254
申请日:2005-08-30
申请人: Paul Butterfield , Liang-Yuh Chen , Yonqi Hu , Antoine Manens , Rashid Mavliev , Stan Tsai , Feng Liu , Ralph Wadensweiler , Lizhong Sun , Siew Neo , Alain Duboust
发明人: Paul Butterfield , Liang-Yuh Chen , Yonqi Hu , Antoine Manens , Rashid Mavliev , Stan Tsai , Feng Liu , Ralph Wadensweiler , Lizhong Sun , Siew Neo , Alain Duboust
IPC分类号: B23H5/00 , B23H5/06 , B23H5/08 , B23H5/10 , B24B37/04 , B24B49/16 , B24B53/007 , B24D13/14 , C25D17/00 , C25D17/10 , H01L21/321
CPC分类号: B23H5/06 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/11 , B24B37/22 , B24B37/24 , B24B37/26 , B24B49/16 , B24B53/017 , C25D17/10 , H01L21/32125
摘要: Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes a ring-shaped upper layer having a polishing surface, and a conductive layer coupled to the upper layer and forming a replaceable assembly therewith.
摘要翻译: 提供了用于研磨衬底的抛光制品的实施例。 在一个实施例中,抛光制品包括具有抛光表面的环形上层,以及耦合到上层并与其形成可更换组件的导电层。
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公开(公告)号:US20080026681A1
公开(公告)日:2008-01-31
申请号:US11868829
申请日:2007-10-08
申请人: PAUL BUTTERFIELD , Liang-Yuh Chen , Yonqi Hu , Antoine Manens , Rashid Mavliev , Stan Tsai , Feng Liu , Ralph Wadensweiler , Lizhong Sun , Siew Neo , Alain Duboust
发明人: PAUL BUTTERFIELD , Liang-Yuh Chen , Yonqi Hu , Antoine Manens , Rashid Mavliev , Stan Tsai , Feng Liu , Ralph Wadensweiler , Lizhong Sun , Siew Neo , Alain Duboust
IPC分类号: B24B29/00
CPC分类号: B23H5/06 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/11 , B24B37/22 , B24B37/24 , B24B37/26 , B24B49/16 , B24B53/017 , C25D17/10 , H01L21/32125
摘要: Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes an annular upper layer made of a dielectric material coupled to an annular lower layer made of a conductive material, and an annular subpad sandwiched between the annular upper layer and the annular lower layer forming a replaceable assembly therewith.
摘要翻译: 提供了用于研磨衬底的抛光制品的实施例。 在一个实施例中,抛光制品包括由与由导电材料制成的环形下层耦合的电介质材料制成的环形上层,以及夹在环形上层和环形下层之间的环形子垫,其与之形成可更换组件。
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3.
公开(公告)号:US07278911B2
公开(公告)日:2007-10-09
申请号:US11215254
申请日:2005-08-30
申请人: Paul D. Butterfield , Liang-Yuh Chen , Yonqi Hu , Antoine P. Manens , Rashid Mavliev , Stan D. Tsai , Feng Q. Liu , Ralph Wadensweiler , Lizhong Sun , Siew S. Neo , Alain Duboust
发明人: Paul D. Butterfield , Liang-Yuh Chen , Yonqi Hu , Antoine P. Manens , Rashid Mavliev , Stan D. Tsai , Feng Q. Liu , Ralph Wadensweiler , Lizhong Sun , Siew S. Neo , Alain Duboust
CPC分类号: B23H5/06 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/11 , B24B37/22 , B24B37/24 , B24B37/26 , B24B49/16 , B24B53/017 , C25D17/10 , H01L21/32125
摘要: Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes a ring-shaped upper layer having a polishing surface, and a conductive layer coupled to the upper layer and forming a replaceable assembly therewith.
摘要翻译: 提供了用于研磨衬底的抛光制品的实施例。 在一个实施例中,抛光制品包括具有抛光表面的环形上层,以及耦合到上层并与其形成可更换组件的导电层。
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4.
公开(公告)号:US07422516B2
公开(公告)日:2008-09-09
申请号:US11868829
申请日:2007-10-08
申请人: Paul D. Butterfield , Liang-Yuh Chen , Yonqi Hu , Antoine P. Manens , Rashid Mavliev , Stan D. Tsai , Feng Q. Liu , Ralph Wadensweiler , Lizhong Sun , Siew S. Neo , Alain Duboust
发明人: Paul D. Butterfield , Liang-Yuh Chen , Yonqi Hu , Antoine P. Manens , Rashid Mavliev , Stan D. Tsai , Feng Q. Liu , Ralph Wadensweiler , Lizhong Sun , Siew S. Neo , Alain Duboust
CPC分类号: B23H5/06 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/11 , B24B37/22 , B24B37/24 , B24B37/26 , B24B49/16 , B24B53/017 , C25D17/10 , H01L21/32125
摘要: Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes an annular upper layer made of a dielectric material coupled to an annular lower layer made of a conductive material, and an annular subpad sandwiched between the annular upper layer and the annular lower layer forming a replaceable assembly therewith.
摘要翻译: 提供了用于研磨衬底的抛光制品的实施例。 在一个实施例中,抛光制品包括由与由导电材料制成的环形下层耦合的电介质材料制成的环形上层,以及夹在环形上层和环形下层之间的环形子垫,其与之形成可更换组件。
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5.
公开(公告)号:US06962524B2
公开(公告)日:2005-11-08
申请号:US10642128
申请日:2003-08-15
申请人: Paul D. Butterfield , Liang-Yuh Chen , Yonqi Hu , Antoine P. Manens , Rashid Mavliev , Stan D. Tsai , Feng Q. Liu , Ralph Wadensweiler , Lizhong Sun , Siew S. Neo , Alain Duboust
发明人: Paul D. Butterfield , Liang-Yuh Chen , Yonqi Hu , Antoine P. Manens , Rashid Mavliev , Stan D. Tsai , Feng Q. Liu , Ralph Wadensweiler , Lizhong Sun , Siew S. Neo , Alain Duboust
IPC分类号: B23H5/00 , B23H5/06 , B23H5/08 , B23H5/10 , B24B37/04 , B24B49/16 , B24B53/007 , B24D13/14 , C25D17/00 , C25D17/10 , H01L21/321 , B24D11/02
CPC分类号: B23H5/06 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/11 , B24B37/22 , B24B37/24 , B24B37/26 , B24B49/16 , B24B53/017 , C25D17/10 , H01L21/32125
摘要: Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupled to a second end of the housing. The contact element electrically couples the adapter and the ball with is retained in the housing between seat and the adapter.
摘要翻译: 提供球组件的实施例。 在一个实施例中,球组件包括壳体,球,导电适配器和接触元件。 壳体具有延伸到内部通道的第一端的环形座。 导电适配器联接到壳体的第二端。 接触元件将适配器和球电耦合并保持在座椅和适配器之间的壳体中。
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