公开(公告)号：US12038802B2

公开(公告)日：2024-07-16

申请号：US17070520

申请日：2020-10-14

申请人： PDF Solutions, Inc.

发明人： Tomonori Honda ,  Richard Burch ,  John Kibarian ,  Lin Lee Cheong ,  Qing Zhu ,  Vaishnavi Reddipalli ,  Kenneth Harris ,  Said Akar ,  Jeffrey D David ,  Michael Keleher ,  Brian Stine ,  Dennis Ciplickas

IPC分类号： G06N20/00 ,  G06F11/07 ,  G06F18/211 ,  G06F18/241 ,  G06F18/40 ,  H01L21/02 ,  G06F3/0482 ,  G06N3/08 ,  G06N7/01

CPC分类号： G06F11/079 ,  G06F11/0736 ,  G06F11/0751 ,  G06F11/0778 ,  G06F18/211 ,  G06F18/241 ,  G06F18/40 ,  G06N20/00 ,  H01L21/02 ,  G06F3/0482 ,  G06N3/08 ,  G06N7/01

摘要： Classifying wafers using Collaborative Learning. An initial wafer classification is determined by a rule-based model. A predicted wafer classification is determined by a machine learning model. Multiple users can manually review the classifications to confirm or modify, or to add user classifications. All of the classifications are input to the machine learning model to continuously update its scheme for detection and classification.

公开(公告)号：US10777472B1

公开(公告)日：2020-09-15

申请号：US16147631

申请日：2018-09-29

申请人： PDF Solutions, Inc.

发明人： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC分类号： H01L23/58 ,  H01L21/66 ,  H01L23/528

摘要： An IC includes a contiguous standard cell area with first, second, and third TS-GATE-short-configured test area geometries disposed therein. In some embodiments, the contiguous standard cell area may further include: fourth and fifth TS-GATE-short-configured test area geometries, and/or other test area geometries, such as tip-to-tip-short, tip-to-side-short, diagonal-short, corner-short, interlayer-overlap-short, via-chamfer-short, merged-via-short, snake-open, stitch-open, via-open, or metal-island-open.

公开(公告)号：US10199293B1

公开(公告)日：2019-02-05

申请号：US15937182

申请日：2018-03-27

申请人： PDF Solutions, Inc.

发明人： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC分类号： H01L23/58 ,  H01L21/66 ,  H01L27/118 ,  H01L27/02 ,  H01L23/528 ,  H01L29/06

摘要： A method for processing a semiconductor wafer uses non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one side-to-side short or leakage, and at least one chamfer short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, side-to-side short, and chamfer short test areas.

公开(公告)号：US10199284B1

公开(公告)日：2019-02-05

申请号：US15936825

申请日：2018-03-27

申请人： PDF Solutions, Inc.

发明人： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC分类号： H01L21/66 ,  H01L27/02 ,  H01L23/528 ,  H01L23/58 ,  H01L29/06

摘要： A method for processing a semiconductor wafer uses non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one tip-to-side short or leakage, and at least one chamfer short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, tip-to-side short, and chamfer short test areas.

公开(公告)号：US10096530B1

公开(公告)日：2018-10-09

申请号：US15635357

申请日：2017-06-28

申请人： PDF Solutions, Inc.

发明人： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC分类号： H01L29/00 ,  H01L21/66 ,  G06F17/50 ,  H01L27/02 ,  G06F11/07 ,  H01L29/06

摘要： A process for making and using a semiconductor wafer includes instantiating first and second designs of experiments (DOES), each comprised of at least two fill cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The first DOE contains fill cells configured to enable non-contact (NC) detection of merged-via opens, and the second DOE contains fill cells configured to enable NC detection of stitch opens. The process may further include obtaining NC measurements from the first and/or second DOE(s) and using such measurements, at least in part, to selectively perform additional processing, metrology or inspection steps on the wafer, and/or on other wafer(s) currently being manufactured.

公开(公告)号：US09818660B1

公开(公告)日：2017-11-14

申请号：US15633920

申请日：2017-06-27

申请人： PDF Solutions, Inc.

发明人： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC分类号： H01L29/00 ,  H01L21/66 ,  G06F11/07 ,  G06F17/50 ,  H01L29/06 ,  H01L27/02

CPC分类号： H01L22/20 ,  G01R31/303 ,  G06F11/079 ,  G06F17/5045 ,  G06F17/5068 ,  G06F17/5072 ,  G06F17/5081 ,  G06F2217/06 ,  H01L21/823437 ,  H01L21/823475 ,  H01L22/26 ,  H01L22/32 ,  H01L22/34 ,  H01L23/5226 ,  H01L23/528 ,  H01L27/0207 ,  H01L27/088 ,  H01L27/11803 ,  H01L27/11807 ,  H01L28/00 ,  H01L29/0649 ,  H01L29/0684 ,  H01L29/0847 ,  H01L29/41725 ,  H01L29/45 ,  H01L2027/11866 ,  H01L2027/11875 ,  H01L2027/11888

摘要： An IC includes first and second designs of experiments (DOEs), each comprised of at least two fill cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The first DOE contains fill cells configured to enable non-contact (NC) detection of via opens, and the second DOE contains fill cells configured to enable NC detection of metal island opens.

公开(公告)号：US09786649B1

公开(公告)日：2017-10-10

申请号：US15634896

申请日：2017-06-27

申请人： PDF Solutions, Inc.

发明人： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC分类号： H01L29/00 ,  H01L27/02 ,  H01L21/66 ,  H01L29/417 ,  H01L29/06 ,  H01L23/528 ,  G06F17/50 ,  G06F11/07

CPC分类号： H01L27/0207 ,  G06F11/079 ,  G06F17/5045 ,  G06F17/5072 ,  G06F17/5081 ,  H01L22/14 ,  H01L22/20 ,  H01L22/26 ,  H01L22/34 ,  H01L23/528 ,  H01L27/11807 ,  H01L29/0649 ,  H01L29/0684 ,  H01L29/41725 ,  H01L2027/11875

摘要： A process for making and using a semiconductor wafer includes instantiating first and second designs of experiments (DOES), each comprised of at least two fill cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The first DOE contains fill cells configured to enable non-contact (NC) detection of via opens, and the second DOE contains fill cells configured to enable NC detection of stitch opens. The process may further include obtaining NC measurements from the first and/or second DOE(s) and using such measurements, at least in part, to selectively perform additional processing, metrology or inspection steps on the wafer, and/or on other wafer(s) currently being manufactured.

公开(公告)号：US09773773B1

公开(公告)日：2017-09-26

申请号：US15395751

申请日：2016-12-30

申请人： PDF Solutions, Inc.

发明人： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC分类号： H01L27/00 ,  H01L27/02 ,  H01L21/66 ,  G06F11/07 ,  H01L29/06 ,  G06F17/50

CPC分类号： H01L22/20 ,  G01R31/303 ,  G06F11/079 ,  G06F17/5045 ,  G06F17/5068 ,  G06F17/5072 ,  G06F17/5081 ,  G06F2217/06 ,  H01L21/823437 ,  H01L21/823475 ,  H01L22/26 ,  H01L22/32 ,  H01L22/34 ,  H01L23/5226 ,  H01L23/528 ,  H01L27/0207 ,  H01L27/088 ,  H01L27/11803 ,  H01L27/11807 ,  H01L28/00 ,  H01L29/0649 ,  H01L29/0684 ,  H01L29/0847 ,  H01L29/41725 ,  H01L29/45 ,  H01L2027/11866 ,  H01L2027/11875 ,  H01L2027/11888

摘要： An IC includes logic cells, selected from a standard cell library, and fill cells, configured for compatibility with the standard logic cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The IC includes such NCEM-enabled fill cells configured to enable detection and/or measurement of a variety of short-circuit failure modes, including at least one chamfer-short-related failure mode, one AACNT-short-related failure mode, one GATE-short-related failure mode, and one GATECNT-short-related failure mode.

公开(公告)号：US09766970B1

公开(公告)日：2017-09-19

申请号：US15635259

申请日：2017-06-28

申请人： PDF Solutions, Inc.

发明人： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC分类号： H01L29/00 ,  G06F11/07 ,  G06F17/50 ,  H01L27/02 ,  H01L29/06

CPC分类号： H01L22/20 ,  G01R31/303 ,  G06F11/079 ,  G06F17/5045 ,  G06F17/5068 ,  G06F17/5072 ,  G06F17/5081 ,  G06F2217/06 ,  H01L21/823437 ,  H01L21/823475 ,  H01L22/26 ,  H01L22/32 ,  H01L22/34 ,  H01L23/5226 ,  H01L23/528 ,  H01L27/0207 ,  H01L27/088 ,  H01L27/11803 ,  H01L27/11807 ,  H01L28/00 ,  H01L29/0649 ,  H01L29/0684 ,  H01L29/0847 ,  H01L29/41725 ,  H01L29/45 ,  H01L2027/11866 ,  H01L2027/11875 ,  H01L2027/11888

摘要： An IC includes first and second designs of experiments (DOES), each comprised of at least two fill cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The first DOE contains fill cells configured to enable non-contact (NC) detection of merged-via opens, and the second DOE contains fill cells configured to enable NC detection of metal island opens.

公开(公告)号：US09761502B1

公开(公告)日：2017-09-12

申请号：US15633040

申请日：2017-06-26

申请人： PDF Solutions, Inc.

发明人： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC分类号： H01L27/00 ,  H01L21/66 ,  G06F11/07 ,  G06F17/50 ,  H01L29/06 ,  H01L27/02

CPC分类号： H01L22/20 ,  G01R31/303 ,  G06F11/079 ,  G06F17/5045 ,  G06F17/5068 ,  G06F17/5072 ,  G06F17/5081 ,  G06F2217/06 ,  H01L21/823437 ,  H01L21/823475 ,  H01L22/26 ,  H01L22/32 ,  H01L22/34 ,  H01L23/5226 ,  H01L23/528 ,  H01L27/0207 ,  H01L27/088 ,  H01L27/11803 ,  H01L27/11807 ,  H01L28/00 ,  H01L29/0649 ,  H01L29/0684 ,  H01L29/0847 ,  H01L29/41725 ,  H01L29/45 ,  H01L2027/11866 ,  H01L2027/11875 ,  H01L2027/11888

摘要： An IC includes first and second designs of experiments (DOEs), each comprised of at least two fill cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The first DOE contains fill cells configured to enable non-contact (NC) detection of via opens, and the second DOE contains fill cells configured to enable NC detection of merged-via opens.