专利检索 ap:("PDF Solutions, Inc.") AND inv:"Larg Weiland" 第 1 页

1.

发明授权
IC with test structures embedded within a contiguous standard cell area 有权

公开(公告)号：US10777472B1

公开(公告)日：2020-09-15

申请号：US16147631

申请日：2018-09-29

申请人： PDF Solutions, Inc.

发明人： Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama

IPC分类号： H01L23/58 , H01L21/66 , H01L23/528

摘要： An IC includes a contiguous standard cell area with first, second, and third TS-GATE-short-configured test area geometries disposed therein. In some embodiments, the contiguous standard cell area may further include: fourth and fifth TS-GATE-short-configured test area geometries, and/or other test area geometries, such as tip-to-tip-short, tip-to-side-short, diagonal-short, corner-short, interlayer-overlap-short, via-chamfer-short, merged-via-short, snake-open, stitch-open, via-open, or metal-island-open.

2.

发明授权
Method for processing a semiconductor water using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one side-to-side short or leakage, and at least one chamfer short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, side to side short, and chamfer short test areas 有权

公开(公告)号：US10199293B1

公开(公告)日：2019-02-05

申请号：US15937182

申请日：2018-03-27

申请人： PDF Solutions, Inc.

发明人： Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama

IPC分类号： H01L23/58 , H01L21/66 , H01L27/118 , H01L27/02 , H01L23/528 , H01L29/06

摘要： A method for processing a semiconductor wafer uses non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one side-to-side short or leakage, and at least one chamfer short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, side-to-side short, and chamfer short test areas.

3.

发明授权
Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one tip-to-side short or leakage, and at least one chamfer short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, tip-to-side short, and chamfer short test areas 有权

公开(公告)号：US10199284B1

公开(公告)日：2019-02-05

申请号：US15936825

申请日：2018-03-27

申请人： PDF Solutions, Inc.

发明人： Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama

IPC分类号： H01L21/66 , H01L27/02 , H01L23/528 , H01L23/58 , H01L29/06

摘要： A method for processing a semiconductor wafer uses non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one tip-to-side short or leakage, and at least one chamfer short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, tip-to-side short, and chamfer short test areas.

4.

发明授权
Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including merged-via open configured fill cells, and the second DOE including stitch open configured fill cells 有权

公开(公告)号：US10096530B1

公开(公告)日：2018-10-09

申请号：US15635357

申请日：2017-06-28

申请人： PDF Solutions, Inc.

发明人： Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama

IPC分类号： H01L29/00 , H01L21/66 , G06F17/50 , H01L27/02 , G06F11/07 , H01L29/06

摘要： A process for making and using a semiconductor wafer includes instantiating first and second designs of experiments (DOES), each comprised of at least two fill cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The first DOE contains fill cells configured to enable non-contact (NC) detection of merged-via opens, and the second DOE contains fill cells configured to enable NC detection of stitch opens. The process may further include obtaining NC measurements from the first and/or second DOE(s) and using such measurements, at least in part, to selectively perform additional processing, metrology or inspection steps on the wafer, and/or on other wafer(s) currently being manufactured.

5.

发明授权
Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including via open configured fill cells, and the second DOE including metal island open configured fill cells 有权

公开(公告)号：US09818660B1

公开(公告)日：2017-11-14

申请号：US15633920

申请日：2017-06-27

申请人： PDF Solutions, Inc.

发明人： Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama

IPC分类号： H01L29/00 , H01L21/66 , G06F11/07 , G06F17/50 , H01L29/06 , H01L27/02

CPC分类号： H01L22/20 , G01R31/303 , G06F11/079 , G06F17/5045 , G06F17/5068 , G06F17/5072 , G06F17/5081 , G06F2217/06 , H01L21/823437 , H01L21/823475 , H01L22/26 , H01L22/32 , H01L22/34 , H01L23/5226 , H01L23/528 , H01L27/0207 , H01L27/088 , H01L27/11803 , H01L27/11807 , H01L28/00 , H01L29/0649 , H01L29/0684 , H01L29/0847 , H01L29/41725 , H01L29/45 , H01L2027/11866 , H01L2027/11875 , H01L2027/11888

摘要： An IC includes first and second designs of experiments (DOEs), each comprised of at least two fill cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The first DOE contains fill cells configured to enable non-contact (NC) detection of via opens, and the second DOE contains fill cells configured to enable NC detection of metal island opens.

6.

发明授权
Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including via open configured fill cells, and the second DOE including stitch open configured fill cells 有权

公开(公告)号：US09786649B1

公开(公告)日：2017-10-10

申请号：US15634896

申请日：2017-06-27

申请人： PDF Solutions, Inc.

发明人： Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama

IPC分类号： H01L29/00 , H01L27/02 , H01L21/66 , H01L29/417 , H01L29/06 , H01L23/528 , G06F17/50 , G06F11/07

CPC分类号： H01L27/0207 , G06F11/079 , G06F17/5045 , G06F17/5072 , G06F17/5081 , H01L22/14 , H01L22/20 , H01L22/26 , H01L22/34 , H01L23/528 , H01L27/11807 , H01L29/0649 , H01L29/0684 , H01L29/41725 , H01L2027/11875

摘要： A process for making and using a semiconductor wafer includes instantiating first and second designs of experiments (DOES), each comprised of at least two fill cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The first DOE contains fill cells configured to enable non-contact (NC) detection of via opens, and the second DOE contains fill cells configured to enable NC detection of stitch opens. The process may further include obtaining NC measurements from the first and/or second DOE(s) and using such measurements, at least in part, to selectively perform additional processing, metrology or inspection steps on the wafer, and/or on other wafer(s) currently being manufactured.

7.

发明授权
Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least chamfer-short-configured, AACNT-short-configured, GATE-short-configured, and GATECNT-short-configured, NCEM-enabled fill cells 有权

公开(公告)号：US09773773B1

公开(公告)日：2017-09-26

申请号：US15395751

申请日：2016-12-30

申请人： PDF Solutions, Inc.

发明人： Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama

IPC分类号： H01L27/00 , H01L27/02 , H01L21/66 , G06F11/07 , H01L29/06 , G06F17/50

CPC分类号： H01L22/20 , G01R31/303 , G06F11/079 , G06F17/5045 , G06F17/5068 , G06F17/5072 , G06F17/5081 , G06F2217/06 , H01L21/823437 , H01L21/823475 , H01L22/26 , H01L22/32 , H01L22/34 , H01L23/5226 , H01L23/528 , H01L27/0207 , H01L27/088 , H01L27/11803 , H01L27/11807 , H01L28/00 , H01L29/0649 , H01L29/0684 , H01L29/0847 , H01L29/41725 , H01L29/45 , H01L2027/11866 , H01L2027/11875 , H01L2027/11888

摘要： An IC includes logic cells, selected from a standard cell library, and fill cells, configured for compatibility with the standard logic cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The IC includes such NCEM-enabled fill cells configured to enable detection and/or measurement of a variety of short-circuit failure modes, including at least one chamfer-short-related failure mode, one AACNT-short-related failure mode, one GATE-short-related failure mode, and one GATECNT-short-related failure mode.

8.

发明授权
Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including merged-via open configured fill cells, and the second DOE including metal island open configured fill cells 有权

公开(公告)号：US09766970B1

公开(公告)日：2017-09-19

申请号：US15635259

申请日：2017-06-28

申请人： PDF Solutions, Inc.

发明人： Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama

IPC分类号： H01L29/00 , G06F11/07 , G06F17/50 , H01L27/02 , H01L29/06

CPC分类号： H01L22/20 , G01R31/303 , G06F11/079 , G06F17/5045 , G06F17/5068 , G06F17/5072 , G06F17/5081 , G06F2217/06 , H01L21/823437 , H01L21/823475 , H01L22/26 , H01L22/32 , H01L22/34 , H01L23/5226 , H01L23/528 , H01L27/0207 , H01L27/088 , H01L27/11803 , H01L27/11807 , H01L28/00 , H01L29/0649 , H01L29/0684 , H01L29/0847 , H01L29/41725 , H01L29/45 , H01L2027/11866 , H01L2027/11875 , H01L2027/11888

摘要： An IC includes first and second designs of experiments (DOES), each comprised of at least two fill cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The first DOE contains fill cells configured to enable non-contact (NC) detection of merged-via opens, and the second DOE contains fill cells configured to enable NC detection of metal island opens.

9.

发明授权
Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including via open configured fill cells, and the second DOE including merged-via configured fill cells 有权

公开(公告)号：US09761502B1

公开(公告)日：2017-09-12

申请号：US15633040

申请日：2017-06-26

申请人： PDF Solutions, Inc.

发明人： Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama

IPC分类号： H01L27/00 , H01L21/66 , G06F11/07 , G06F17/50 , H01L29/06 , H01L27/02

CPC分类号： H01L22/20 , G01R31/303 , G06F11/079 , G06F17/5045 , G06F17/5068 , G06F17/5072 , G06F17/5081 , G06F2217/06 , H01L21/823437 , H01L21/823475 , H01L22/26 , H01L22/32 , H01L22/34 , H01L23/5226 , H01L23/528 , H01L27/0207 , H01L27/088 , H01L27/11803 , H01L27/11807 , H01L28/00 , H01L29/0649 , H01L29/0684 , H01L29/0847 , H01L29/41725 , H01L29/45 , H01L2027/11866 , H01L2027/11875 , H01L2027/11888

摘要： An IC includes first and second designs of experiments (DOEs), each comprised of at least two fill cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The first DOE contains fill cells configured to enable non-contact (NC) detection of via opens, and the second DOE contains fill cells configured to enable NC detection of merged-via opens.

10.

发明授权
Integrated circuit containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including tip-to-tip short configured fill cells, and the second DOE including corner short configured fill cells 有权

公开(公告)号：US09721938B1

公开(公告)日：2017-08-01

申请号：US15473646

申请日：2017-03-30

申请人： PDF Solutions, Inc.

发明人： Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama

IPC分类号： H01L27/02 , H01L21/66 , H01L29/45 , H01L23/522 , H01L23/528 , H01L21/8234 , H01L27/088 , G06F17/50

CPC分类号： H01L22/20 , G01R31/303 , G06F11/079 , G06F17/5045 , G06F17/5068 , G06F17/5072 , G06F17/5081 , G06F2217/06 , H01L21/823437 , H01L21/823475 , H01L22/26 , H01L22/32 , H01L22/34 , H01L23/5226 , H01L23/528 , H01L27/0207 , H01L27/088 , H01L27/11803 , H01L27/11807 , H01L28/00 , H01L29/0649 , H01L29/0684 , H01L29/0847 , H01L29/41725 , H01L29/45 , H01L2027/11866 , H01L2027/11875 , H01L2027/11888

摘要： An IC includes first and second designs of experiments (DOEs), each comprised of at least two fill cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The first DOE contains fill cells configured to enable non-contact (NC) detection of tip-to-tip shorts, and the second DOE contains fill cells configured to enable NC detection of corner shorts.

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