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公开(公告)号：US20180254550A1
公开(公告)日：2018-09-06
申请号：US15899678
申请日：2018-02-20
发明人： TOMOHIRO MURATA , JUNJI SATO
摘要： An antenna device includes: a dielectric substrate having a first surface and a second surface; a semiconductor substrate disposed above the first surface of the dielectric substrate and having a third surface and a fourth surface that faces the dielectric substrate; an integrated circuit disposed on the fourth surface of the semiconductor substrate; a radiator disposed on the fourth surface of the semiconductor substrate; a reflector disposed at a position where projection of the radiator along a radiation direction of an electromagnetic wave radiated from the radiator falls on the third surface of the semiconductor substrate; and one or more directors disposed at a position where projection of the radiator along the radiation direction falls on the dielectric substrate.
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公开(公告)号：US20180226727A1
公开(公告)日：2018-08-09
申请号：US15867268
申请日：2018-01-10
发明人： JUNJI SATO
CPC分类号： H01Q21/0025 , G01S7/032 , G01S7/038 , G01S13/931 , G01S2007/028 , H01Q1/3233 , H01Q1/525 , H01Q9/065 , H01Q9/285 , H01Q13/10 , H01Q13/106 , H01Q21/062 , H01Q21/064 , H01Q21/28 , H01Q23/00 , H04B7/0413
摘要： A module includes a dielectric substrate, one or more electric coupling antenna elements that are formed in one or more conductive layers included in the dielectric substrate and that have a shape elongated in an electric field direction of an electromagnetic wave to be radiated by the one or more electric coupling antenna elements, and one or more magnetic coupling antenna elements that are formed in the one or more conductive layers and that have a shape elongated in a magnetic field direction of the electromagnetic wave to be radiated by the one or more electric coupling antenna elements.
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公开(公告)号：US20160261036A1
公开(公告)日：2016-09-08
申请号：US15046933
申请日：2016-02-18
发明人： JUNJI SATO , RYOSUKE SHIOZAKI
CPC分类号： H01Q1/38 , G01S7/02 , G01S7/032 , G01S7/4026 , G01S2007/028 , G01S2007/4013 , H01L23/66 , H01L2223/6677 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2924/10253 , H01L2924/1421 , H01Q1/2283 , H01Q9/04 , H01Q21/08 , H01Q23/00
摘要： An antenna-integrated module includes: one or more semiconductor chips each including a silicon substrate, a metal layer stacked on a first surface of the silicon substrate, and one or more frequency converters; an insulating layer that surrounds the one or more semiconductor chips; a re-distribution layer that is stacked on a first surface of the insulating layer and on a first surface of the metal layer; one or more first antenna elements that are provided on the first surface of the metal layer with a first conductor pattern and that are connected to the one or more frequency converters; and one or more second antenna elements that are provided with a second conductor pattern on a first surface of the re-distribution layer stacked on the first surface of the insulating layer and that are connected to the one or more frequency converters.
摘要翻译： 天线集成模块包括：一个或多个半导体芯片，每个半导体芯片包括硅衬底，堆叠在硅衬底的第一表面上的金属层和一个或多个变频器; 围绕所述一个或多个半导体芯片的绝缘层; 层叠在所述绝缘层的第一表面上并且在所述金属层的第一表面上的再分布层; 一个或多个第一天线元件，其设置在具有第一导体图案的金属层的第一表面上并且连接到所述一个或多个变频器; 以及一个或多个第二天线元件，其在所述再分配层的第一表面上设置有第二导体图案，所述第二导体图案堆叠在所述绝缘层的所述第一表面上并且连接到所述一个或多个变频器。
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公开(公告)号：US20180277946A1
公开(公告)日：2018-09-27
申请号：US15926630
申请日：2018-03-20
发明人： TOMOHIRO MURATA , JUNJI SATO
IPC分类号： H01Q1/52 , H01Q19/185 , H01Q1/48
CPC分类号： H01Q1/521 , H01Q1/38 , H01Q1/48 , H01Q9/0407 , H01Q15/008 , H01Q19/185
摘要： An antenna apparatus includes: a dielectric substrate; at least first and second radiators disposed in a first wiring layer in the dielectric substrate; a first reflector disposed in a first range in a second wiring layer in the dielectric substrate, the first range including a second range where the first radiator is projected in the layer thickness direction of the dielectric substrate; a second reflector disposed in a third range in the second wiring layer, the third range including a fourth range where the second radiator is projected in the layer thickness direction; and an electromagnetic band-gap disposed between the first and second radiators. The electromagnetic band-gap has patches disposed in the first wiring layer, a ground electrode disposed in a third wiring layer at a different place from the second wiring layer in the layer thickness direction, and a first via extending in the layer thickness direction, both ends of the via mutually connecting the patches and ground electrode.
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公开(公告)号：US20170082730A1
公开(公告)日：2017-03-23
申请号：US15256509
申请日：2016-09-02
发明人： TAKAAKI KISHIGAMI , JUNJI SATO
CPC分类号： G01S7/28 , G01S13/325 , G01S2013/0254 , H01Q21/061 , H01Q25/00
摘要： A plurality of transmission antennas include Nt1 transmission antennas arranged in a first direction and Nt2 transmission antennas arranged in a second direction orthogonal to the first direction, a plurality of reception antennas include Na1 reception antennas arranged in the first direction and Na2 reception antennas arranged in the second direction. In the first direction, an inter-element space between any two of the Nt1 transmission antennas and an inter-element space between any two of the Na1 reception antennas are each a value which is a product of a first space and an integer and are all values different from each other, and in the second direction, an inter-element space between any two of the Nt2 transmission antennas and an inter-element space between any two of the Na2 reception antennas are each a value which is a product of a second space and an integer and are all values different from each other.
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公开(公告)号：US20160072191A1
公开(公告)日：2016-03-10
申请号：US14842880
申请日：2015-09-02
发明人： HIROSHI IWAI , JUNJI SATO , RYOSUKE SHIOZAKI , JIRO HIROKAWA , MIAO ZHANG
摘要： An array antenna device includes a plurality of slot array antennas which are arranged and each of which includes a plurality of slot antennas and a radiation surface, which is formed to be conformal, and a plurality of waveguides each of which supplies respective power to each of the slot array antennas. After bodies of the waveguides are formed by a resin molding method, surface treatment is performed with respect to inner surfaces of the waveguides with plating.
摘要翻译： 阵列天线装置包括多个时隙阵列天线，其布置并且每个天线阵列天线包括多个时隙天线和形成为保形的辐射表面，以及多个波导，每个波导将各自的功率提供给 时隙阵列天线。 在通过树脂模制方法形成波导体之后，相对于具有电镀的波导管的内表面进行表面处理。
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公开(公告)号：US20190252795A1
公开(公告)日：2019-08-15
申请号：US16270940
申请日：2019-02-08
发明人： TOMOHIRO MURATA , JUNJI SATO
摘要： An antenna device includes: a first sub-array antenna provided on a substrate and having a group of first antenna elements, one or more third antenna elements, and a first electrical power line through which electric power is supplied to the group of first antenna elements and the one or more third antenna elements; and a second sub-array antenna provided on the substrate and having a group of second antenna elements, the one or more third antenna elements, and a second electrical power line through which electric power is supplied to the group of second antenna elements and the one or more third antenna elements. The one or more third antenna elements are placed away from the first electrical power line and the second electrical power line.
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公开(公告)号：US20170257067A1
公开(公告)日：2017-09-07
申请号：US15409506
申请日：2017-01-18
发明人： TAKAYUKI ABE , JUNJI SATO
CPC分类号： H03F1/0205 , H03F1/14 , H03F3/193 , H03F3/21 , H03F3/45179 , H03F2200/21 , H03F2200/267 , H03F2200/451 , H03F2203/45318 , H03F2203/45394
摘要： A power amplifier circuit includes an input that receives a first input signal having a first phase and a second input signal having a second phase, a first transistor that includes a source that is supplied with a first voltage, and a gate that receives the first input signal, a second transistor that includes a source that is supplied with the first voltage, and a gate that receives the second input signal, a first neutralizing circuit that neutralizes a parasitic element, a second neutralizing circuit that neutralizes a parasitic element, N third transistors, N being an integer equal to or higher that 1, N fourth transistors, and an output that is connected between a drain of the N-th third transistor and a drain of the N-th fourth transistor and outputs a first output signal having a third phase and a second output signal having a fourth phase.
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公开(公告)号：US20160285465A1
公开(公告)日：2016-09-29
申请号：US15044024
申请日：2016-02-15
发明人： TAKAYUKI ABE , JUNJI SATO
CPC分类号： H03L7/00 , H03B5/1209 , H03B5/1212 , H03B5/1228 , H03B5/1278 , H03B5/24 , H03B2200/0088 , H03K3/027 , H03K5/003 , H03L7/099
摘要： An oscillation signal generation circuit includes an oscillator and a calibration circuit. The oscillator includes a reference signal source circuit that has a reference signal source outputting a reference signal and converts the output reference signal into a control voltage, a filter that includes a variable resistance and a capacitance and removes noise in the control voltage, a transistor that converts the control voltage which has passed through the filter into a control current and outputs the control current, a core circuit that is driven by the control current and generates an output signal, and an output terminal that outputs the generated output signal. The calibration circuit is connected to the output terminal of the oscillator, detects whether or not the generated output signal is oscillating, and adjusts the current value of the control current by controlling the resistance value of the variable resistance in accordance with the detection result.
摘要翻译： 振荡信号产生电路包括振荡器和校准电路。 振荡器包括参考信号源电路，其具有输出参考信号的参考信号源并将输出参考信号转换为控制电压，包括可变电阻和电容并且去除控制电压中的噪声的滤波器， 将通过滤波器的控制电压转换为控制电流，并输出控制电流，由控制电流驱动的核心电路并产生输出信号，以及输出产生的输出信号的输出端子。 校准电路连接到振荡器的输出端子，检测所产生的输出信号是否振荡，并通过根据检测结果控制可变电阻的电阻值来调节控制电流的电流值。
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公开(公告)号：US20210288398A1
公开(公告)日：2021-09-16
申请号：US17334322
申请日：2021-05-28
发明人： JUNJI SATO , RYOSUKE SHIOZAKI
摘要： An antenna-integrated module includes: a substrate; one or more semiconductor chips each arranged on the substrate; and one or more antenna elements that are connected to the one or more semiconductor chips. At least one antenna element among the one or more antenna elements is arranged in the same region on the substrate on which the one or more semiconductor chips are arranged.
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