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公开(公告)号：US09799803B2
公开(公告)日：2017-10-24
申请号：US15223713
申请日：2016-07-29
Inventor： Naoki Tagami , Masumi Abe , Hisaki Fujitani , Kosuke Takehara , Toshiaki Kurachi
IPC: H01L33/48
CPC classification number: H01L33/486 , H01L2224/32225 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2924/181 , H01L2924/00012 , H01L2924/00
Abstract: A light emitting diode (LED) module including: a substrate; a resist including a plurality of layers, above the substrate; and an LED element mounted above the resist via an adhesive. The adhesive includes an addition-reaction type silicone resin. In the resist, a higher positioned layer of the plurality of layers is lower in at least one of sulfur content, phosphorus content, and nitrogen content than a lower positioned layer of the plurality of layers.
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Patent Agency Ranking
公开(公告)号：US09761766B2
公开(公告)日：2017-09-12
申请号：US15013457
申请日：2016-02-02
Inventor： Kosuke Takehara , Hisaki Fujitani , Naoki Tagami
IPC: H01L33/50 , H01L33/56 , H01L33/62 , H01L33/60 , H01L33/20 , H01L33/54 , H01L33/44 , H01L25/075 , H05K1/02
CPC classification number: H01L33/502 , H01L25/0753 , H01L33/50 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/48228 , H01L2224/49107 , H01L2224/73265 , H05K1/0274 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
Abstract: An LED module includes a mount board and an LED chip. The mount board includes: an insulation substrate that includes resin and glass; a first conductor, a second conductor and a third conductor; and a white resist layer. The white resist layer is provided with a first opening, a second opening and at least one third opening for exposing the first conductor, the second conductor and the third conductor, respectively. The LED module further includes a wavelength conversion layer disposed between the LED chip and the third conductor in a thickness direction of the LED chip. The wavelength conversion layer includes phosphor particles that are excited by first light emitted from the LED chip to emit second light having wavelengths greater than wavelengths of the first light.
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公开(公告)号：US10260687B2
公开(公告)日：2019-04-16
申请号：US15790674
申请日：2017-10-23
Inventor： Hisaki Fujitani , Masumi Abe , Kosuke Takehara
IPC: F21K9/64 , H01L25/075 , F21K9/00 , F21V5/00 , F21V7/00 , F21Y115/10 , F21S8/04 , F21K9/23 , F21K9/27 , F21Y103/10 , F21V5/04 , F21V13/02 , F21K9/69 , F21K9/68
Abstract: A light-emitting module is provided. The light emitting module includes a substrate; a thin-film layer that is disposed above the substrate, the thin-film layer defining an opening that exposes a surface of the substrate; a light-emitting element disposed above the substrate and in the opening; and a sealant disposed above the substrate and in the opening, the sealant containing a wavelength converter and sealing the light-emitting element. A thickness of the thin-film layer is less than a thickness of the sealant. An edge portion of the sealant is in contact with the thin-film layer. The surface of the substrate and a surface of the thin-film layer are hydrophilic. The surface of the thin-film layer has a lower wettability than a wettability of the surface of the substrate.
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4.发明授权公开(公告)号：US09741915B2
公开(公告)日：2017-08-22
申请号：US15220790
申请日：2016-07-27
Inventor： Naoki Tagami , Masumi Abe , Hisaki Fujitani , Kosuke Takehara , Toshiaki Kurachi
CPC classification number: H01L33/62 , H01L33/60 , H01L2224/48091 , H01L2224/48228 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
Abstract: A light emitting diode (LED) module including: a substrate; a resist including a plurality of layers above the substrate; and an LED element mounted above the substrate. A content percentage of at least one of a phenyl group, an ester bond, and a carbon double bond in a second layer that is an uppermost layer of the plurality of layers is lower than a content percentage of the at least one of the phenyl group, the ester bond, and the carbon double bond in a first layer that is an underlying layer of the plurality of layers, the underlying layer being located below the uppermost layer.
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公开(公告)号：US10103298B2
公开(公告)日：2018-10-16
申请号：US15223043
申请日：2016-07-29
Inventor： Naoki Tagami , Masumi Abe , Hisaki Fujitani , Kosuke Takehara , Toshiaki Kurachi
Abstract: A light emitting diode (LED) module which includes: a substrate; a resist including a plurality of layers above the substrate; and an LED element mounted above the substrate. The plurality of layers includes a second layer that is an uppermost layer and a first layer that is an underlying layer. The second layer that is the uppermost layer includes fluorine as a component.
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公开(公告)号：US09728695B2
公开(公告)日：2017-08-08
申请号：US15012133
申请日：2016-02-01
Inventor： Kosuke Takehara , Hisaki Fujitani , Naoki Tagami , Toshiaki Kurachi
CPC classification number: H01L33/62 , H01L33/50 , H01L33/505 , H01L33/52 , H01L33/60 , H01L2224/45144 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H05K1/0274 , H05K2201/0195 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
Abstract: A mount substrate includes: an insulation substrate containing resin and glass; connection conductors formed on a surface of the insulation substrate; a first white resist layer that covers the connection conductors; and a second white resist layer that covers the first white resist. Each of the connection conductors includes a copper foil and a plating layer partly formed on the copper foil. The plating layer is formed of metal having oxidation-resistant and corrosion-resistant characteristics higher than those of copper. The first white resist layer is formed with first openings that respectively expose the plating layers of the connection conductors. The second white resist layer covers a periphery of each plating layer of the connection conductors in planar view.
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