Vapor chamber structure and method for manufacturing the same
    2.
    发明申请
    Vapor chamber structure and method for manufacturing the same 审中-公开
    蒸气室结构及其制造方法

    公开(公告)号:US20090040726A1

    公开(公告)日:2009-02-12

    申请号:US11889074

    申请日:2007-08-09

    IPC分类号: H05K7/20 B21D53/02

    摘要: A vapor chamber structure includes a casing, a working fluid, a wick layer, a plurality of structure strengthening bodies, and a plurality of backflow accelerating bodies. The casing has an airtight vacuum chamber. The working fluid is filled into the airtight vacuum chamber. The wick layer is formed on a surface of the airtight vacuum chamber. The structure strengthening bodies are respectively arranged in the airtight vacuum chamber for supporting the casing. The backflow accelerating bodies are respectively arranged in the airtight vacuum chamber for increasing the backflow velocity of the working fluid. Therefore, the present invention can maintain the completeness of the vapor chamber structure and increase the backflow velocity of the working fluid due to the match of the structure strengthening bodies and backflow accelerating bodies. Because the backflow velocity of the working fluid is increased, the heat-transmitting efficiency is increased.

    摘要翻译: 蒸气室结构包括壳体,工作流体,芯层,多个结构强化体和多个回流加速体。 外壳具有气密真空室。 将工作流体填充到气密真空室中。 芯层形成在气密真空室的表面上。 结构强化体分别设置在用于支撑壳体的气密真空室中。 回流加速体分别设置在气密真空室中,用于增加工作流体的回流速度。 因此,本发明可以保持蒸气室结构的完整性,并且由于结构强化体和回流加速体的匹配而增加工作流体的回流速度。 因为工作流体的回流速度增加,所以传热效率提高。