利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

32 条记录 (耗时 0.022 秒)

    METHOD AND APPARATUS FOR SIGNAL PROBE CONTACT WITH CIRCUIT BOARD VIAS
    5.
    发明申请
    METHOD AND APPARATUS FOR SIGNAL PROBE CONTACT WITH CIRCUIT BOARD VIAS 审中-公开
    用于信号探测的方法和装置与电路板VIAS接触

    公开(公告)号：US20090302874A1

    公开(公告)日：2009-12-10

    申请号：US12135119

    申请日：2008-06-06

    申请人： Paul M. Harvey ,  Samuel W. Yang ,  Yaping Zhou

    发明人： Paul M. Harvey ,  Samuel W. Yang ,  Yaping Zhou

    IPC分类号： G01R1/067

    CPC分类号： G01R1/06788 ,  G01R1/06738

    摘要： A method and apparatus for probing a circuit board, is provided. One implementation involves a signal probe including a tip having a plurality of strands of flexible conductive material surrounding the tip, the strands extending out from the tip to provide multiple points of contact with the rim of a via or a conductive barrel of the via when the tip is inserted into the via, the probe tip and probe strands being made of same conductive material; such that aligning the signal probe with the via for engaging the probe tip strands with the via, and inserting the tip into the via, causes bending and flexing of the strands for making contact with a conductor on a top rim of the barrel and inside an inner wall of the barrel.

    摘要翻译： 提供一种用于探测电路板的方法和装置。 一个实施方案涉及信号探针，其包括具有围绕尖端的多个柔性导电材料股的尖端，所述股线从尖端延伸出来，以提供与通孔的通孔或导电筒的边缘的多个接触点 尖端插入通孔中，探针尖端和探针线由相同的导电材料制成; 使得信号探针与用于将探针尖端股线与通孔接合并将尖端插入通孔的通孔的信号探针引起股线的弯曲和弯曲以与筒的顶部边缘上的导体接触，并且在一个 桶的内壁。

    Method and apparatus to reduce impedance discontinuity in packages
    6.
    发明授权
    Method and apparatus to reduce impedance discontinuity in packages 失效
    减少封装中阻抗不连续性的方法和装置

    公开(公告)号：US08440917B2

    公开(公告)日：2013-05-14

    申请号：US11942061

    申请日：2007-11-19

    申请人： Paul M. Harvey ,  Douglas O. Powell ,  Wolfgang Sauter ,  Yaping Zhou

    发明人： Paul M. Harvey ,  Douglas O. Powell ,  Wolfgang Sauter ,  Yaping Zhou

    IPC分类号： H05K1/11

    CPC分类号： H05K1/115 ,  H05K1/0233 ,  H05K1/112 ,  H05K3/42 ,  H05K3/4602 ,  H05K2201/086 ,  H05K2201/09536 ,  H05K2201/096

    摘要： A method, system and apparatus for coating plated through holes (PTHs) to reduce impedance discontinuity in electronic packages. PTH vias are imbedded in the core of a printed circuit board comprising a core layer, a plurality of buildup layers, a plurality of micro-vias, and a plurality of traces. Traces electrically interconnect each of the micro-vias to PTH vias, forming an electrically conductive path. PTHs are coated with a magnetic metal material, such as nickel, to increase the internal and external conductance of the PTHs, thereby providing decreased impedance discontinuity of the signals in electronic packages.

    摘要翻译： 一种用于涂覆电镀通孔（PTH）的方法，系统和装置，以减少电子封装中的阻抗不连续性。 PTH通孔嵌入印刷电路板的芯中，该印刷电路板包括芯层，多个堆积层，多个微通孔和多个迹线。 迹线将每个微通孔电连接到PTH通孔，形成导电路径。 PTH用诸如镍的磁性金属材料涂覆以增加PTH的内部和外部电导，从而在电子封装中提供信号的阻抗不连续性。

    Method and Apparatus to Reduce Impedance Discontinuity in Packages
    7.
    发明申请
    Method and Apparatus to Reduce Impedance Discontinuity in Packages 有权
    减少封装阻抗不连续性的方法和装置

    公开(公告)号：US20130075148A1

    公开(公告)日：2013-03-28

    申请号：US13426892

    申请日：2012-03-22

    申请人： Paul M. Harvey ,  Douglas O. Powell ,  Wolfgang Sauter ,  Yaping Zhou

    发明人： Paul M. Harvey ,  Douglas O. Powell ,  Wolfgang Sauter ,  Yaping Zhou

    IPC分类号： H05K1/11

    CPC分类号： H05K1/115 ,  H05K1/0233 ,  H05K1/112 ,  H05K3/42 ,  H05K3/4602 ,  H05K2201/086 ,  H05K2201/09536 ,  H05K2201/096

    摘要： A device and/or apparatus having plated through holes (PTHs) which are coated to reduce impedance discontinuity in electronic packages. PTH vias are imbedded in the core of a printed circuit board comprising a core layer, a plurality of buildup layers, a plurality of micro-vias, and a plurality of traces. Traces electrically interconnect each of the micro-vias to PTH vias, forming an electrically conductive path. PTHs are coated with a magnetic metal material, such as nickel, to increase the internal and external conductance of the PTHs, thereby providing decreased impedance discontinuity of the signals in electronic packages.

    摘要翻译： 一种具有电镀通孔（PTH）的器件和/或设备，其被涂覆以减少电子封装中的阻抗不连续性。 PTH通孔嵌入印刷电路板的芯中，该印刷电路板包括芯层，多个堆积层，多个微通孔和多个迹线。 迹线将每个微通孔电连接到PTH通孔，形成导电路径。 PTH用诸如镍的磁性金属材料涂覆以增加PTH的内部和外部电导，从而在电子封装中提供信号的阻抗不连续性。

    Method and Apparatus to Reduce Impedance Discontinuity in Packages
    8.
    发明申请
    Method and Apparatus to Reduce Impedance Discontinuity in Packages 失效
    减少封装阻抗不连续性的方法和装置

    公开(公告)号：US20090126983A1

    公开(公告)日：2009-05-21

    申请号：US11942061

    申请日：2007-11-19

    申请人： Paul M. Harvey ,  Douglas O. Powell ,  Wolfgang Sauter ,  Yaping Zhou

    发明人： Paul M. Harvey ,  Douglas O. Powell ,  Wolfgang Sauter ,  Yaping Zhou

    IPC分类号： H05K1/02 ,  H05K3/10

    CPC分类号： H05K1/115 ,  H05K1/0233 ,  H05K1/112 ,  H05K3/42 ,  H05K3/4602 ,  H05K2201/086 ,  H05K2201/09536 ,  H05K2201/096

    摘要： A method, system and apparatus for coating plated through holes (PTHs) to reduce impedance discontinuity in electronic packages. PTH vias are imbedded in the core of a printed circuit board comprising a core layer, a plurality of buildup layers, a plurality of micro-vias, and a plurality of traces. Traces electrically interconnect each of the micro-vias to PTH vias, forming an electrically conductive path. PTHs are coated with a magnetic metal material, such as nickel, to increase the internal and external conductance of the PTHs, thereby providing decreased impedance discontinuity of the signals in electronic packages.

    摘要翻译： 一种用于涂覆电镀通孔（PTH）的方法，系统和装置，以减少电子封装中的阻抗不连续性。 PTH通孔嵌入印刷电路板的芯中，该印刷电路板包括芯层，多个堆积层，多个微通孔和多个迹线。 迹线将每个微通孔电连接到PTH通孔，形成导电路径。 PTH用诸如镍的磁性金属材料涂覆以增加PTH的内部和外部电导，从而在电子封装中提供信号的阻抗不连续性。

    Reducing impedance discontinuity in packages
    9.
    发明授权
    Reducing impedance discontinuity in packages 有权
    减少封装中的阻抗不连续性

    公开(公告)号：US08791372B2

    公开(公告)日：2014-07-29

    申请号：US13426892

    申请日：2012-03-22

    申请人： Paul M. Harvey ,  Douglas O. Powell ,  Wolfgang Sauter ,  Yaping Zhou

    发明人： Paul M. Harvey ,  Douglas O. Powell ,  Wolfgang Sauter ,  Yaping Zhou

    IPC分类号： H05K1/11

    CPC分类号： H05K1/115 ,  H05K1/0233 ,  H05K1/112 ,  H05K3/42 ,  H05K3/4602 ,  H05K2201/086 ,  H05K2201/09536 ,  H05K2201/096

    摘要： A device and/or apparatus having plated through holes (PTHs) which are coated to reduce impedance discontinuity in electronic packages. PTH vias are imbedded in the core of a printed circuit board comprising a core layer, a plurality of buildup layers, a plurality of micro-vias, and a plurality of traces. Traces electrically interconnect each of the micro-vias to PTH vias, forming an electrically conductive path. PTHs are coated with a magnetic metal material, such as nickel, to increase the internal and external conductance of the PTHs, thereby providing decreased impedance discontinuity of the signals in electronic packages.

    摘要翻译： 具有电镀通孔（PTH）的器件和/或设备，其被涂覆以减少电子封装中的阻抗不连续性。 PTH通孔嵌入印刷电路板的芯中，该印刷电路板包括芯层，多个堆积层，多个微通孔和多个迹线。 迹线将每个微通孔电连接到PTH通孔，形成导电路径。 PTH用诸如镍的磁性金属材料涂覆以增加PTH的内部和外部电导，从而在电子封装中提供信号的阻抗不连续性。