公开(公告)号：US08115302B2

公开(公告)日：2012-02-14

申请号：US12134873

申请日：2008-06-06

申请人： Paul S. Andry ,  Evan G. Colgan

发明人： Paul S. Andry ,  Evan G. Colgan

IPC分类号： H01L23/473

CPC分类号： H01L23/473 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/06589 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2224/0401

摘要： Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (high power) IC chips are disposed in close proximity to the integrated cooling module (or cooling plate) for effective heat extraction. Moreover, electronic modules which comprise large surface area silicon carriers with multiple chips face mounted thereon are designed such that integrated silicon cooling modules are rigidly bonded to the back surfaces of such chips to increase the structural integrity of the silicon carriers.

摘要翻译： 提供了用于将微通道冷却模块集成在包括多个高性能IC芯片的高密度电子模块（例如，芯片封装，系统级封装模块等）中的装置和方法。 电子模块被设计成使得高性能（大功率）IC芯片被布置成靠近集成冷却模块（或冷却板）以有效地提取热量。 此外，包括具有多个芯片面的大表面积硅载体的电子模块被设计成使得集成的硅冷却模块刚性地结合到这种芯片的背面以增加硅载体的结构完整性。

公开(公告)号：US20110205708A1

公开(公告)日：2011-08-25

申请号：US12711455

申请日：2010-02-24

申请人： Paul S. Andry ,  Thomas J. Brunschwiler ,  Evan G. Colgan ,  John H. Magerlein

发明人： Paul S. Andry ,  Thomas J. Brunschwiler ,  Evan G. Colgan ,  John H. Magerlein

IPC分类号： H05K7/20 ,  H01L21/50

CPC分类号： H01L23/473 ,  H01L23/147 ,  H01L23/3677 ,  H01L23/481 ,  H01L23/49827 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/0401

摘要： A plurality of heat-dissipating electronic chips are arranged in a vertical chip stack. The electronic chips have electronic components thereon. A cold plate is secured to a back side of the chip stack. A silicon carrier sandwich, defining a fluid cavity, is secured to a front side of the chip stack. An inlet manifold is configured to supply cooling fluid to the cold plate and the fluid cavity of the silicon carrier sandwich. An outlet manifold is configured to receive the cooling fluid from the cold plate and the fluid cavity of the silicon carrier sandwich. The cold plate, the silicon carrier sandwich, the inlet manifold, and the outlet manifold are configured and dimensioned to electrically isolate the cooling fluid from the electronic components. A method of operating an electronic apparatus and a method of manufacturing an electronic apparatus are also disclosed. Single-sided heat removal with double-sided electrical input-output and double-sided heat removal with double-sided electrical input-output are also disclosed.

摘要翻译： 多个散热电子芯片布置在垂直芯片堆叠中。 电子芯片上有电子部件。 冷板固定在芯片堆叠的背面。 限定流体腔的硅载体夹层固定到芯片组的前侧。 入口歧管构造成将冷却流体供应到冷却板和硅载体三明治的流体腔。 出口歧管构造成从冷板和硅载体三明治的流体腔接收冷却流体。 冷板，硅载体夹层，入口歧管和出口歧管的构造和尺寸被设计成将冷却流体与电子部件电隔离。 还公开了操作电子设备的方法和制造电子设备的方法。 还公开了具有双面电输入输出和双面电输入输出的双面除热的单面除热。

公开(公告)号：US07990711B1

公开(公告)日：2011-08-02

申请号：US12711455

申请日：2010-02-24

申请人： Paul S. Andry ,  Thomas J. Brunschwiler ,  Evan G. Colgan ,  John H. Magerlein

发明人： Paul S. Andry ,  Thomas J. Brunschwiler ,  Evan G. Colgan ,  John H. Magerlein

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  H01L23/147 ,  H01L23/3677 ,  H01L23/481 ,  H01L23/49827 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/0401

摘要： A plurality of heat-dissipating electronic chips are arranged in a vertical chip stack. The electronic chips have electronic components thereon. A cold plate is secured to a back side of the chip stack. A silicon carrier sandwich, defining a fluid cavity, is secured to a front side of the chip stack. An inlet manifold is configured to supply cooling fluid to the cold plate and the fluid cavity of the silicon carrier sandwich. An outlet manifold is configured to receive the cooling fluid from the cold plate and the fluid cavity of the silicon carrier sandwich. The cold plate, the silicon carrier sandwich, the inlet manifold, and the outlet manifold are configured and dimensioned to electrically isolate the cooling fluid from the electronic components. A method of operating an electronic apparatus and a method of manufacturing an electronic apparatus are also disclosed. Single-sided heat removal with double-sided electrical input-output and double-sided heat removal with double-sided electrical input-output are also disclosed.

摘要翻译： 多个散热电子芯片布置在垂直芯片堆叠中。 电子芯片上有电子部件。 冷板固定在芯片堆叠的背面。 限定流体腔的硅载体夹层固定到芯片组的前侧。 入口歧管构造成将冷却流体供应到冷却板和硅载体三明治的流体腔。 出口歧管构造成从冷板和硅载体三明治的流体腔接收冷却流体。 冷板，硅载体夹层，入口歧管和出口歧管的构造和尺寸被设计成将冷却流体与电子部件电隔离。 还公开了操作电子设备的方法和制造电子设备的方法。 还公开了具有双面电输入输出和双面电输入输出的双面除热的单面除热。

公开(公告)号：US20080315403A1

公开(公告)日：2008-12-25

申请号：US12134883

申请日：2008-06-06

申请人： Paul S. Andry ,  Evan G. Colgan ,  Lawrence S. Mok ,  Chirag S. Patel ,  David E. Seeger

发明人： Paul S. Andry ,  Evan G. Colgan ,  Lawrence S. Mok ,  Chirag S. Patel ,  David E. Seeger

IPC分类号： H01L23/46

CPC分类号： H01L23/473 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/06589 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2224/0401

摘要： Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (high power) IC chips are disposed in close proximity to the integrated cooling module (or cooling plate) for effective heat extraction. Moreover, electronic modules which comprise large surface area silicon carriers with multiple chips face mounted thereon are designed such that integrated silicon cooling modules are rigidly bonded to the back surfaces of such chips to increase the structural integrity of the silicon carriers.

摘要翻译： 提供了用于将微通道冷却模块集成在包括多个高性能IC芯片的高密度电子模块（例如，芯片封装，系统级封装模块等）中的装置和方法。 电子模块被设计成使得高性能（大功率）IC芯片被布置成靠近集成冷却模块（或冷却板）以有效地提取热量。 此外，包括具有多个芯片面的大表面积硅载体的电子模块被设计成使得集成的硅冷却模块刚性地结合到这种芯片的背面以增加硅载体的结构完整性。

公开(公告)号：US20080265406A1

公开(公告)日：2008-10-30

申请号：US12134873

申请日：2008-06-06

申请人： PAUL S ANDRY ,  Evan G. Colgan

发明人： PAUL S ANDRY ,  Evan G. Colgan

IPC分类号： H01L23/46

CPC分类号： H01L23/473 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/06589 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2224/0401

摘要： Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (high power) IC chips are disposed in close proximity to the integrated cooling module (or cooling plate) for effective heat extraction. Moreover, electronic modules which comprise large surface area silicon carriers with multiple chips face mounted thereon are designed such that integrated silicon cooling modules are rigidly bonded to the back surfaces of such chips to increase the structural integrity of the silicon carriers.

公开(公告)号：US07888786B2

公开(公告)日：2011-02-15

申请号：US11735155

申请日：2007-04-13

申请人： Paul S. Andry ,  Evan G. Colgan ,  Lawrence S. Mok ,  Chirag S. Patel ,  David E. Seeger

发明人： Paul S. Andry ,  Evan G. Colgan ,  Lawrence S. Mok ,  Chirag S. Patel ,  David E. Seeger

IPC分类号： H01L23/473 ,  H01L23/52

CPC分类号： H01L23/473 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/06589 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2224/0401

摘要： Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (high power) IC chips are disposed in close proximity to the integrated cooling module (or cooling plate) for effective heat extraction. Moreover, electronic modules which comprise large surface area silicon carriers with multiple chips face mounted thereon are designed such that integrated silicon cooling modules are rigidly bonded to the back surfaces of such chips to increase the structural integrity of the silicon carriers.

摘要翻译： 提供了用于将微通道冷却模块集成在包括多个高性能IC芯片的高密度电子模块（例如，芯片封装，系统级封装模块等）中的装置和方法。 电子模块被设计成使得高性能（大功率）IC芯片被布置成靠近集成冷却模块（或冷却板）以有效地提取热量。 此外，包括具有多个芯片面的大表面积硅载体的电子模块被设计成使得集成的硅冷却模块刚性地结合到这种芯片的背面以增加硅载体的结构完整性。

公开(公告)号：US07948077B2

公开(公告)日：2011-05-24

申请号：US12134883

申请日：2008-06-06

申请人： Paul S. Andry ,  Evan G. Colgan ,  Lawrence S. Mok ,  Chirag S. Patel ,  David E. Seeger

发明人： Paul S. Andry ,  Evan G. Colgan ,  Lawrence S. Mok ,  Chirag S. Patel ,  David E. Seeger

IPC分类号： H01L23/473 ,  H01L23/52

CPC分类号： H01L23/473 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/06589 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2224/0401

摘要： Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (high power) IC chips are disposed in close proximity to the integrated cooling module (or cooling plate) for effective heat extraction. Moreover, electronic modules which comprise large surface area silicon carriers with multiple chips face mounted thereon are designed such that integrated silicon cooling modules are rigidly bonded to the back surfaces of such chips to increase the structural integrity of the silicon carriers.

摘要翻译： 提供了用于将微通道冷却模块集成在包括多个高性能IC芯片的高密度电子模块（例如，芯片封装，系统级封装模块等）中的装置和方法。 电子模块被设计成使得高性能（大功率）IC芯片被布置成靠近集成冷却模块（或冷却板）以有效地提取热量。 此外，包括具有多个芯片面的大表面积硅载体的电子模块被设计成使得集成的硅冷却模块刚性地结合到这种芯片的背面以增加硅载体的结构完整性。

公开(公告)号：US07230334B2

公开(公告)日：2007-06-12

申请号：US10987985

申请日：2004-11-12

申请人： Paul S. Andry ,  Evan G. Colgan ,  Lawrence S. Mok ,  Chirag S. Patel ,  David E. Seeger

发明人： Paul S. Andry ,  Evan G. Colgan ,  Lawrence S. Mok ,  Chirag S. Patel ,  David E. Seeger

IPC分类号： H01L23/46

CPC分类号： H01L23/473 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/06589 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2224/0401

摘要： Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (high power) IC chips are disposed in close proximity to the integrated cooling module (or cooling plate) for effective heat extraction. Moreover, electronic modules which comprise large surface area silicon carriers with multiple chips face mounted thereon are designed such that integrated silicon cooling modules are rigidly bonded to the back surfaces of such chips to increase the structural integrity of the silicon carriers.

摘要翻译： 提供了用于将微通道冷却模块集成在包括多个高性能IC芯片的高密度电子模块（例如，芯片封装，系统级封装模块等）中的装置和方法。 电子模块被设计成使得高性能（大功率）IC芯片被布置成靠近集成冷却模块（或冷却板）以有效地提取热量。 此外，包括具有多个芯片面的大表面积硅载体的电子模块被设计成使得集成的硅冷却模块刚性地结合到这种芯片的背面以增加硅载体的结构完整性。

公开(公告)号：US08954712B2

公开(公告)日：2015-02-10

申请号：US13313145

申请日：2011-12-07

申请人： Evan G. Colgan ,  Monty M. Denneau ,  Daniel M. Kuchta

发明人： Evan G. Colgan ,  Monty M. Denneau ,  Daniel M. Kuchta

IPC分类号： G06F15/163 ,  G06F15/173

CPC分类号： H04B10/40 ,  G06F15/161 ,  G06F15/163 ,  G06F15/173 ,  G06F15/17337 ,  H04B10/2503 ,  H04L5/14

摘要： Node Interconnect architectures to implement a high performance supercomputer are provided. For example, a node interconnect architecture for connecting a multitude of nodes (or processors) of a supercomputer is implemented using an all-to-all electrical and optical connection network which provides two independent communication paths between any two processors of the supercomputer, wherein a communication path includes at most two electrical links and one optical link.

摘要翻译： 提供节点互连架构来实现高性能超级计算机。 例如，用于连接超级计算机的多个节点（或处理器）的节点互连体系架构是使用提供超级计算机的任何两个处理器之间的两个独立通信路径的全对电连接网络来实现的，其中a 通信路径最多包括两个电连接和一个光链路。

公开(公告)号：US08693200B2

公开(公告)日：2014-04-08

申请号：US13368031

申请日：2012-02-07

申请人： Evan G. Colgan ,  Michael A. Gaynes ,  Jeffrey A. Zitz

发明人： Evan G. Colgan ,  Michael A. Gaynes ,  Jeffrey A. Zitz

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling module for cooling a semiconductor is provided and includes a land grid array (LGA) interposer, a substrate with an LGA side and a chip side, a cooler, a load frame attached to the substrate and formed to define an aperture in which the cooler is removably disposable, a spring clamp removably attachable to the load frame and configured to apply force from the load frame to the cooler such that the substrate and the cooler are urged together about the semiconductor and a load assembly device configured to urge the load frame and the LGA interposer together.

摘要翻译： 提供了一种用于冷却半导体的冷却模块，其包括平台栅格阵列（LGA）插入器，具有LGA侧和芯片侧的衬底，冷却器，附接到衬底并形成以限定孔径的负载框架 冷却器可拆卸地是一次性的，弹簧夹可移除地附接到负载框架并且构造成将力从负载框架施加到冷却器，使得衬底和冷却器围绕半导体被一起被推动在一起;以及负载组件装置，其构造成推动负载框架 和LGA插入器在一起。