公开(公告)号：US07316831B2

公开(公告)日：2008-01-08

申请号：US10706842

申请日：2003-11-12

申请人： Paul S. Andry ,  Praveen Chaudhari ,  James P. Doyle ,  Eileen A. Galligan ,  James A. Lacey ,  Shui-Chih A. Lien ,  Minhua Lu

发明人： Paul S. Andry ,  Praveen Chaudhari ,  James P. Doyle ,  Eileen A. Galligan ,  James A. Lacey ,  Shui-Chih A. Lien ,  Minhua Lu

IPC分类号： G02F1/1337

CPC分类号： G02F1/133734 ,  G02F1/13378 ,  G02F2001/133765 ,  Y10T428/1009

摘要： A liquid crystal display device includes an alignment layer with constituent materials. The constituent materials have a stoichiometric relationship configured to provide a given pretilt angle. Liquid crystal material is provided in contact with the alignment layer. A method for forming an alignment layer for liquid crystal displays includes forming the alignment layer on a substrate by introducing an amount of material to adjust a stoichiometric ratio of constituent materials wherein the amount is determined to provide a given pretilt angle to the alignment layer. Ions are directed at the alignment layer to provide uniformity of the pretilt angle.

摘要翻译： 液晶显示装置包括具有构成材料的取向层。 构成材料具有配置成提供给定预倾角的化学计量关系。 液晶材料设置成与取向层接触。 用于形成液晶显示器取向层的方法包括：通过引入一定量的材料在基板上形成取向层，以调整其中所确定的量与取向层提供给定的预倾角的构成材料的化学计量比。 离子被引导到对准层以提供预倾角的均匀性。

公开(公告)号：US06731361B2

公开(公告)日：2004-05-04

申请号：US09876382

申请日：2001-06-07

申请人： Paul S. Andry ,  Praveen Chaudhari ,  James P. Doyle ,  Eileen A. Galligan ,  Richard A. John ,  James A. Lacey ,  Shui-Chih A. Lien ,  Minhua Lu

发明人： Paul S. Andry ,  Praveen Chaudhari ,  James P. Doyle ,  Eileen A. Galligan ,  Richard A. John ,  James A. Lacey ,  Shui-Chih A. Lien ,  Minhua Lu

IPC分类号： G02F11333

CPC分类号： G02F1/134363

摘要： Display panels and methods for fabrication are disclosed for an in-plane switching mode display to reduce or eliminate image sticking. The display panel includes a substrate with a first electrode formed on the substrate. A dielectric layer is formed on the substrate, and the dielectric layer forms an opening down to the first electrode so that the dielectric layer is eliminated over the first electrode. A second electrode is formed on the dielectric layer, and an alignment layer is formed on the first electrode, the second electrode and the dielectric layer.

摘要翻译： 公开了用于制造的显示面板和方法用于面内切换模式显示以减少或消除图像残留。 显示面板包括在基板上形成有第一电极的基板。 在基板上形成电介质层，电介质层形成向下延伸到第一电极的开口，从而在第一电极上消除电介质层。 在电介质层上形成第二电极，在第一电极，第二电极和电介质层上形成取向层。

公开(公告)号：US06660341B2

公开(公告)日：2003-12-09

申请号：US09877803

申请日：2001-06-07

申请人： Paul S. Andry ,  Praveen Chaudhari ,  James P. Doyle ,  Eileen A. Galligan ,  James A. Lacey ,  Shui-Chih A. Lien ,  Minhua Lu

发明人： Paul S. Andry ,  Praveen Chaudhari ,  James P. Doyle ,  Eileen A. Galligan ,  James A. Lacey ,  Shui-Chih A. Lien ,  Minhua Lu

IPC分类号： G02F11337

CPC分类号： G02F1/133734 ,  G02F1/13378 ,  G02F2001/133765 ,  Y10T428/1009

摘要： A liquid crystal display device includes an alignment layer with constituent materials. The constituent materials have a stoichiometric relationship configured to provide a given pretilt angle. Liquid crystal material is provided in contact with the alignment layer. A method for forming an alignment layer for liquid crystal displays includes forming the alignment layer on a substrate by introducing an amount of material to adjust a stoichiometric ratio of constituent materials wherein the amount is determined to provide a given pretilt angle to the alignment layer. Ions are directed at the alignment layer to provide uniformity of the pretilt angle.

公开(公告)号：US06682786B1

公开(公告)日：2004-01-27

申请号：US09455671

申请日：1999-12-07

申请人： Shui-Chih Alan Lien ,  Alessandro C. Callegari ,  Paul S. Andry ,  Praveen Chaudhari ,  James A. Lacey ,  Sampath Purushothaman ,  James P. Doyle ,  Eileen A. Galligan ,  Richard A. John ,  John J. Ritsko ,  Yuhichi Momoi ,  Christopher Jahnes

发明人： Shui-Chih Alan Lien ,  Alessandro C. Callegari ,  Paul S. Andry ,  Praveen Chaudhari ,  James A. Lacey ,  Sampath Purushothaman ,  James P. Doyle ,  Eileen A. Galligan ,  Richard A. John ,  John J. Ritsko ,  Yuhichi Momoi ,  Christopher Jahnes

IPC分类号： G02F11337

CPC分类号： G02F1/133711 ,  G02F1/13378 ,  G02F1/1393 ,  Y10T428/1009 ,  Y10T428/1064

摘要： A liquid crystal display cell having liquid crystal molecules positioned in a vertical or a substantially vertical alignment is provided. The liquid crystal display cell includes at least two substantially homogeneous fluorinated alignment layers disposed on transparent electrodes; a liquid crystal layer of liquid crystal molecules disposed between the alignment layers; and, a means of applying voltage across the transparent electrodes. Methods for forming these liquid crystal display cells are also provided.

摘要翻译： 提供具有位于垂直或基本垂直取向的液晶分子的液晶显示单元。 液晶显示单元包括设置在透明电极上的至少两个基本均匀的氟化取向层; 设置在取向层之间的液晶分子的液晶层; 以及在透明电极上施加电压的手段。 还提供了形成这些液晶显示单元的方法。

公开(公告)号：US08592932B2

公开(公告)日：2013-11-26

申请号：US13430195

申请日：2012-03-26

申请人： Paul S. Andry ,  John M. Cotte ,  John U. Knickerbocker ,  Cornelia K. Tsang

发明人： Paul S. Andry ,  John M. Cotte ,  John U. Knickerbocker ,  Cornelia K. Tsang

IPC分类号： H01L31/0203

CPC分类号： H01L21/6835 ,  H01L23/147 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/50 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/0401

摘要： Apparatus and methods are provided for high density packaging of semiconductor chips using silicon space transformer chip level package structures, which allow high density chip interconnection and/or integration of multiple chips or chip stacks high I/O interconnection and heterogeneous chip or function integration.

公开(公告)号：US08564113B2

公开(公告)日：2013-10-22

申请号：US13444193

申请日：2012-04-11

申请人： Paul S. Andry ,  Edward C. Cooney, III ,  Edmund J. Sprogis ,  Anthony K. Stamper ,  Cornelia K. Tsang

发明人： Paul S. Andry ,  Edward C. Cooney, III ,  Edmund J. Sprogis ,  Anthony K. Stamper ,  Cornelia K. Tsang

IPC分类号： H01L23/488

CPC分类号： H01L24/10 ,  H01L23/5384 ,  H01L24/13 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/05686 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01327 ,  H01L2924/04953 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/049

摘要： A back of a dielectric transparent handle substrate is coated with a blanket conductive film or a mesh of conductive wires. A semiconductor substrate is attached to the transparent handle substrate employing an adhesive layer. The semiconductor substrate is thinned in the bonded structure to form a stack of the transparent handle substrate and the semiconductor interposer. The thinned bonded structure may be loaded into a processing chamber and electrostatically chucked employing the blanket conductive film or the mesh of conductive wires. The semiconductor interposer may be bonded to a semiconductor chip or a packaging substrate employing C4 bonding or intermetallic alloy bonding. Illumination of ultraviolet radiation to the adhesive layer is enabled, for example, by removal of the blanket conductive film or through the mesh so that the transparent handle substrate may be detached. The semiconductor interposer may then be bonded to a packaging substrate or a semiconductor chip.

摘要翻译： 电介质透明手柄基板的背面涂覆有橡皮布导电膜或导电丝网。 使用粘合剂层将半导体衬底附接到透明手柄衬底。 半导体衬底在接合结构中变薄以形成透明手柄衬底和半导体插入器的堆叠。 减薄的粘合结构可以被加载到处理室中并且使用橡皮布导电膜或导线的网状物静电夹持。 半导体插入件可以结合到采用C4键合或金属间化合物键合的半导体芯片或封装衬底。 照射紫外线到粘合剂层是可以实现的，例如，通过去除橡皮布传导膜或通过网格，使透明手柄基板可以分离。 然后可以将半导体中介层结合到封装衬底或半导体芯片。

公开(公告)号：US08388782B2

公开(公告)日：2013-03-05

申请号：US12788832

申请日：2010-05-27

申请人： Paul S. Andry ,  Bing Dang ,  John Knickerbocker ,  Aparna Prahbakar ,  Peter J. Sorce ,  Robert E. Trzcinski ,  Cornelia K. Tsang

发明人： Paul S. Andry ,  Bing Dang ,  John Knickerbocker ,  Aparna Prahbakar ,  Peter J. Sorce ,  Robert E. Trzcinski ,  Cornelia K. Tsang

IPC分类号： B32B38/10 ,  B32B37/12

CPC分类号： H01L21/67132 ,  C09J5/06 ,  C09J2203/326 ,  C09J2479/08 ,  H01L21/6835 ,  H01L2221/6835 ,  H01L2221/68381 ,  Y10T156/1158

摘要： A method for attaching a handler to a wafer, the wafer comprising an integrated circuit (IC), includes forming a layer of an adhesive on the wafer, the adhesive comprising a polyimide-based polymer configured to withstand processing at a temperature of over about 280° C.; and adhering a handler to the wafer using the layer of adhesive. A system for attaching a handler to a wafer, the wafer comprising IC, includes a layer of an adhesive located on the wafer, the adhesive comprising a polyimide-based polymer configured to withstand processing at a temperature of over about 280° C.; and a handler adhered to the wafer using the layer of adhesive.

摘要翻译： 一种用于将处理器附接到晶片的方法，所述晶片包括集成电路（IC），包括在所述晶片上形成粘合剂层，所述粘合剂包括基于聚酰亚胺的聚合物，所述聚酰亚胺基聚合物构造成经受超过约280℃的温度下的加工 C。; 以及使用所述粘合剂层将处理器粘附到所述晶片。 一种用于将处理器附接到晶片的系统，包括IC的晶片包括位于晶片上的粘合剂层，所述粘合剂包括基于聚酰亚胺的聚合物，其被配置为经受超过约280℃的温度下的加工; 以及使用粘合剂层粘附到晶片的处理器。

公开(公告)号：US08242591B2

公开(公告)日：2012-08-14

申请号：US12540510

申请日：2009-08-13

申请人： Paul S. Andry ,  Edward C. Cooney, III ,  Edmund J. Sprogis ,  Anthony K. Stamper ,  Cornelia K. Tsang

发明人： Paul S. Andry ,  Edward C. Cooney, III ,  Edmund J. Sprogis ,  Anthony K. Stamper ,  Cornelia K. Tsang

IPC分类号： H01L23/488

CPC分类号： H01L24/10 ,  H01L23/5384 ,  H01L24/13 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/05686 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01327 ,  H01L2924/04953 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/049

摘要： A back of a dielectric transparent handle substrate is coated with a blanket conductive film or a mesh of conductive wires. A semiconductor substrate is attached to the transparent handle substrate employing an adhesive layer. The semiconductor substrate is thinned in the bonded structure to form a stack of the transparent handle substrate and the semiconductor interposer. The thinned bonded structure may be loaded into a processing chamber and electrostatically chucked employing the blanket conductive film or the mesh of conductive wires. The semiconductor interposer may be bonded to a semiconductor chip or a packaging substrate employing C4 bonding or intermetallic alloy bonding. Illumination of ultraviolet radiation to the adhesive layer is enabled, for example, by removal of the blanket conductive film or through the mesh so that the transparent handle substrate may be detached. The semiconductor interposer may then be bonded to a packaging substrate or a semiconductor chip.

摘要翻译： 电介质透明手柄基板的背面涂覆有橡皮布导电膜或导电丝网。 使用粘合剂层将半导体衬底附接到透明手柄衬底。 半导体衬底在接合结构中变薄以形成透明手柄衬底和半导体插入器的堆叠。 减薄的粘合结构可以被加载到处理室中并且使用橡皮布导电膜或导线的网状物静电夹持。 半导体插入件可以结合到采用C4键合或金属间化合物键合的半导体芯片或封装衬底。 照射紫外线到粘合剂层是可以实现的，例如，通过去除橡皮布传导膜或通过网格，使透明手柄基板可以分离。 然后可以将半导体中介层结合到封装衬底或半导体芯片。

公开(公告)号：US08115302B2

公开(公告)日：2012-02-14

申请号：US12134873

申请日：2008-06-06

申请人： Paul S. Andry ,  Evan G. Colgan

发明人： Paul S. Andry ,  Evan G. Colgan

IPC分类号： H01L23/473

CPC分类号： H01L23/473 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/06589 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2224/0401

摘要： Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (high power) IC chips are disposed in close proximity to the integrated cooling module (or cooling plate) for effective heat extraction. Moreover, electronic modules which comprise large surface area silicon carriers with multiple chips face mounted thereon are designed such that integrated silicon cooling modules are rigidly bonded to the back surfaces of such chips to increase the structural integrity of the silicon carriers.

摘要翻译： 提供了用于将微通道冷却模块集成在包括多个高性能IC芯片的高密度电子模块（例如，芯片封装，系统级封装模块等）中的装置和方法。 电子模块被设计成使得高性能（大功率）IC芯片被布置成靠近集成冷却模块（或冷却板）以有效地提取热量。 此外，包括具有多个芯片面的大表面积硅载体的电子模块被设计成使得集成的硅冷却模块刚性地结合到这种芯片的背面以增加硅载体的结构完整性。

公开(公告)号：US20110044369A1

公开(公告)日：2011-02-24

申请号：US12544696

申请日：2009-08-20

申请人： Paul S. Andry ,  Russell A. Budd ,  Bing Dang ,  David Danovitch ,  Benjamin V. Fasano ,  Paul Fortier ,  Luc Guerin ,  Frank R. Libsch ,  Sylvain Ouimet ,  Chirag S. Patel

发明人： Paul S. Andry ,  Russell A. Budd ,  Bing Dang ,  David Danovitch ,  Benjamin V. Fasano ,  Paul Fortier ,  Luc Guerin ,  Frank R. Libsch ,  Sylvain Ouimet ,  Chirag S. Patel

IPC分类号： H01S5/18 ,  H01L31/0232 ,  H01L23/34 ,  H01L21/50

CPC分类号： H01L27/1446 ,  G02B6/4204 ,  G02B6/4249 ,  G02B6/4257 ,  G02B6/428 ,  G02B6/4292 ,  H01L23/367 ,  H01L25/16 ,  H01L27/14625 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01S5/005 ,  H01S5/0224 ,  H01S5/02248 ,  H01S5/02276 ,  H01S5/02284 ,  H01S5/02407 ,  H01S5/02476 ,  H01S5/183 ,  H01S5/423 ,  H01L2924/014 ,  H01L2924/00

摘要： An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with wiring. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. A plurality of OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the OE elements positioned in optical alignment with the optical via for receiving the light. A carrier is interposed between electrical interconnect elements. The carrier is positioned between the wiring of the silicon layer and a circuit board and the carrier is electrically connecting first interconnect elements connected to the wiring of the silicon layer and second interconnect elements connected to the circuit board.

摘要翻译： 公开了一种用于制造的光电（OE）封装或系统和方法，其包括具有布线的硅层。 硅层具有允许光通过的光通孔。 光耦合层结合到硅层，并且光耦合层包括多个微透镜，用于聚焦和/或准直光穿过光通孔。 多个OE元件耦合到硅层并与布线电连通。 至少一个OE元件被定位成与用于接收光的光通孔光学对准。 载体介于电互连元件之间。 载体位于硅层的布线和电路板之间，并且载体电连接到连接到硅层的布线的第一互连元件和连接到电路板的第二互连元件。