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    Through board stacking of multiple LGA-connected components
    1.
    发明授权
    Through board stacking of multiple LGA-connected components 有权
    通过板堆叠多个LGA连接的组件

    公开(公告)号：US08278745B2

    公开(公告)日：2012-10-02

    申请号：US12543104

    申请日：2009-08-18

    申请人： Paul W. Coteus ,  Shawn A. Hall ,  Gareth G. Hougham ,  Alphonso P. Lanzetta ,  Rick A. Rand

    发明人： Paul W. Coteus ,  Shawn A. Hall ,  Gareth G. Hougham ,  Alphonso P. Lanzetta ,  Rick A. Rand

    IPC分类号： H01L23/52

    CPC分类号： H05K3/325 ,  H05K2201/0314 ,  H05K2201/10545 ,  H05K2201/10719 ,  H05K2201/2018

    摘要： A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.

    摘要翻译： 提供了一种封装设计，其中芯片模块通过PCB顶表面上的焊盘网格阵列（LGA）连接到印刷电路板（PCB），并且电源通过第二个LGA连接到PCB PCB的底面。 芯片模块，电源和LGA的堆叠被保持就位并用致动硬件压缩形成可调节的框架。 该封装允许模块或PS的现场可替代性，并提供从PS到模块的最短可能布线距离，从而实现更高的性能。

    Through board stacking of multiple LGA-connected components
    2.
    发明申请
    Through board stacking of multiple LGA-connected components 有权
    通过板堆叠多个LGA连接的组件

    公开(公告)号：US20080054430A1

    公开(公告)日：2008-03-06

    申请号：US11511815

    申请日：2006-08-29

    申请人： Paul W. Coteus ,  Shawn A. Hall ,  Gareth G. Hougham ,  Alphonso P. Lanzetta ,  Rick A. Rand

    发明人： Paul W. Coteus ,  Shawn A. Hall ,  Gareth G. Hougham ,  Alphonso P. Lanzetta ,  Rick A. Rand

    IPC分类号： H01L23/02

    CPC分类号： H05K3/325 ,  H05K2201/0314 ,  H05K2201/10545 ,  H05K2201/10719 ,  H05K2201/2018

    摘要： A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.

    摘要翻译： 提供了一种封装设计，其中芯片模块通过PCB顶表面上的焊盘网格阵列（LGA）连接到印刷电路板（PCB），并且电源通过第二个LGA连接到PCB PCB的底面。 芯片模块，电源和LGA的堆叠被保持就位并用致动硬件压缩形成可调节的框架。 该封装允许模块或PS的现场可替代性，并提供从PS到模块的最短可能布线距离，从而实现更高的性能。

    THROUGH BOARD STACKING OF MULTIPLE LGA-CONNECTED COMPONENTS
    3.
    发明申请
    THROUGH BOARD STACKING OF MULTIPLE LGA-CONNECTED COMPONENTS 有权
    通过多个LGA连接组件的板堆栈

    公开(公告)号：US20090315168A1

    公开(公告)日：2009-12-24

    申请号：US12543104

    申请日：2009-08-18

    申请人： Paul W. Coteus ,  Shawn A. Hall ,  Gareth G. Hougham ,  Alphonso P. Lanzetta ,  Rick A. Rand

    发明人： Paul W. Coteus ,  Shawn A. Hall ,  Gareth G. Hougham ,  Alphonso P. Lanzetta ,  Rick A. Rand

    IPC分类号： H01L23/52 ,  H01L21/50

    CPC分类号： H05K3/325 ,  H05K2201/0314 ,  H05K2201/10545 ,  H05K2201/10719 ,  H05K2201/2018

    摘要： A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.

    摘要翻译： 提供了一种封装设计，其中芯片模块通过PCB顶表面上的焊盘网格阵列（LGA）连接到印刷电路板（PCB），并且电源通过第二个LGA连接到PCB PCB的底面。 芯片模块，电源和LGA的堆叠被保持就位并用致动硬件压缩形成可调节的框架。 该封装允许模块或PS的现场可替代性，并提供从PS到模块的最短可能布线距离，从而实现更高的性能。

    Pad on pad type contact interconnection technology for electronic apparatus
    10.
    发明授权
    Pad on pad type contact interconnection technology for electronic apparatus 失效
    垫式电子仪器接触式互联技术

    公开(公告)号：US5558523A

    公开(公告)日：1996-09-24

    申请号：US275897

    申请日：1994-07-15

    申请人： Paul W. Coteus ,  Alphonso P. Lanzetta

    发明人： Paul W. Coteus ,  Alphonso P. Lanzetta

    IPC分类号： H01R4/48 ,  H01L23/48 ,  H01R12/52 ,  H01R13/24 ,  H05K3/36 ,  H01R23/66

    CPC分类号： H01R12/52 ,  H01R13/24 ,  H05K3/365

    摘要： A pad on pad type contact, and technology therefor, for electronic apparatus wherein a spring member, that by its shape and material in the motion when the contact comes together wipes the mating pad surfaces across each other and then retains them under permanent compressive force in service. In high density and high performance electronic apparatus interwiring, array quantities of the spring member of contact are fabricated in unitary assembly elements for connection assemblies between both rigid and flexible type wiring.

    摘要翻译： 用于电子设备的垫式接触垫及其技术，其中弹簧构件通过其形状和材料在接触时的运动中相互擦拭，并将它们保持在永久的压缩力下 服务。 在高密度和高性能的电子设备互连中，接触的弹簧构件的阵列数量被制造成用于刚性和柔性型布线之间的连接组件的单元组装元件。