摘要:
A liquid epoxy resin composition for semiconductor encapsulation comprising: (A) an epoxy resin, (B) an imidazole compound, and (C) a maleimide compound, a semiconductor device encapsulated by the liquid epoxy resin composition, and an assembly in which a cured material of the liquid epoxy resin is positioned between a printed circuit substrate and a semiconductor die.The liquid epoxy resin composition provides a cured material that has an excellent adhesiveness to a semiconductor chip surface and has an excellent moisture resistance.
摘要:
Disclosed herein is a water-based erasable ink for use in a writing instrument. The ink comprises platy-like pigment particles, film formers and an aqueous vehicle. Also disclosed are writing instruments using such inks as well as comprising a reservoir containing a water based erasable ink having a non-shear-thinning composition and a porous fiber nib in fluid communication with this reservoir. Related methods of forming an erasable marking are also disclosed.
摘要:
Disclosed herein is a water-based erasable ink for use in a writing instrument. The ink comprises platy-like pigment particles, film formers and an aqueous vehicle. Also disclosed are writing instruments using such inks as well as comprising a reservoir containing a water based erasable ink having a non-shear-thinning composition and a porous fiber nib in fluid communication with this reservoir. Related methods of forming an erasable marking are also disclosed.