公开(公告)号：US5137461A

公开(公告)日：1992-08-11

申请号：US606007

申请日：1990-10-30

申请人： Perminder S. Bindra ,  Jerome J. Cuomo ,  Thomas P. Gall ,  Anthony P. Ingraham ,  Sung K. Kang ,  Jungihl Kim ,  Paul Lauro ,  David N. Light ,  Voya R. Markovich ,  Ekkehard F. Miersch ,  Jaynal A. Molla ,  Douglas O. Powell ,  John J. Ritsko ,  George J. Saxenmeyer, Jr. ,  Jack A. Varcoe ,  George F. Walker

发明人： Perminder S. Bindra ,  Jerome J. Cuomo ,  Thomas P. Gall ,  Anthony P. Ingraham ,  Sung K. Kang ,  Jungihl Kim ,  Paul Lauro ,  David N. Light ,  Voya R. Markovich ,  Ekkehard F. Miersch ,  Jaynal A. Molla ,  Douglas O. Powell ,  John J. Ritsko ,  George J. Saxenmeyer, Jr. ,  Jack A. Varcoe ,  George F. Walker

IPC分类号： H01R4/26 ,  H01R4/58 ,  H01R13/22 ,  H05K3/32

CPC分类号： H01R4/26 ,  H01L24/83 ,  H01L24/90 ,  H01L24/98 ,  H01R13/22 ,  H01R4/58 ,  H05K3/325 ,  H01L2224/13111 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/48227 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/85444 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  Y10T29/49224

摘要： A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating with an opposite similar contact. Displacement damage is averted through accommodating lateral stresses by providing one or more of a conformal opposing contact, by strengthening through coating and base reinforcement and a deformable coating. The contacts are fabricated by physical and chemical processes including sputtering, normal and pulse electroplating and chemical vapor deposition. The contacts on completion are provided with a surrounding immobilizing material that enhances rigidity.

摘要翻译： 提供一种用于电气设备的可分离和可重新连接的连接件，其适于小型化，其中容纳从平面部分一体地附接和突出的垂直交叉构件，以控制与相对的类似接触件配合时发生的横向位移损坏。 通过提供一个或多个共形相对的接触，通过加强涂层和基底加强件以及可变形的涂层来容纳横向应力来避免位移损伤。 接触是通过物理和化学过程制造的，包括溅射，正常和脉冲电镀以及化学气相沉积。 完成的触点设置有增强刚性的周边固定材料。

公开(公告)号：US5185073A

公开(公告)日：1993-02-09

申请号：US692606

申请日：1991-04-29

申请人： Perminder S. Bindra ,  Jerome J. Cuomo ,  Thomas P. Gall ,  Anthony P. Ingraham ,  Sung K. Kang ,  Jungihl Kim ,  Paul Lauro ,  David N. Light ,  Voya R. Markovich ,  Ekkehard F. Miersch ,  Jaynal A. Molla ,  Douglas O. Powell ,  John J. Ritsko ,  George J. Saxenmeyer, Jr. ,  Jack A. Varcoe ,  George F. Walker

发明人： Perminder S. Bindra ,  Jerome J. Cuomo ,  Thomas P. Gall ,  Anthony P. Ingraham ,  Sung K. Kang ,  Jungihl Kim ,  Paul Lauro ,  David N. Light ,  Voya R. Markovich ,  Ekkehard F. Miersch ,  Jaynal A. Molla ,  Douglas O. Powell ,  John J. Ritsko ,  George J. Saxenmeyer, Jr. ,  Jack A. Varcoe ,  George F. Walker

IPC分类号： H01R4/26 ,  H01R4/58 ,  H01R13/22 ,  H05K3/32

CPC分类号： H01L24/83 ,  H01L24/90 ,  H01R13/22 ,  H01R4/26 ,  H01R4/58 ,  H05K3/325 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/13111 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/48227 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14

摘要： A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating with an opposite similar contact. Displacement damage is averted through accommodating lateral stresses by providing one or more of a conformal opposing contact, by strengthening through coating and base reinforcement and a deformable coating. The contacts are fabricated by physical and chemical processes including sputtering, normal and pulse electroplating and chemical vapor deposition. Pulse electroplating of palladium provides a dendritic deposit of uniform height, uniform rounded points and less branching. The contacts on completion are provided with a surrounding immobilizing material that enhances rigidity.

摘要翻译： 提供一种用于电气设备的可分离和可重新连接的连接件，其适于小型化，其中容纳从平面部分一体地附接和突出的垂直交叉构件，以控制与相对的类似接触件配合时发生的横向位移损坏。 通过提供一个或多个共形相对的接触，通过加强涂层和基底加强件以及可变形的涂层来容纳横向应力来避免位移损伤。 接触是通过物理和化学过程制造的，包括溅射，正常和脉冲电镀以及化学气相沉积。 钯的脉冲电镀提供均匀高度，均匀圆点和较少支化的树枝状沉积物。 完成的触点设置有增强刚性的周边固定材料。

公开(公告)号：US5237743A

公开(公告)日：1993-08-24

申请号：US901054

申请日：1992-06-19

申请人： Raymond A. Busacco ,  Fletcher W. Chapin ,  David W. Dranchak ,  Jaynal A. Molla ,  George J. Saxenmeyer, Jr. ,  Robert D. Topa

发明人： Raymond A. Busacco ,  Fletcher W. Chapin ,  David W. Dranchak ,  Jaynal A. Molla ,  George J. Saxenmeyer, Jr. ,  Robert D. Topa

IPC分类号： H01R43/00 ,  H01R4/26 ,  H01R13/03 ,  H01R13/24 ,  H01R43/16 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40

CPC分类号： H01R13/2435 ,  H01R12/714 ,  H01R13/03 ,  H01R4/26 ,  H05K3/403 ,  H01R43/16 ,  H05K1/118 ,  H05K2201/0373 ,  H05K2201/09172 ,  H05K3/365 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/49224

摘要： A method of forming conductive end portions on a flexible circuit member having a dielectric layer (e.g., polyimide) with at least one conductive element (e.g., copper) thereon. The method comprises the steps of forming (e.g., punching) an opening through both dielectric and conductive element, providing (e.g., additive plating) an electrically conducting layer on the opening's internal surface, providing (e.g., electroplating) a plurality of dendritic elements on the conducting layer's surface, and thereafter removing (e.g., punching) a portion of the dielectric and conductive element such that the formed dendritic elements (e.g., palladium) project from the flexible circuit's conductive ends.

公开(公告)号：US5199879A

公开(公告)日：1993-04-06

申请号：US840212

申请日：1992-02-24

申请人： Harold Kohn ,  Kishor V. Desai ,  Ronald J. Romanosky ,  George J. Saxenmeyer, Jr. ,  Reinhold E. Tomek ,  James R. Webb

发明人： Harold Kohn ,  Kishor V. Desai ,  Ronald J. Romanosky ,  George J. Saxenmeyer, Jr. ,  Reinhold E. Tomek ,  James R. Webb

IPC分类号： H05K1/14 ,  H01R12/58 ,  H01R24/58 ,  H05K1/11 ,  H05K3/00 ,  H05K3/30 ,  H05K3/32 ,  H05K3/46

CPC分类号： H01R24/58 ,  H05K3/326 ,  H01R2103/00 ,  H05K1/118 ,  H05K2201/091 ,  H05K2201/09809 ,  H05K2201/1059 ,  H05K2201/10704 ,  H05K3/306 ,  H05K3/4691

摘要： An electrical assembly which includes a first circuit member (e.g., TCM) with at least one conductive pin projecting therefrom for being frictionally and electrically engaged by a flexible portion of circuit means of a second circuit member (e.g., PCB). An opening is provided within the PCB relative to the flexible portions such that these portions project at least partly across the opening and frictionally engage respective conductive portions of the pin when inserted within the opening. Each of these flexible portions in turn is part of a circuit layer which may be coupled to respective conductive planes or the like within the PCB, while the respective conductive portions of the pin may in turn be electrically coupled to various conductive layers within/upon the TCM.

摘要翻译： 一种电气组件，其包括具有从其突出的至少一个导电针的第一电路构件（例如TCM），用于由第二电路构件（例如PCB）的电路装置的柔性部分摩擦和电接合。 在PCB内相对于柔性部分设置开口，使得这些部分至少部分地突出穿过开口并且当插入到开口内时摩擦地接合销的相应导电部分。 这些柔性部分中的每一个又是电路层的一部分，其可以耦合到PCB内的相应的导电平面等，而引脚的相应导电部分又可以电连接到/ 中医。

公开(公告)号：US5248262A

公开(公告)日：1993-09-28

申请号：US901055

申请日：1992-06-19

申请人： Raymond A. Busacco ,  Chi S. Chang ,  Fletcher W. Chapin ,  David W. Dranchak ,  Thomas G. Macek ,  James R. Petrozello ,  George J. Saxenmeyer, Jr. ,  Rod A. Smith

发明人： Raymond A. Busacco ,  Chi S. Chang ,  Fletcher W. Chapin ,  David W. Dranchak ,  Thomas G. Macek ,  James R. Petrozello ,  George J. Saxenmeyer, Jr. ,  Rod A. Smith

IPC分类号： H01R4/48 ,  H01R12/52 ,  H01R12/71 ,  H01R24/00 ,  H05K7/10

CPC分类号： H05K7/1069 ,  H01R12/52 ,  H01R12/714

摘要： An electrical connector for interconnecting a pair of circuit members (e.g., a circuit board and module), which, in one embodiment, includes a housing, at least one flexible circuit within the housing and a spring means attached to the flexible circuit at two spaced locations for exerting force against the flexible circuit to cause the circuit to engage respective conductive pads on the circuit members when the circuit members are moved toward each other (e.g., compressed). The shape of the spring means conforms substantially to the portion of the flexible circuit between the locations of attachment. In another embodiment, a connector for interconnecting such circuit members includes a housing adapted for being located between both members and at least one elongated, compressible contact member in the housing and including conductive end portions for engaging the circuit members. The contact occupies a first, prestressed position before engagement and is adapted for moving to a second, compressed position during the engagement. The conductive end portions of the flexible circuit in the first embodiment and the contact member in the second embodiment preferably comprise a plurality of dendrites for providing enhanced connections.

公开(公告)号：US4254431A

公开(公告)日：1981-03-03

申请号：US50390

申请日：1979-06-20

申请人： Robert Babuka ,  Robert E. Heath ,  George J. Saxenmeyer, Jr. ,  Lewis K. Schultz

发明人： Robert Babuka ,  Robert E. Heath ,  George J. Saxenmeyer, Jr. ,  Lewis K. Schultz

IPC分类号： H01L23/42 ,  H01L23/373 ,  H01L23/433 ,  H01L25/04 ,  H01L23/02 ,  H01L23/48

CPC分类号： H01L23/4338 ,  H01L23/3733 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253

摘要： An improved arrangement for cooling a module packaged semiconductor integrated circuit chip having heat generating microcircuits thereon is disclosed. Enhanced cooling over prior art techniques is achieved by utilizing an interfacial layer of liquid metal alloy coated metallic dendrites, which layer is sandwiched between two facing surfaces of the chip and a heat sink. Appropriate biasing means are also provided to urge the dendritic projections into piercing engagement with the liquid metal alloy layer, the biasing means being thermally coupled between the heat sink and the module container to thereby aid in forming unitary heat transfer path from the chip to the module container. The biasing means are adapted to provide sufficient force to cause the dendritic projections to engage and retain the liquid metal alloy layer and to non-destructively force the layer to fill all available space between the chip and the heat sink.

摘要翻译： 公开了一种用于冷却其上具有发热微电路的模块封装的半导体集成电路芯片的改进布置。 通过利用液体金属合金涂覆的金属枝晶的界面层来实现对现有技术的增强的冷却，该层被夹在芯片的两个相对表面和散热器之间。 还提供了适当的偏压装置以促使树枝状突起与液态金属合金层刺穿接合，偏压装置热耦合在散热器和模块容器之间，从而有助于形成从芯片到模块的单一传热路径 容器。 偏置装置适于提供足够的力以使树枝状突起接合并保持液态金属合金层，并且非破坏性地迫使该层填充芯片和散热片之间的所有可用空间。