公开(公告)号：US5968670A

公开(公告)日：1999-10-19

申请号：US909864

申请日：1997-08-12

申请人： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  James H. Covell, II ,  Shaji Farooq ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  David C. Linnell ,  Gregory B. Martin ,  Frank L. Pompeo ,  Kathleen A. Stalter ,  Hilton T. Toy

发明人： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  James H. Covell, II ,  Shaji Farooq ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  David C. Linnell ,  Gregory B. Martin ,  Frank L. Pompeo ,  Kathleen A. Stalter ,  Hilton T. Toy

IPC分类号： B23K35/02 ,  H01L21/60 ,  H01L23/48 ,  H05K3/34 ,  B23K35/14

CPC分类号： H01L24/81 ,  B23K35/0222 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H05K3/3436 ,  H01L2224/10135 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/14051 ,  H01L2224/14505 ,  H01L2224/16058 ,  H01L2224/16227 ,  H01L2224/17051 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/30107 ,  H05K2201/09781 ,  H05K2201/10265 ,  H05K2203/0415 ,  H05K2203/0465 ,  H05K2203/306 ,  Y02P70/613 ,  Y10T428/12222 ,  Y10T428/12333 ,  Y10T428/12486

摘要： A method and apparatus are provided for forming an elongated solder joint between two soldered substrates of an electronic module or an electronic module in the process of being fabricated by using expandable solder bump means disposed between the substrates. The expandable solder bumps means comprise solder having a higher reflow temperature than the solder used to join the substrates and expansion means such as a compressed spring encased within the solder and are activated (expanded) by reflowing at a higher temperature than the melting point temperature of the solder joints.

摘要翻译： 提供了一种方法和装置，用于在通过使用设置在基板之间的可膨胀焊料凸块装置制造过程中，在电子模块或电子模块的两个焊接基板之间形成细长焊接接头。 可膨胀焊料凸点装置包括具有比用于接合基板的焊料更高的回流温度的焊料和诸如包封在焊料内的压缩弹簧的膨胀装置，并且通过在比熔融温度高于 焊点。

公开(公告)号：US5975409A

公开(公告)日：1999-11-02

申请号：US909865

申请日：1997-08-12

申请人： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Shaji Farooq ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  David C. Linnell ,  Gregory B. Martin ,  Frank L. Pompeo ,  Kathleen A. Stalter ,  Hilton T. Toy

发明人： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Shaji Farooq ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  David C. Linnell ,  Gregory B. Martin ,  Frank L. Pompeo ,  Kathleen A. Stalter ,  Hilton T. Toy

IPC分类号： H01L21/60 ,  H05K3/34 ,  B23K31/02 ,  B23K37/04

CPC分类号： H01L24/81 ,  H01L24/75 ,  H05K3/3436 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75743 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/30107 ,  H05K2203/0195 ,  H05K2203/0465 ,  H05K2203/082 ,  H05K2203/306 ,  Y02P70/613

摘要： A method and apparatus is provided for forming an elongated solder joint between two soldered substrates of an electronic module by applying a controlled separating force between the two soldered substrates during and/or after heating of the module. The solder joints are plasticized, preferably to the molten state above the liquidus temperature, and are thereby stretched and the module is then cooled to solidify the stretched joints. An apparatus and method are provided which preferably uses a vacuum device as the separating force to stretch the existing solder joints to the desired solder height and configuration which is preferably an hour-glass shape.

摘要翻译： 提供了一种方法和装置，用于在电子模块的两个焊接的基板之间通过在模块的加热期间和/或之后施加受控的分离力来在两个焊接的基板之间形成细长的焊接接头。 焊接接头被塑化，优选地熔化到高于液相线温度的熔融状态，并且由此被拉伸，然后将模块冷却以固化拉伸接头。 提供了一种优选使用真空装置作为将现有焊料接头拉伸到期望的焊料高度和优选为沙漏形状的构造的分离力的装置和方法。

公开(公告)号：US5964396A

公开(公告)日：1999-10-12

申请号：US909801

申请日：1997-08-12

申请人： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Shaji Farooq ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  David C. Linnell ,  Gregory B. Martin ,  Frank L. Pompeo ,  Kathleen A. Stalter ,  Hilton T. Toy

发明人： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Shaji Farooq ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  David C. Linnell ,  Gregory B. Martin ,  Frank L. Pompeo ,  Kathleen A. Stalter ,  Hilton T. Toy

IPC分类号： H01L23/12 ,  B23K3/06 ,  H01L21/60 ,  H05K3/34 ,  B23K31/02 ,  B23K37/04

CPC分类号： B23K3/0638 ,  H05K3/3436 ,  B23K2201/36 ,  H01L2924/00013 ,  H01L2924/0002 ,  H05K2203/0195 ,  H05K2203/0465 ,  H05K2203/306 ,  Y02P70/613

摘要： A device is provided for stretching solder interconnection joints between two substrates of an electronic module. The device employs an expandable metal to exert a separating (stretching) force to the two substrates whereby a lifting rod attached to a clamping bridge is cause to move upwards by expansion of the expandable metal raising a first substrate clamped thereto. A lifting bridge in connection with the clamping bridge is caused to move downward to maintain the lifting bridge in contact with the second substrate being interconnected to the first substrate.

摘要翻译： 提供一种用于在电子模块的两个基板之间拉伸焊料互连接头的装置。 该装置使用可膨胀金属对两个基板施加分离（拉伸）力，借此通过膨胀可膨胀金属的方式使附接到夹紧桥的提升杆向上移动，从而提升夹持在其上的第一基板。 引起与夹紧桥连接的升降桥向下运动，以使升降桥与第二基板相互接触而与第一基板互连。

公开(公告)号：US06278184B1

公开(公告)日：2001-08-21

申请号：US09400783

申请日：1999-09-22

申请人： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  William E. Sablinski ,  Kathleen A. Stalter ,  Hilton T. Toy ,  Li Wang

发明人： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  William E. Sablinski ,  Kathleen A. Stalter ,  Hilton T. Toy ,  Li Wang

IPC分类号： H01L2348

CPC分类号： H01L24/12 ,  B23K1/0016 ,  B23K2101/42 ,  H01L23/10 ,  H01L23/50 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3436 ,  H05K2201/1025 ,  H05K2201/10992 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00

摘要： A solder preform is provided for forming interconnections between multilayer ceramic substrates comprising an upper layer and lower layer of solder separated by an intermediate layer of a material which is wettable by solder and which does not melt at the temperatures used to reflow the solder and form the connections. The solder preform is used to join the substrates and is particularly useful to simultaneously electrically interconnect the substrates and to form a hermetic seal between the substrates being joined.

公开(公告)号：US6070321A

公开(公告)日：2000-06-06

申请号：US890458

申请日：1997-07-09

申请人： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  William E. Sablinski ,  Kathleen A. Stalter ,  Hilton T. Toy ,  Li Wang

发明人： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  William E. Sablinski ,  Kathleen A. Stalter ,  Hilton T. Toy ,  Li Wang

IPC分类号： B23K1/00 ,  B23K35/14 ,  H01L21/60 ,  H01L23/10 ,  H01L23/50 ,  H05K3/34

CPC分类号： H01L24/12 ,  B23K1/0016 ,  H01L23/10 ,  H01L23/50 ,  H01L24/16 ,  H01L24/81 ,  H05K3/3436 ,  B23K2201/42 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K2201/1025 ,  H05K2201/10992 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49144

摘要： A solder preform is provided for forming interconnections between multilayer ceramic substrates comprising an upper layer and lower layer of solder separated by an intermediate layer of a material which is wettable by solder and which does not melt at the temperatures used to reflow the solder and form the connections. The solder preform is used to join the substrates and is particularly useful to simultaneously electrically interconnect the substrates and to form a hermetic seal between the substrates being joined.

摘要翻译： 提供焊料预成型件，用于在多层陶瓷基片之间形成互连，包括上层和下层焊料，该材料由可由焊料润湿的材料的中间层分开，并且在用于回流焊料的温度下不熔化，形成 连接。 焊料预成型件用于连接基板，并且特别可用于同时电连接基板并且在被接合的基板之间形成气密密封。

公开(公告)号：US06253986B1

公开(公告)日：2001-07-03

申请号：US09400784

申请日：1999-09-22

申请人： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  William E. Sablinski ,  Kathleen A. Stalter ,  Hilton T. Toy ,  Li Wang

发明人： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  William E. Sablinski ,  Kathleen A. Stalter ,  Hilton T. Toy ,  Li Wang

IPC分类号： B23K3514

CPC分类号： H01L24/12 ,  B23K1/0016 ,  B23K2101/42 ,  H01L23/10 ,  H01L23/50 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3436 ,  H05K2201/1025 ,  H05K2201/10992 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00

摘要： A solder preform is provided for forming interconnections between multilayer ceramic substrates comprising an upper layer and lower layer of solder separated by an intermediate layer of a material which is wettable by solder and which does not melt at the temperatures used to reflow the solder and form the connections. The solder preform is used to join the substrates and is particularly useful to simultaneously electrically interconnect the substrates and to form a hermetic seal between the substrates being joined.

摘要翻译： 提供焊料预成型件，用于在多层陶瓷基片之间形成互连，包括上层和下层焊料，该材料由可由焊料润湿的材料的中间层分开，并且在用于回流焊料的温度下不熔化，形成 连接。 焊料预成型件用于连接基板，并且特别可用于同时电连接基板并且在被接合的基板之间形成气密密封。

公开(公告)号：US07518235B2

公开(公告)日：2009-04-14

申请号：US10906809

申请日：2005-03-08

申请人： Patrick A. Coico ,  David L. Edwards ,  Benjamin V. Fasano ,  Lewis S. Goldmann ,  Ellyn M. Ingalls ,  Michael S. June ,  Hilton T. Toy ,  Paul A. Zucco

发明人： Patrick A. Coico ,  David L. Edwards ,  Benjamin V. Fasano ,  Lewis S. Goldmann ,  Ellyn M. Ingalls ,  Michael S. June ,  Hilton T. Toy ,  Paul A. Zucco

IPC分类号： H01L23/34

CPC分类号： H01L23/4006 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

摘要： An integrated circuit chip mounting structure includes a chip carrier electrically connected to a circuit board with an integrated circuit chip mounted on the chip carrier. In addition, a thermally conductive device is thermally connected to the chip and a set of compressible support members are provided to transmit a portion of an applied compressive load from the thermally conductive device to the chip and chip carrier.

摘要翻译： 集成电路芯片安装结构包括芯片载体，其电连接到具有安装在芯片载体上的集成电路芯片的电路板。 此外，导热装置热连接到芯片，并且提供一组可压缩支撑构件以将施加的压缩载荷的一部分从导热装置传递到芯片和芯片载体。

公开(公告)号：US06255139B1

公开(公告)日：2001-07-03

申请号：US09369083

申请日：1999-08-05

申请人： David L. Edwards ,  Patrick A. Coico ,  Sushumna Iruvanti ,  Frank L. Pompeo ,  Raed A. Sherif ,  Hilton T. Toy

发明人： David L. Edwards ,  Patrick A. Coico ,  Sushumna Iruvanti ,  Frank L. Pompeo ,  Raed A. Sherif ,  Hilton T. Toy

IPC分类号： H01L2148

CPC分类号： H01L23/3737 ,  H01L23/367 ,  H01L23/3733 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/16152

摘要： The present invention relates generally to a new method for improving the reliability of cooling designs using thermal paste to cool chips in semiconductor modules and structure thereof. More particularly, the invention encompasses a structure and a method that uses surface chemistry modification of the inside of the thermal cooling caps where it contacts thermal paste. The internal surface of the cap is modified by embedding particles that have the same chemical composition as one or more of the solids used in the thermal paste. The particles may be embedded in the cap by casting, grit blasting, or pressing the particles permanently into the surface.

摘要翻译： 本发明一般涉及一种用于提高使用散热膏冷却半导体模块中的芯片的冷却设计的可靠性的新方法及其结构。 更具体地说，本发明包括一种结构和方法，该结构和方法使用热冷却帽内部的与热膏接触的表面化学改性。 盖的内表面通过包埋具有与用于热膏中的一种或多种固体相同的化学组成的颗粒来改性。 颗粒可以通过铸造，喷砂或将颗粒永久地压入表面而嵌入盖中。

公开(公告)号：US06111314A

公开(公告)日：2000-08-29

申请号：US140583

申请日：1998-08-26

申请人： David L. Edwards ,  Patrick A. Coico ,  Sushumna Iruvanti ,  Frank L. Pompeo ,  Raed A. Sherif ,  Hilton T. Toy

发明人： David L. Edwards ,  Patrick A. Coico ,  Sushumna Iruvanti ,  Frank L. Pompeo ,  Raed A. Sherif ,  Hilton T. Toy

IPC分类号： H01L23/367 ,  H01L23/373 ,  H01L23/42 ,  H01L23/12

CPC分类号： H01L23/3737 ,  H01L23/367 ,  H01L23/3733 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/16152

摘要： The present invention relates generally to a new method for improving the reliability of cooling designs using thermal paste to cool chips in semiconductor modules and structure thereof. More particularly, the invention encompasses a structure and a method that uses surface chemistry modification of the inside of the thermal cooling caps where it contacts thermal paste. The internal surface of the cap is modified by embedding particles that have the same chemical composition as one or more of the solids used in the thermal paste. The particles may be embedded in the cap by casting, grit blasting, or pressing the particles permanently into the surface.

摘要翻译： 本发明一般涉及一种用于提高使用散热膏冷却半导体模块中的芯片的冷却设计的可靠性的新方法及其结构。 更具体地说，本发明包括一种结构和方法，该结构和方法使用热冷却帽内部的与热膏接触的表面化学改性。 盖的内表面通过包埋具有与用于热膏中的一种或多种固体相同的化学组成的颗粒来改性。 颗粒可以通过铸造，喷砂或将颗粒永久地压入表面而嵌入盖中。

公开(公告)号：US5773561A

公开(公告)日：1998-06-30

申请号：US692033

申请日：1996-08-02

申请人： Krishna Gandhi Sachdev ,  Michael Berger ,  Patrick A. Coico ,  Frank L. Pompeo

发明人： Krishna Gandhi Sachdev ,  Michael Berger ,  Patrick A. Coico ,  Frank L. Pompeo

IPC分类号： C08L79/08 ,  C08G73/10 ,  C09J179/08 ,  C09J183/10 ,  H01L21/52 ,  C08G69/26

CPC分类号： C09J183/10 ,  C08G73/1042 ,  C08G73/106 ,  C09J179/08 ,  Y10T428/31681

摘要： The present invention relates generally to a new adhesive comprising a vinyl containing siloxane-containing polyimide for use in TSM capping of electronic package assemblies with adhesive capability of providing a seal band width of less than 4mm and even less than 2mm, solubility in non-toxic and environmentally safe solvents and durable adhesive properties and to a method for making the polyimides, a method for using the polyimides to make electronic packages and electronic packages made using the adhesive. The preferred vinyl-containing siloxane containing polyimide is a block type polymer containing blocks of a dianhydride-aromatic diamine oligomeric reaction product joined by non-vinyl/vinyl containing siloxane diamine forming links.

摘要翻译： 本发明一般涉及包含含乙烯基的含硅氧烷的聚酰亚胺的新型粘合剂，用于电子封装组件的TSM封盖，具有提供小于4mm甚至小于2mm的密封带宽度的粘合能力，在无毒的溶解度 和环境安全的溶剂和耐久的粘合性能以及制造聚酰亚胺的方法，使用聚酰亚胺制造使用该粘合剂制成的电子封装和电子封装的方法。 优选的含乙烯基的含硅氧烷的聚酰亚胺是含有通过非乙烯基/乙烯基的硅氧烷二胺形成连接物连接的二酐 - 芳族二胺低聚反应产物的嵌段的嵌段型聚合物。