摘要:
The present application is directed to electrostatic actuators, and methods of making electrostatic actuators. In one embodiment, an electrostatic actuator of the present application comprises a first electrode and a second electrode. The second electrode is positioned in proximity to the first electrode so as to provide a gap between the first electrode and the second electrode. The first electrode is capable of being deflected toward the second electrode. A dielectric structure comprising a dielectric landing post is positioned in the gap between the first electrode and the second electrode, the dielectric structure extending over a greater surface of the gap than the landing post. The landing post protrudes out into the gap so as to limit the minimum contact spacing between the first electrode and the second electrode.
摘要:
The present application is directed to electrostatic actuators, and methods of making electrostatic actuators. In one embodiment, an electrostatic actuator of the present application comprises a first electrode and a second electrode. The second electrode is positioned in proximity to the first electrode so as to provide a gap between the first electrode and the second electrode. The first electrode is capable of being deflected toward the second electrode. A dielectric structure comprising a dielectric landing post is positioned in the gap between the first electrode and the second electrode, the dielectric structure extending over a greater surface of the gap than the landing post. The landing post protrudes out into the gap so as to limit the minimum contact spacing between the first electrode and the second electrode.
摘要:
A method and resulting device for reducing an electrical field at an isolation gap in a capacitive actuator includes providing a bottom electrode layer and forming a pattern in the bottom electrode layer having an isolation gap between center and outer electrode components of the patterned electrode. A spacing material is deposited in the isolation gap, the spacing material having a greater height than a remainder of the patterned electrode, and a sacrificial material is deposited conformably on a surface of the patterned electrode and spacing material. The method also includes applying a deformable electrode to a surface of the sacrificial material, whereby removal of the sacrificial and spacing materials results in a greater spacing between the deformable electrode and the electrode layer at a region of the isolation gap than over a remainder of the spacing between the patterned electrode layer and deformable surface.
摘要:
A method for forming an ink jet printhead can include interposing a coverlay between a press plate of a press and an ink jet printhead aperture plate assembly, such that the coverlay physically contacts an anti-wetting coating on a surface of the aperture plate assembly. With the coverlay contacting the anti-wetting coating, a force is applied to the aperture plate assembly using the press. The coverlay is separated from the aperture plate assembly, wherein the coverlay includes a layer having an elastic modulus of at least 0.5 GPa.
摘要:
An aperture plate for a print head of a printer can include a first layer having a first emissivity which is covered by a second layer having a second emissivity which is less than the first emissivity. In an embodiment, the second layer can be etched at nozzle locations to form openings in the second layer which have widths/areas greater than widths/areas of nozzles formed in the first layer. In another embodiment, the second layer can have a smaller thickness at the nozzle locations and a larger thickness away from the nozzle locations. Forming the openings in the second layer which are larger than the nozzles, or forming the second layer thinner at the nozzle locations prior to forming the nozzles, can provide a well-formed nozzle and an aperture plate having a low emissivity.
摘要:
The present application is directed to novel electrostatic actuators and methods of making the electrostatic actuators. In one embodiment, the electrostatic actuator comprises a substrate, an electrode formed on the substrate and a deflectable member positioned in proximity to the electrode so as to provide a gap between the electrode and the deflectable member. The deflectable member is anchored on the substrate via one or more anchors. The gap comprises at least one first region having a first gap height positioned near the one or more anchors and at least one second region having a second gap height positioned farther from the anchors than the first region. The first gap height is smaller than the second gap height.
摘要:
A method of connecting a chip to a package in a semiconductor device includes printing an encapsulant to a predetermined thickness on at least a portion of the chip and package and printing a layer of conductive material on the encapsulant in a predetermined pattern between the chip and package. The printed conductive material conforms to an upper surface of the encapsulant such that the encapsulant defines a distance from the printed conductive material to the chip and package. The method further includes printing a second layer of encapsulant over the printed conductive material curing at least the second layer of encapsulant.
摘要:
Disclosed is a microelectromechanically tunable Fabry-Perot device and method of manufacturing tunable Fabry-Perot device and method of manufacturing. The F-P device comprises a first and second substrate which has partially reflective planar surfaces, and the partially reflective planar surfaces are separated by a predetermined separation distance and aligned to provide a F-P cavity, where one or more piezoelectric members are adapted to displace the first and second substrates when an electric field is applied.
摘要:
A full width array printhead is provided having a continuous maintainable printhead surface and method of forming the same. The printhead includes a substrate and an array of die modules mounted thereon with a front face of each die module exposed. A hardened fill material surrounds the array of die modules to define a continuous surface coplanar with the front face of the array of die modules.
摘要:
A method and resulting device for accurately positioning an array of die modules in an imaging array, including larger partial width arrays and full page width arrays, is described herein. The method includes forming physical reference datum directly on an individual silicon die module, and positioning the individual die modules on a temporary holder. The temporary holder includes an alignment tool and singulated die are placed onto the temporary holder by abutting the physical reference datum against the alignment tool. A vacuum temporarily secures the die positioned on the temporary holder, and a permanent substrate is then attached to the die of the temporary holder. The temporary holder is released in favor of the permanent substrate having the accurately aligned die modules thereon.