Electric field concentration minimization for MEMS
    3.
    发明授权
    Electric field concentration minimization for MEMS 有权
    MEMS的电场浓度最小化

    公开(公告)号:US07718458B2

    公开(公告)日:2010-05-18

    申请号:US11853469

    申请日:2007-09-11

    IPC分类号: H01L21/00 H01L31/00 H01G5/16

    CPC分类号: B81B3/0086

    摘要: A method and resulting device for reducing an electrical field at an isolation gap in a capacitive actuator includes providing a bottom electrode layer and forming a pattern in the bottom electrode layer having an isolation gap between center and outer electrode components of the patterned electrode. A spacing material is deposited in the isolation gap, the spacing material having a greater height than a remainder of the patterned electrode, and a sacrificial material is deposited conformably on a surface of the patterned electrode and spacing material. The method also includes applying a deformable electrode to a surface of the sacrificial material, whereby removal of the sacrificial and spacing materials results in a greater spacing between the deformable electrode and the electrode layer at a region of the isolation gap than over a remainder of the spacing between the patterned electrode layer and deformable surface.

    摘要翻译: 用于减小电容式致动器中的隔离间隙处的电场的方法和所得装置包括提供底部电极层并在底部电极层中形成图案,该图案在图案化电极的中心和外部电极组件之间具有隔离间隙。 间隔材料沉积在隔离间隙中,间隔材料具有比图案化电极的其余部分更大的高度,并且将牺牲材料顺应地沉积在图案化电极和间隔材料的表面上。 该方法还包括将可变形电极施加到牺牲材料的表面,由此去除牺牲和间隔材料导致在隔离间隙的区域处的可变形电极和电极层之间的间隔比在其余部分 图案化电极层和可变形表面之间的间距。

    Electrostatic actuator device having multiple gap heights
    6.
    发明授权
    Electrostatic actuator device having multiple gap heights 有权
    具有多个间隙高度的静电致动器装置

    公开(公告)号:US08450902B2

    公开(公告)日:2013-05-28

    申请号:US11467660

    申请日:2006-08-28

    IPC分类号: H02N1/00 H01H59/00 B41J2/45

    CPC分类号: H01H59/0009 H01G5/18

    摘要: The present application is directed to novel electrostatic actuators and methods of making the electrostatic actuators. In one embodiment, the electrostatic actuator comprises a substrate, an electrode formed on the substrate and a deflectable member positioned in proximity to the electrode so as to provide a gap between the electrode and the deflectable member. The deflectable member is anchored on the substrate via one or more anchors. The gap comprises at least one first region having a first gap height positioned near the one or more anchors and at least one second region having a second gap height positioned farther from the anchors than the first region. The first gap height is smaller than the second gap height.

    摘要翻译: 本申请涉及新型静电致动器和制造静电致动器的方法。 在一个实施例中,静电致动器包括衬底,形成在衬底上的电极和位于电极附近的可偏转构件,以便在电极和可偏转构件之间提供间隙。 可偏转构件经由一个或多个锚固件锚定在基底上。 所述间隙包括至少一个第一区域,其具有位于所述一个或多个锚固件附近的第一间隙高度和至少一个第二区域,所述第二区域具有比所述第一区域更远离所述锚定件的第二间隙高度。 第一间隙高度小于第二间隙高度。

    Fabry-Perot piezoelectric tunable filter
    8.
    发明授权
    Fabry-Perot piezoelectric tunable filter 有权
    法布里 - 珀罗压电可调谐滤波器

    公开(公告)号:US07911623B2

    公开(公告)日:2011-03-22

    申请号:US11890575

    申请日:2007-08-07

    IPC分类号: G01B9/02

    摘要: Disclosed is a microelectromechanically tunable Fabry-Perot device and method of manufacturing tunable Fabry-Perot device and method of manufacturing. The F-P device comprises a first and second substrate which has partially reflective planar surfaces, and the partially reflective planar surfaces are separated by a predetermined separation distance and aligned to provide a F-P cavity, where one or more piezoelectric members are adapted to displace the first and second substrates when an electric field is applied.

    摘要翻译: 公开了一种微机电可调法布里 - 珀罗器件和制造可调谐法布里 - 珀罗器件的方法和制造方法。 FP器件包括第一和第二衬底,其具有部分反射的平面表面,并且部分反射的平面表面被隔开预定的间隔距离并对齐以提供FP腔,其中一个或多个压电元件适于使第一和 施加电场时的第二基板。

    SELF-ALIGNED PRECISION DATUMS FOR ARRAY DIE PLACEMENT

    公开(公告)号:US20090201328A1

    公开(公告)日:2009-08-13

    申请号:US12422532

    申请日:2009-04-13

    IPC分类号: B41J29/38

    摘要: A method and resulting device for accurately positioning an array of die modules in an imaging array, including larger partial width arrays and full page width arrays, is described herein. The method includes forming physical reference datum directly on an individual silicon die module, and positioning the individual die modules on a temporary holder. The temporary holder includes an alignment tool and singulated die are placed onto the temporary holder by abutting the physical reference datum against the alignment tool. A vacuum temporarily secures the die positioned on the temporary holder, and a permanent substrate is then attached to the die of the temporary holder. The temporary holder is released in favor of the permanent substrate having the accurately aligned die modules thereon.