公开(公告)号：US07884784B2

公开(公告)日：2011-02-08

申请号：US11399208

申请日：2006-04-06

申请人： Piermario Repetto ,  Sabino Sinesi ,  Sara Padovani ,  Stefano Bernard ,  Denis Bollea ,  Davide Capello ,  Piero Perlo ,  Alberto Pairetti ,  Michele Antonipieri

发明人： Piermario Repetto ,  Sabino Sinesi ,  Sara Padovani ,  Stefano Bernard ,  Denis Bollea ,  Davide Capello ,  Piero Perlo ,  Alberto Pairetti ,  Michele Antonipieri

IPC分类号： G09G3/32

CPC分类号： G02B27/01 ,  G02B2027/011 ,  G02B2027/0123 ,  H01L25/0753 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014

摘要： Described herein is a transparent-display device for motor vehicles, to be used for presentation of information to the driver and/or to the passengers, said device comprising a plurality of LED sources, addressable individually or in groups through a series of conductive paths, deposited on a transparent underlayer and connected to a control electronics, in which: i) said LED sources are integrated in the form of dice, i.e., of elements obtained by dividing up a semiconductor wafer and without package; ii) said dice are integrated on, and electrically connected to, said underlayer via technologies of the chip-on-board type; and iii) said transparent underlayer 1 is pre-arranged for being at least in part superimposed on the windscreen of the vehicle, in such a way that at least part of the information presented to the user is superimposed on the background, said background being visible to the user through said windscreen.

摘要翻译： 这里描述的是用于机动车辆的透明显示装置，用于向驾驶员和/或乘客提供信息，所述装置包括多个LED源，可单独地或通过一系列导电路径分组地寻址， 沉积在透明底层上并连接到控制电子器件，其中：i）所述LED源以骰子的形式集成，即通过划分半导体晶片而不包装获得的元件; ii）所述骰子通过板上芯片类型的技术集成在所述底层上并与其电连接; 和iii）所述透明底层1预先布置成至少部分地叠加在车辆的挡风玻璃上，使得呈现给用户的信息的至少一部分叠加在背景上，所述背景是可见的 通过所述挡风玻璃向用户传递。

公开(公告)号：US08283680B2

公开(公告)日：2012-10-09

申请号：US11398358

申请日：2006-04-05

申请人： Piermario Repetto ,  Sabino Sinesi ,  Sara Padovani ,  Stefano Bernard ,  Denis Bollea ,  Davide Capello ,  Alberto Pairetti ,  Michele Antonipieri

发明人： Piermario Repetto ,  Sabino Sinesi ,  Sara Padovani ,  Stefano Bernard ,  Denis Bollea ,  Davide Capello ,  Alberto Pairetti ,  Michele Antonipieri

IPC分类号： H01L29/18

CPC分类号： F21K9/00 ,  G09F9/33 ,  G09F21/04 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/00014

摘要： A method of fabrication of transparent LED devices, of the type comprising the operations of: i) providing a series of conductive paths on a transparent underlayer; ii) connecting said conductive paths to electronic control means; iii) associating to said underlayer an array of LED sources addressable individually or in groups through said conductive paths, in which i) said LED sources are integrated in the form of chips, i.e., of elements obtained by dividing up a semiconductor wafer and without package, via technologies of the chip-on-board type; ii) said method envisages the use of the flip-chip technique for die bonding, i.e., the electrical connection of the chip to the underlayer.

摘要翻译： 一种制造透明LED器件的方法，包括以下操作：i）在透明底层上提供一系列导电路径; ii）将所述导电路径连接到电子控制装置; iii）将所述LED源的阵列与所述底层相关联，所述阵列的LED源单独地或通过所述导电路径可分组地组合，其中i）所述LED源以芯片的形式集成，即，通过划分半导体晶片而没有封装获得的元件 ，通过板载型技术; ii）所述方法设想使用用于芯片接合的倒装芯片技术，即芯片与底层的电连接。

公开(公告)号：US07932524B2

公开(公告)日：2011-04-26

申请号：US11397225

申请日：2006-04-04

申请人： Piermario Repetto ,  Sabino Sinesi ,  Sara Padovani ,  Stefano Bernard ,  Denis Bollea ,  Davide Capello ,  Alberto Pairetti ,  Michele Antonipieri

发明人： Piermario Repetto ,  Sabino Sinesi ,  Sara Padovani ,  Stefano Bernard ,  Denis Bollea ,  Davide Capello ,  Alberto Pairetti ,  Michele Antonipieri

IPC分类号： H01L33/36

CPC分类号： H01L27/156 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/12041 ,  H01L2924/00014

摘要： Described herein is a transparent device for display of information superimposed on a background, said device comprising a plurality of LED sources, addressable individually or in groups through a series of conductive paths deposited on a transparent underlayer and connected to a control electronics, in which: i) said LED sources are integrated in the form of dice, i.e., of elements obtained by dividing up a semiconductor wafer and without package; and ii) at least one of said conductive paths is with interrupted stretches and replaced by stretches of metal wire, bonded to said paths through a wire-bonding operation.

摘要翻译： 这里描述的是用于显示叠加在背景上的信息的透明装置，所述装置包括多个LED源，可以单独地或通过沉积在透明底层上并连接到控制电子装置的一系列导电路径成组地寻址，其中： i）所述LED源以骰子的形式集成，即通过划分半导体晶片而不包装获得的元件; 以及ii）所述导电路径中的至少一个具有中断的延伸并且被金属线的延伸部分替换，通过引线键合操作结合到所述路径。

公开(公告)号：US20060238327A1

公开(公告)日：2006-10-26

申请号：US11399208

申请日：2006-04-06

申请人： Piermario Repetto ,  Sabino Sinesi ,  Sara Padovani ,  Stefano Bernard ,  Denis Bollea ,  Davide Capello ,  Piero Perlo ,  Alberto Pairetti ,  Michele Antonipieri

发明人： Piermario Repetto ,  Sabino Sinesi ,  Sara Padovani ,  Stefano Bernard ,  Denis Bollea ,  Davide Capello ,  Piero Perlo ,  Alberto Pairetti ,  Michele Antonipieri

IPC分类号： B60Q1/00

CPC分类号： G02B27/01 ,  G02B2027/011 ,  G02B2027/0123 ,  H01L25/0753 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014

摘要： Described herein is a transparent-display device for motor vehicles, to be used for presentation of information to the driver and/or to the passengers, said device comprising a plurality of LED sources, addressable individually or in groups through a series of conductive paths, deposited on a transparent underlayer and connected to a control electronics, in which: i) said LED sources are integrated in the form of dice, i.e., of elements obtained by dividing up a semiconductor wafer and without package; ii) said dice are integrated on, and electrically connected to, said underlayer via technologies of the chip-on-board type; and iii) said transparent underlayer 1 is pre-arranged for being at least in part superimposed on the windscreen of the vehicle, in such a way that at least part of the information presented to the user is superimposed on the background, said background being visible to the user through said windscreen.

摘要翻译： 这里描述的是用于机动车辆的透明显示装置，用于向驾驶员和/或乘客提供信息，所述装置包括多个LED源，可单独地或通过一系列导电路径分组地寻址， 沉积在透明底层上并连接到控制电子器件，其中：i）所述LED源以骰子的形式集成，即通过划分半导体晶片而不包装获得的元件; ii）所述骰子通过板上芯片类型的技术集成在所述底层上并与其电连接; 和iii）所述透明底层1预先布置成至少部分地叠加在车辆的挡风玻璃上，使得呈现给用户的信息的至少一部分叠加在背景上，所述背景是可见的 通过所述挡风玻璃向用户传递。

公开(公告)号：US20060239037A1

公开(公告)日：2006-10-26

申请号：US11398358

申请日：2006-04-05

申请人： Piermario Repetto ,  Sabino Sinesi ,  Sara Padovani ,  Stefano Bernard ,  Denis Bollea ,  Davide Capello ,  Alberto Pairetti ,  Michele Antonipieri

发明人： Piermario Repetto ,  Sabino Sinesi ,  Sara Padovani ,  Stefano Bernard ,  Denis Bollea ,  Davide Capello ,  Alberto Pairetti ,  Michele Antonipieri

IPC分类号： H01L33/00

CPC分类号： F21K9/00 ,  G09F9/33 ,  G09F21/04 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/00014

摘要： A method of fabrication of transparent LED devices, of the type comprising the operations of: i) providing a series of conductive paths on a transparent underlayer; ii) connecting said conductive paths to electronic control means; iii) associating to said underlayer an array of LED sources addressable individually or in groups through said conductive paths, in which i) said LED sources are integrated in the form of chips, i.e., of elements obtained by dividing up a semiconductor wafer and without package, via technologies of the chip-on-board type; ii) said method envisages the use of the flip-chip technique for die bonding, i.e., the electrical connection of the chip to the underlayer.

摘要翻译： 一种制造透明LED器件的方法，包括以下操作：i）在透明底层上提供一系列导电路径; ii）将所述导电路径连接到电子控制装置; iii）将所述LED源的阵列与所述底层相关联，所述阵列的LED源单独地或通过所述导电路径可分组地组合，其中i）所述LED源以芯片的形式集成，即，通过划分半导体晶片而没有封装获得的元件 ，通过板载型技术; ii）所述方法设想使用用于芯片接合的倒装芯片技术，即芯片与底层的电连接。

公开(公告)号：US20060238326A1

公开(公告)日：2006-10-26

申请号：US11397225

申请日：2006-04-04

申请人： Piermario Repetto ,  Sabino Sinesi ,  Sara Padovani ,  Stefano Bernard ,  Denis Bollea ,  Davide Capello ,  Alberto Pairetti ,  Michele Antonipieri

发明人： Piermario Repetto ,  Sabino Sinesi ,  Sara Padovani ,  Stefano Bernard ,  Denis Bollea ,  Davide Capello ,  Alberto Pairetti ,  Michele Antonipieri

IPC分类号： B60Q1/00

CPC分类号： H01L27/156 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/12041 ,  H01L2924/00014

摘要： Described herein is a transparent device for display of information superimposed on a background, said device comprising a plurality of LED sources, addressable individually or in groups through a series of conductive paths deposited on a transparent underlayer and connected to a control electronics, in which: i) said LED sources are integrated in the form of dice, i.e., of elements obtained by dividing up a semiconductor wafer and without package; and ii) at least one of said conductive paths is with interrupted stretches and replaced by stretches of metal wire, bonded to said paths through a wire-bonding operation.

摘要翻译： 这里描述的是用于显示叠加在背景上的信息的透明装置，所述装置包括多个LED源，可以单独地或通过沉积在透明底层上并连接到控制电子装置的一系列导电路径成组地寻址，其中： i）所述LED源以骰子的形式集成，即通过划分半导体晶片而不包装获得的元件; 以及ii）所述导电路径中的至少一个具有中断的延伸并且被金属线的延伸部分替换，通过引线键合操作结合到所述路径。