公开(公告)号：US20120126363A1

公开(公告)日：2012-05-24

申请号：US12952317

申请日：2010-11-23

申请人： Ping-Chuan Wang ,  Chunyan E. Tian ,  Ronald Filippi ,  Wai-ki Li

发明人： Ping-Chuan Wang ,  Chunyan E. Tian ,  Ronald Filippi ,  Wai-ki Li

IPC分类号： H01L23/525

CPC分类号： H01L23/5256 ,  H01L2924/0002 ,  H01L2924/00

摘要： Structures of electronic fuses (e-fuse) are provided. An un-programmed e-fuse includes a via of a first conductive material having a bottom and sidewalls with a portion of the sidewalls being covered by a conductive liner and the bottom of the via being formed on top of a dielectric layer, and a first and a second conductive path of a second conductive material formed on top of the dielectric layer with the first and second conductive paths being conductively connected through, and only through, the via at the sidewalls. A programmed e-fuse includes a via; a first conductive path at a first side of the via and being separated from sidewalls of the via by a void; and a second conductive path at a second different side of the via and being in conductive contact with the via through sidewalls of the via.

摘要翻译： 提供电子保险丝（e-fuse）的结构。 未编程的电子熔断器包括具有底部和侧壁的第一导电材料的通孔，侧壁的一部分被导电衬垫覆盖，并且通孔的底部形成在电介质层的顶部上，并且第一 以及形成在电介质层顶部上的第二导电材料的第二导电路径，其中第一和第二导电路径通过侧壁导通地连接，并且仅通过通孔。 编程的电子熔丝包括通孔; 在通孔的第一侧处的第一导电路径，并且通过空隙与通路的侧壁分离; 以及在所述通孔的第二不同侧的第二导电路径，并且与通孔通过所述通孔的侧壁导电接触。