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    Heat dissipation for integrated circuit
    3.
    发明授权
    Heat dissipation for integrated circuit 有权
    集成电路散热

    公开(公告)号：US08134232B2

    公开(公告)日：2012-03-13

    申请号：US12061728

    申请日：2008-04-03

    申请人： Mitchel E. Lohr ,  Qwai H. Low

    发明人： Mitchel E. Lohr ,  Qwai H. Low

    IPC分类号： H01L23/34

    CPC分类号： H01L23/4334 ,  H01L23/3677 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A packaged integrated circuit having a thermal pathway to exhaust heat from the integrated circuit. The integrated circuit is disposed on a package substrate, with an encapsulant disposed around the integrated circuit. A heat sink is disposed at least partially within the encapsulant, with at least a portion of one surface of the heat sink exposed outside of the encapsulant. The integrated circuit has an uppermost passivation layer, where the passivation layer is not electrically conductive, with a port disposed in the passivation layer. The port extends completely through the passivation layer to expose an underlying layer. A thermal pathway is disposed at least partially within the port, and makes thermal contact to both the underlying layer and the heat sink. The thermal transfer rate of the thermal pathway is greater than the thermal transfer rate either the passivation layer or the encapsulant.

    摘要翻译： 一种具有从该集成电路排出热量的热路径的封装集成电路。 集成电路设置在封装基板上，封装件设置在集成电路周围。 散热器至少部分地设置在密封剂内，散热器的一个表面的至少一部分暴露在密封剂外部。 集成电路具有最上面的钝化层，其中钝化层不导电，其中端口设置在钝化层中。 端口完全延伸穿过钝化层以暴露下层。 热路径至少部分地设置在端口内，并且与下面的层和散热器进行热接触。 热路径的热传递速率大于钝化层或密封剂的热传递速率。

    Test structure for detecting bonding-induced cracks
    5.
    发明授权
    Test structure for detecting bonding-induced cracks 有权
    用于检测接合引起的裂纹的测试结构

    公开(公告)号：US06781150B2

    公开(公告)日：2004-08-24

    申请号：US10229601

    申请日：2002-08-28

    申请人： Qwai H. Low ,  Ramaswamy Ranganathan ,  Anwar Ali ,  Tauman T. Lau

    发明人： Qwai H. Low ,  Ramaswamy Ranganathan ,  Anwar Ali ,  Tauman T. Lau

    IPC分类号： H01L2358

    CPC分类号： H01L24/05 ,  H01L22/34 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/05073 ,  H01L2224/05093 ,  H01L2224/05095 ,  H01L2224/05624 ,  H01L2224/48463 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2224/45099 ,  H01L2924/00

    摘要： An integrated circuit having a crack detection structure. A control structure is formed having interleaved electrically conductive layers and non electrically conductive layers in a vertical orientation. Electrically conductive vias are disposed vertically through all of the non electrically conductive layers, which vias electrically connect all of the electrically conductive layers one to another. A test structure is formed having a bonding pad for probing and bonding, with underlying interleaved electrically conductive layers and non electrically conductive layers disposed in a vertical orientation. At least one of the non electrically conductive layers has no vias formed therein, simulating active circuitry under other bonding pads of the integrated circuit. At least one of the interleaved electrically conductive layers of the control structure extends from within the control structure to within the test structure as a sensing layer. The sensing layer immediately underlies the at least one of the non electrically conductive layers in the test structure that has no vias formed therein. Thus, a crack in the at least one of the non electrically conductive layers in the test structure that has no vias formed therein is detectable as a leakage current between the bonding pad of the test structure and a top most electrically conductive layer of the control structure.

    摘要翻译： 具有裂纹检测结构的集成电路。 形成具有垂直取向的交错导电层和非导电层的控制结构。 导电通孔垂直地设置在所有非导电层上，通孔将所有的导电层彼此电连接。 形成具有用于探测和结合的接合焊盘的测试结构，其中底层交错的导电层和以垂直取向设置的非导电层。 非导电层中的至少一个在其中没有形成通孔，模拟集成电路的其它接合焊盘下的有源电路。 控制结构的交错导电层中的至少一个从控制结构内延伸到作为感测层的测试结构内。 感测层紧邻在其中形成有通孔的测试结构中的非导电层中的至少一个之上。 因此，测试结构中没有形成通孔的非导电层中的至少一个的裂纹可以被检测为在测试结构的焊盘与控制结构的最高导电层之间的漏电流 。

    High power dissipating packages with matched heatspreader heatsink assemblies
    6.
    发明授权
    High power dissipating packages with matched heatspreader heatsink assemblies 失效
    具有匹配散热器散热器组件的大功率消散封装

    公开(公告)号：US5463529A

    公开(公告)日：1995-10-31

    申请号：US317968

    申请日：1994-10-04

    申请人： Chok J. Chia ,  Manian Alagaratnam ,  Qwai H. Low ,  Seng-Sooi Lim

    发明人： Chok J. Chia ,  Manian Alagaratnam ,  Qwai H. Low ,  Seng-Sooi Lim

    IPC分类号： F02F7/00 ,  H01L23/367 ,  H01L23/40 ,  H05K7/20

    CPC分类号： H01L23/40 ,  F02F7/00 ,  H01L23/3675 ,  H01L2924/0002 ,  Y10T29/4913

    摘要： A removable heatsink assembly comprised of a heatsink unit and a heatspreader is provided. The heatsink unit has at least one fin and a coupling collar for radiating heat away from a packaged electronic device. The heatspreader includes a platform attached to an inner collar in thermal contact with the packaged electronic device. The platform has one or more tabs suitable for mating with one or more flanges located on the coupling collar of the heatsink unit. Coupling grooves within the flanges engage the platform of the heatspreader when the flanges are mated with the heatspreader tabs and the heatsink is turned. The heatsink can therefore be quickly and conveniently attached to or removed from the heatspreader. The present invention thus permits a wide variety of different heatsinks to be interchangeably used with a single heatspreader attached to an electronic device package.

    摘要翻译： 提供了由散热器单元和散热器组成的可拆卸的散热器组件。 散热器单元具有至少一个翅片和用于从封装的电子设备辐射热量的联接套环。 散热器包括附接到与封装的电子设备热接触的内部套环的平台。 该平台具有一个或多个适合于与位于散热器单元的联接环上的一个或多个凸缘相配合的凸片。 当凸缘与散热片接头配合并且散热片转动时，凸缘内的耦合凹槽接合散热器的平台。 因此，散热器可以快速方便地附接到散热器或从散热器移除。 因此，本发明允许各种不同的散热器与附接到电子设备封装的单个散热器可互换地使用。

    Bonding pad for low k dielectric
    8.
    发明授权
    Bonding pad for low k dielectric 有权
    低k电介质接合垫

    公开(公告)号：US06798035B1

    公开(公告)日：2004-09-28

    申请号：US10600255

    申请日：2003-06-20

    申请人： Qwai H. Low ,  Ramaswamy Ranganathan ,  Edwin M. Fulcher

    发明人： Qwai H. Low ,  Ramaswamy Ranganathan ,  Edwin M. Fulcher

    IPC分类号： H01L3100

    CPC分类号： H01L24/05 ,  H01L2224/05624 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A bonding pad structure having an electrically conductive capping layer. An electrically conductive first supporting layer is disposed immediately under the electrically conductive capping layer, without any intervening layers between the electrically conductive capping layer and the electrically conductive first supporting layer. The electrically conductive first supporting layer is configured as one of a sheet having no voids and a sheet having slotted voids in a first direction. An electrically conductive second supporting layer is disposed under the electrically conductive first supporting layer. The electrically conductive second supporting layer is configured as one of a sheet having slotted voids in the first direction, a sheet having slotted voids in a second direction, and a sheet having checkerboard voids.

    摘要翻译： 一种具有导电覆盖层的焊盘结构。 导电的第一支撑层设置在导电覆盖层的正下方，在导电覆盖层和导电的第一支撑层之间没有任何中间层。 导电性第一支撑层被构造为没有空隙的片材之一和在第一方向上具有开槽空隙的片材。 导电的第二支撑层设置在导电的第一支撑层之下。 导电性第二支撑层被构造为在第一方向上具有开槽空隙的片材之一，在第二方向上具有开槽空隙的片材和具有棋盘空隙的片材。

    Multiple sized die
    9.
    发明授权
    Multiple sized die 失效
    多尺寸模具

    公开(公告)号：US6040632A

    公开(公告)日：2000-03-21

    申请号：US6784

    申请日：1998-01-14

    申请人： Qwai H. Low ,  Chok J. Chia ,  Seng-Sooi Lim

    发明人： Qwai H. Low ,  Chok J. Chia ,  Seng-Sooi Lim

    IPC分类号： H01L23/485 ,  H01L27/10

    CPC分类号： H01L24/02 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19043

    摘要： A multiple-sized integrated circuit (IC) die and a method of making a multiple-sized IC die includes forming a plurality of IC dies on a semiconductor wafer. Each IC die has multiple rows of bonding pads around its periphery. Adjacent bonding pads on separate rows of each IC die are electrically connected together so that attachment to any one of the connected bond pads yields the same result. A plurality of scribe streets separate each IC die on the wafer, with the scribe street defining the width between each IC die. Rows of bonding pads reside in the scribe street area. Different rows of bonding pads may be selectively removed from the IC die by scribing the wafer so as to include one or more of the rows of bonding pads, thereby allowing one IC die design to have multiple sizes. An IC die separated from the wafer may still be sized smaller as long as there remain at least two rows of bonding pads around the periphery.

    摘要翻译： 多尺寸集成电路（IC）管芯和制造多尺寸IC管芯的方法包括在半导体晶片上形成多个IC管芯。 每个IC芯片周围都有多排接合焊盘。 每个IC管芯的独立行上的相邻接合焊盘电连接在一起，使得连接到任何一个连接的接合焊盘产生相同的结果。 多个划线区将晶片上的每个IC芯片分开，划线条限定每个IC芯片之间的宽度。 焊盘行位于划痕街区域。 可以通过划片晶片来选择性地从IC芯片去除不同行的焊盘，以便包括一行或多行接合焊盘，从而允许一个IC管芯设计具有多个尺寸。 只要在周围保持至少两排接合焊盘，则与晶片分离的IC裸片仍可具有更小的尺寸。

    Method of cooling a packaged electronic device
    10.
    发明授权
    Method of cooling a packaged electronic device 失效
    冷却电子装置的方法

    公开(公告)号：US5568683A

    公开(公告)日：1996-10-29

    申请号：US472320

    申请日：1995-06-07

    申请人： Chok J. Chia ,  Manian Alagaratnam ,  Qwai H. Low ,  Seng-Sooi Lim

    发明人： Chok J. Chia ,  Manian Alagaratnam ,  Qwai H. Low ,  Seng-Sooi Lim

    IPC分类号： F02F7/00 ,  H01L23/367 ,  H01L23/40 ,  H05K3/30

    CPC分类号： H01L23/40 ,  F02F7/00 ,  H01L23/3675 ,  H01L2924/0002 ,  Y10T29/4913

    摘要： A removable heatsink assembly comprised of a heatsink unit and a heatspreader is provided. The heatsink unit has at least one fin and a coupling collar for radiating heat away from a packaged electronic device. The heatspreader includes a platform attached to an inner collar in thermal contact with the packaged electronic device. The platform has one or more tabs suitable for mating with one or more flanges located on the coupling collar of the heatsink unit. Coupling grooves within the flanges engage the platform of the heatspreader when the flanges are mated with the heatspreader tabs and the heatsink is turned. The heatsink can therefore be quickly and conveniently attached to or removed from the heatspreader. The present invention thus permits a wide variety of different heatsinks to be interchangeably used with a single heatspreader attached to an electronic device package.

    摘要翻译： 提供了由散热器单元和散热器组成的可拆卸的散热器组件。 散热器单元具有至少一个翅片和用于从封装的电子设备辐射热量的联接套环。 散热器包括附接到与封装的电子设备热接触的内部套环的平台。 该平台具有一个或多个适合于与位于散热器单元的联接环上的一个或多个凸缘相配合的凸片。 当凸缘与散热片接头配合并且散热片转动时，凸缘内的耦合凹槽接合散热器的平台。 因此，散热器可以快速方便地附接到散热器或从散热器移除。 因此，本发明允许各种不同的散热器与附接到电子设备封装的单个散热器可互换地使用。