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公开(公告)号：US20240022027A1
公开(公告)日：2024-01-18
申请号：US17866926
申请日：2022-07-18
Applicant: Raytheon Company
Inventor： Ian E. Nord , Joseph P. Nipper , Mikel J. White
IPC: H01R13/6588 , H01R13/50 , H01R12/71 , H01R43/20 , H01R43/24
CPC classification number: H01R13/6588 , H01R13/50 , H01R12/716 , H01R43/205 , H01R43/24 , H01R13/6599
Abstract: A connector is provided and includes one or more radio frequency (RF) signal pins, ground pins arranged in a ring-shape around the one or more RF signal pins, a ground pin supporting mold formed about the ground pins and defining a borehole around the one or more RF signal pins and a dielectric mold formed in the borehole about the one or more RF signal pins and about the ground pin supporting mold.
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公开(公告)号：US10896861B2
公开(公告)日：2021-01-19
申请号：US16390659
申请日：2019-04-22
Applicant: Raytheon Company
Inventor： David D. Heston , John G. Heston , Claire E. Mooney , Mikel J. White , Jon Mooney , Tiffany Cassidy
IPC: H05K1/02 , H01L21/48 , H01L21/56 , H01L23/00 , H01L23/46 , H01L23/48 , H01L23/66 , H01L23/367 , H01L23/373 , H01L23/495 , H01L23/498 , H01L23/522 , H01L23/528 , H01L23/535 , H01L23/538 , H01L23/34
Abstract: An HPA MMIC assembly includes a MMIC device coupled to a thermal spreader. A ground plane is provided on the thermal spreader and coupled to FETs in the MMIC device. The multiple levels of metal separated by multiple dielectric layers provide low-loss broad-band microstrip circuits. The thermal spreader may include diamond, an air/wire-edm spreader or a multi-layer board (MLB) with heat sink vias and ground vias.
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公开(公告)号：US11342647B2
公开(公告)日：2022-05-24
申请号：US16695695
申请日：2019-11-26
Applicant: RAYTHEON COMPANY
Inventor： David D. Heston , Mikel J. White , Michael G. Hawkins
Abstract: A free-from radio frequency (RF) media includes a substrate having a first dielectric layer formed thereon and a second dielectric layer on an upper surface of the first dielectric layer. A first conductive layer is formed on an upper surface of the first dielectric layer and has a first overall profile. A second conductive layer having a second overall profile is formed on an upper surface of the second dielectric layer such that the second dielectric layer is interposed between the first and second conductive layers. The first overall profile of the first conductive layer is different from the second overall profile of the second conductive layer.
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公开(公告)号：US20200335413A1
公开(公告)日：2020-10-22
申请号：US16390659
申请日：2019-04-22
Applicant: Raytheon Company
Inventor： David D. Heston , John G. Heston , Claire E. Mooney , Mikel J. White , Jon Mooney , Tiffany Cassidy
IPC: H01L23/34 , H01L23/498 , H01L23/66
Abstract: An HPA MMIC assembly includes a MMIC device coupled to a thermal spreader. A ground plane is provided on the thermal spreader and coupled to FETs in the MMIC device. The multiple levels of metal separated by multiple dielectric layers provide low-loss broad-band microstrip circuits. The thermal spreader may include diamond, an air/wire-edm spreader or a multi-layer board (MLB) with heat sink vias and ground vias.
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公开(公告)号：US20130111738A1
公开(公告)日：2013-05-09
申请号：US13727524
申请日：2012-12-26
Applicant: Raytheon Company
Inventor： Brandon W. Pillans , Francis J. Morris , Mikel J. White
IPC: H01H11/00
CPC classification number: H01H11/00 , H01G5/16 , H01H57/00 , Y10T29/49105
Abstract: Systems and methods for providing high-capacitive RF MEMS switches are provided. In one embodiment, the invention relates to a micro-electro-mechanical switch assembly including a substrate, an electrode disposed on a portion of the substrate, a dielectric layer disposed on at least a portion of the electrode, a metal layer disposed on at least a portion of the dielectric layer, and a flexible membrane having first and second ends supported at spaced locations on the substrate base, where the flexible membrane is configured to move from a default position to an actuated position in response to a preselected switching voltage applied between the flexible membrane and the electrode, and where, in the actuated position, the flexible membrane is in electrical contact with the metal layer.
Abstract translation: 提供了用于提供高电容RF MEMS开关的系统和方法。 在一个实施例中，本发明涉及一种微机电开关组件，其包括衬底，设置在衬底的一部分上的电极，设置在电极的至少一部分上的电介质层，至少设置在金属层上的金属层 所述电介质层的一部分以及柔性膜，所述柔性膜具有第一和第二端部，其支撑在所述基板基底上的间隔位置处，其中所述柔性膜被配置为响应于施加在所述介电层之间的预选开关电压而从默认位置移动到致动位置 柔性膜和电极，并且其中在致动位置中柔性膜与金属层电接触。
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公开(公告)号：US20210159578A1
公开(公告)日：2021-05-27
申请号：US16695695
申请日：2019-11-26
Applicant: RAYTHEON COMPANY
Inventor： David D. Heston , Mikel J. White , Michael G. Hawkins
Abstract: A free-from radio frequency (RF) media includes a substrate having a first dielectric layer formed thereon and a second dielectric layer on an upper surface of the first dielectric layer. A first conductive layer is formed on an upper surface of the first dielectric layer and has a first overall profile. A second conductive layer having a second overall profile is formed on an upper surface of the second dielectric layer such that the second dielectric layer is interposed between the first and second conductive layers. The first overall profile of the first conductive layer is different from the second overall profile of the second conductive layer.
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公开(公告)号：US09716304B2
公开(公告)日：2017-07-25
申请号：US14858836
申请日：2015-09-18
Applicant: RAYTHEON COMPANY
Inventor： Mikel J. White
CPC classification number: H01P5/10 , H01P1/127 , H01P1/15 , H01P1/182 , H01P3/026 , H01P5/12 , H01P5/19
Abstract: A balun includes: a balanced port; an unbalanced port; and a double-y junction portion between the balanced port and the unbalanced port, the double-y junction portion including: a balanced y junction portion having first and second balanced stubs; and an unbalanced y junction portion having first and second unbalanced stubs, wherein at least one of the first balanced stub, the second balanced stub, the first unbalanced stub, and the second unbalanced stub includes a switch.
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公开(公告)号：US20170084978A1
公开(公告)日：2017-03-23
申请号：US14858836
申请日：2015-09-18
Applicant: RAYTHEON COMPANY
Inventor： Mikel J. White
CPC classification number: H01P5/10 , H01P1/127 , H01P1/15 , H01P1/182 , H01P3/026 , H01P5/12 , H01P5/19
Abstract: A balun includes: a balanced port; an unbalanced port; and a double-y junction portion between the balanced port and the unbalanced port, the double-y junction portion including: a balanced y junction portion having first and second balanced stubs; and an unbalanced y junction portion having first and second unbalanced stubs, wherein at least one of the first balanced stub, the second balanced stub, the first unbalanced stub, and the second unbalanced stub includes a switch.
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公开(公告)号：US09373460B2
公开(公告)日：2016-06-21
申请号：US13727524
申请日：2012-12-26
Applicant: Raytheon Company
Inventor： Brandon W. Pillans , Francis J. Morris , Mikel J. White
CPC classification number: H01H11/00 , H01G5/16 , H01H57/00 , Y10T29/49105
Abstract: Systems and methods for providing high-capacitive RF MEMS switches are provided. In one embodiment, the invention relates to a micro-electro-mechanical switch assembly including a substrate, an electrode disposed on a portion of the substrate, a dielectric layer disposed on at least a portion of the electrode, a metal layer disposed on at least a portion of the dielectric layer, and a flexible membrane having first and second ends supported at spaced locations on the substrate base, where the flexible membrane is configured to move from a default position to an actuated position in response to a preselected switching voltage applied between the flexible membrane and the electrode, and where, in the actuated position, the flexible membrane is in electrical contact with the metal layer.
Abstract translation: 提供了用于提供高电容RF MEMS开关的系统和方法。 在一个实施例中，本发明涉及一种微机电开关组件，其包括衬底，设置在衬底的一部分上的电极，设置在电极的至少一部分上的电介质层，至少设置在金属层上的金属层 所述电介质层的一部分以及柔性膜，所述柔性膜具有第一和第二端部，其支撑在所述基板基底上的间隔位置处，其中所述柔性膜被配置为响应于施加在所述介电层之间的预选开关电压而从默认位置移动到致动位置 柔性膜和电极，并且其中在致动位置中柔性膜与金属层电接触。
