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公开(公告)号：US12087896B2
公开(公告)日：2024-09-10
申请号：US18056034
申请日：2022-11-16
Applicant: ROHM CO., LTD.
Inventor： Tomoichiro Toyama
CPC classification number: H01L33/62 , H01L24/45 , H01L33/486 , H01L33/56
Abstract: Semiconductor light-emitting device, includes: substrate having base and conductive part; first to third semiconductor light-emitting elements; first to third wires connected to the first to third semiconductor light-emitting elements respectively; and light-transmitting resin part covering the first to the third semiconductor light-emitting elements, wherein the base has main and rear surfaces facing opposite sides in thickness direction of the base, wherein the conductive part includes main surface part on the main surface, wherein the main surface part includes main surface first part where the first and second semiconductor light-emitting elements are mounted, wherein the main surface first part reaches both ends of the main surface in first direction perpendicular to the thickness direction, and wherein the main surface first part is separated from both the main surface part where the third semiconductor light-emitting element is mounted and the main surface part where the first, second, and third wires are connected.
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公开(公告)号：USD990439S1
公开(公告)日：2023-06-27
申请号：US29807405
申请日：2021-09-10
Applicant: ROHM CO., LTD.
Designer： Masahiro Nakatani , Tomoichiro Toyama
Abstract: FIG. 1 is a front, top and right side perspective view of a semiconductor module showing our new design;
FIG. 2 is a rear, bottom and left side perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a right side view thereof; the left side view being a mirror image of FIG. 7.
The broken lines illustrate portions of the semiconductor module that form no part of the claimed design. The dash-dotted lines in FIGS. 1, 2 and 7 denote the boundary of the claim and form no part of the claimed design.-
公开(公告)号：US10468557B2
公开(公告)日：2019-11-05
申请号：US15498786
申请日：2017-04-27
Applicant: ROHM CO., LTD.
Inventor： Tomoichiro Toyama , Masahiko Kobayakawa
Abstract: A light-emitting apparatus includes a light-emitting, a first lead, a second lead, and a resin molded body configured to support the first lead and the second lead. The main surfaces of the first and second leads includes first and second coverage areas covered by the resin molded body and first and second exposure regions exposed from the resin molded body at a window portion of the resin molded body, respectively. First and second metal layers are provided to cover main surfaces of the first and second leads at first and second exposure regions, respectively.
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公开(公告)号：US09276187B2
公开(公告)日：2016-03-01
申请号：US14695915
申请日：2015-04-24
Applicant: ROHM CO., LTD.
Inventor： Tomoichiro Toyama
IPC: H01L33/00 , H01L33/64 , H01L33/48 , H01L33/60 , H01L33/08 , H01L33/56 , H01L27/15 , H01L33/50 , H01L33/52 , H01L25/075 , H01L25/16 , H01L33/62
CPC classification number: H01L25/0753 , H01L25/167 , H01L27/15 , H01L33/08 , H01L33/486 , H01L33/507 , H01L33/52 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/647 , H01L2224/48465
Abstract: A semiconductor light emitting device includes an LED chip, which includes an n-type semiconductor layer, active layer, and p-type semiconductor layer stacked on a substrate. The LED chip further includes an anode electrode connected to the p-type semiconductor, and a cathode connected to the n-type semiconductor. The anode and cathode electrodes face a case with the LED chip mounted thereon. The case includes a base member including front and rear surfaces, and wirings including a front surface layer having anode and cathode pads formed at the front surface, a rear surface layer having anode and cathode mounting electrodes formed at the rear surface, an anode through wiring connecting the anode pad and the anode mounting electrode and passing through a portion of the base member, and a cathode through wirings connecting the cathode pad and the cathode mounting electrode and passing through a portion of the base member.
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公开(公告)号：US11699846B2
公开(公告)日：2023-07-11
申请号：US17644225
申请日：2021-12-14
Applicant: ROHM CO., LTD.
Inventor： Toshikazu Mukai , Jaeyoung Kim , Tomoichiro Toyama
CPC classification number: H01Q1/38 , H01L23/66 , H01L24/48 , H01L27/0676 , H01L29/882 , H01L2223/6672 , H01L2223/6677 , H01L2224/48225 , H01Q9/16
Abstract: A terahertz element of an aspect of the present disclosure includes a semiconductor substrate, first and second conductive layers, and an active element. The first and second conductive layers are on the substrate and mutually insulated. The active element is on the substrate and electrically connected to the first and second conductive layers. The first conductive layer includes a first antenna part extending along a first direction, a first capacitor part offset from the active element in a second direction as viewed in a thickness direction of the substrate, and a first conductive part connected to the first capacitor part. The second direction is perpendicular to the thickness direction and first direction. The second conductive layer includes a second capacitor part, stacked over and insulated from the first capacitor part. The substrate includes a part exposed from the first and second capacitor parts. The first conductive part has a portion spaced apart from the first antenna part in the second direction with the exposed part therebetween as viewed in the thickness direction.
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Patent Agency Ranking
公开(公告)号：US11239401B2
公开(公告)日：2022-02-01
申请号：US16933756
申请日：2020-07-20
Applicant: ROHM CO., LTD.
Inventor： Tomoichiro Toyama , Hideaki Anzai , Kenya Hashimoto , Ryo Yatagai
Abstract: A semiconductor light-emitting device includes a substrate having a base, a conductive layer and an insulating layer, a semiconductor light-emitting element and a resin member. The base has a pair of base first side surfaces and a pair of base third side surfaces. The conductive layer includes a front-surface segment and a side-surface segment. The front surface segment includes a front-surface first part. The insulating layer includes an insulating-layer first part and an insulating-layer second part. The resin member covers the insulating-layer first part and the insulating-layer second part of the insulating layer. A first thickness of the insulating-layer first part is greater than a second thickness of the insulating-layer second part.
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公开(公告)号：US10319887B2
公开(公告)日：2019-06-11
申请号：US15643136
申请日：2017-07-06
Applicant: ROHM CO., LTD.
Inventor： Masahiko Kobayakawa , Tomoichiro Toyama
Abstract: A semiconductor light-emitting device includes a base, a light-emitting element and a sealing resin. The base includes an obverse surface and a reverse surface spaced in a first direction, first side surfaces spaced in a second direction crossing the first direction, and second side surfaces spaced in a third direction crossing the first and second directions. The light-emitting element is on the base obverse surface. The sealing resin for covering the light-emitting element is smaller than the base in plan. The base has a wiring pattern connected to the light-emitting element and including an obverse surface electrode on the base obverse surface. The base also has a resist layer including a pattern-covering portion overlapping with the obverse surface electrode. The pattern-covering portion includes a resin outflow preventing portion, disposed outside the sealing resin in plan and extends continuously from one second side surface to the other.
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公开(公告)号：US20140042471A1
公开(公告)日：2014-02-13
申请号：US13752569
申请日：2013-01-29
Applicant: ROHM CO., LTD.
Inventor： Tomoichiro Toyama , Masahiko Kobayakawa
CPC classification number: H01L33/56 , H01L24/97 , H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/45144 , H01L2224/48247 , H01L2224/49107 , H01L2224/73265 , H01L2924/12035 , H01L2924/12041 , H01L2924/15747 , H01L2924/181 , H01L2933/0033 , H01L2933/0066 , H01L2924/00
Abstract: A light-emitting apparatus includes a light-emitting, a first lead, a second lead, and a resin molded body configured to support the first lead and the second lead. The main surfaces of the first and second leads includes first and second coverage areas covered by the resin molded body and first and second exposure regions exposed from the resin molded body at a window portion of the resin molded body, respectively. First and second metal layers are provided to cover main surfaces of the first and second leads at first and second exposure regions, respectively.
Abstract translation: 发光装置包括发光元件，第一引线，第二引线和构造成支撑第一引线和第二引线的树脂成型体。 第一引线和第二引线的主表面分别包括由树脂成型体覆盖的第一和第二覆盖区域以及在树脂模制体的窗口部分处从树脂模制体露出的第一和第二暴露区域。 第一和第二金属层设置成分别在第一和第二曝光区域覆盖第一和第二引线的主表面。
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公开(公告)号：USD992519S1
公开(公告)日：2023-07-18
申请号：US29807404
申请日：2021-09-10
Applicant: ROHM CO., LTD.
Designer： Masahiro Nakatani , Tomoichiro Toyama
Abstract: FIG. 1 is a front, top and right side perspective view of a semiconductor module showing our new design;
FIG. 2 is a rear, bottom and left side perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a right side view thereof; the left side view being a mirror image of FIG. 7.
The broken lines illustrate portions of the semiconductor module that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design.-
公开(公告)号：US11532776B2
公开(公告)日：2022-12-20
申请号：US17161374
申请日：2021-01-28
Applicant: ROHM CO., LTD.
Inventor： Tomoichiro Toyama
Abstract: Semiconductor light-emitting device, includes: substrate having base and conductive part; first to third semiconductor light-emitting elements; first to third wires connected to the first to third semiconductor light-emitting elements respectively; and light-transmitting resin part covering the first to the third semiconductor light-emitting elements, wherein the base has main and rear surfaces facing opposite sides in thickness direction of the base, wherein the conductive part includes main surface part on the main surface, wherein the main surface part includes main surface first part where the first and second semiconductor light-emitting elements are mounted, wherein the main surface first part reaches both ends of the main surface in first direction perpendicular to the thickness direction, and wherein the main surface first part is separated from both the main surface part where the third semiconductor light-emitting element is mounted and the main surface part where the first, second, and third wires are connected.
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