SINGLE JUNCTION TYPE CIGS THIN FILM SOLAR CELL AND METHOD FOR MANUFACTURING THE THIN FILM SOLAR CELL
    3.
    发明申请
    SINGLE JUNCTION TYPE CIGS THIN FILM SOLAR CELL AND METHOD FOR MANUFACTURING THE THIN FILM SOLAR CELL 失效
    单连接型薄膜薄膜太阳能电池及制造薄膜太阳能电池的方法

    公开(公告)号:US20120103418A1

    公开(公告)日:2012-05-03

    申请号:US13207825

    申请日:2011-08-11

    IPC分类号: H01L31/0216 H01L31/18

    摘要: Provided is a single junction type CIGS thin film solar cell, which includes a CIGS light absorption layer manufactured using a single junction. The single junction type CIGS thin film solar cell includes a substrate, a back contact deposited on the substrate, a light absorption layer deposited on the back contact and including a P type CIGS layer and an N type CIGS layer coupled to the P type CIGS layer using a single junction, and a reflection prevention film deposited on the light absorption layer.

    摘要翻译: 提供了一种单结型CIGS薄膜太阳能电池,其包括使用单一结制造的CIGS光吸收层。 单结型CIGS薄膜太阳能电池包括基板,沉积在基板上的背面接触层,沉积在背面接触上的光吸收层,包括P型CIGS层和耦合到P型CIGS层的N型CIGS层 使用单结,以及沉积在光吸收层上的防反射膜。

    Diazadiene-based metal compound, method for preparing same and method for forming a thin film using same
    5.
    发明授权
    Diazadiene-based metal compound, method for preparing same and method for forming a thin film using same 有权
    二亚乙基基金属化合物,其制备方法以及使用其形成薄膜的方法

    公开(公告)号:US09353437B2

    公开(公告)日:2016-05-31

    申请号:US13885740

    申请日:2011-11-17

    申请人: Won Seok Han

    发明人: Won Seok Han

    摘要: The present invention relates to a diazadiene (DAD)-based metal compound, to a method for preparing the same and to a method for forming a thin film using the same. The diazadiene (DAD)-based metal compound of the present invention is provided in a gaseous state to be formed into a metal thin film or a metal oxide thin film by chemical vapor deposition or atomic layer deposition. Particularly, the diazadiene-based organic metal compound of the present invention has advantages in that it may be formed into a metal thin film or a metal oxide thin film and it can be prepared in a relatively inexpensive way without using highly toxic ligands.

    摘要翻译: 本发明涉及基于二亚甲基二(DAD)的金属化合物及其制备方法以及使用其制备薄膜的方法。 本发明的二氮二烯(DAD)类金属化合物以气态提供,通过化学气相沉积或原子层沉积形成金属薄膜或金属氧化物薄膜。 特别地,本发明的二硫化二烯类有机金属化合物具有以下优点:其可以形成为金属薄膜或金属氧化物薄膜,并且可以以相对便宜的方式制备而不使用高毒性配体。

    Method of etching for multi-layered structure of semiconductors in groups III-V and method for manufacturing vertical cavity surface emitting laser device
    6.
    发明申请
    Method of etching for multi-layered structure of semiconductors in groups III-V and method for manufacturing vertical cavity surface emitting laser device 有权
    III-V族半导体多层结构蚀刻方法及垂直腔表面发射激光器件制造方法

    公开(公告)号:US20070134926A1

    公开(公告)日:2007-06-14

    申请号:US11635223

    申请日:2006-12-07

    IPC分类号: H01L21/302

    摘要: Provided are an etching method for a multi-layered structure of semiconductors in groups III-V and a method of manufacturing a VCSEL using the etching method. According to the etching method, a stacked structure including a first semiconductor layer and a second semiconductor layer is exposed to a plasma of a mixture consisting of Cl2, Ar, CH4, and H2 to etch the stacked structure, so that a mirror layer of the VCSEL is formed. The first semiconductor layer is formed of a semiconductor in groups III-V and the second semiconductor layer is formed of a semiconductor in groups III-V, other than the semiconductor of the first semiconductor layer. At least part of a lower mirror layer, a lower electrode layer, an optical gain layer, an upper electrode layer, and an upper mirror layer is etched using one time of an etching process, so that a clean and smooth etched surface is obtained.

    摘要翻译: 提供了III-V族半导体的多层结构的蚀刻方法和使用该蚀刻方法制造VCSEL的方法。 根据蚀刻方法,将包括第一半导体层和第二半导体层的堆叠结构暴露于由Cl 2,Ar,CH 4, 和H 2 N以蚀刻堆叠结构,从而形成VCSEL的镜层。 第一半导体层由III-V族的半导体形成,第二半导体层由除了第一半导体层的半导体之外的III-V族的半导体形成。 使用一次蚀刻工艺蚀刻下镜面层,下电极层,光增益层,上电极层和上镜层的至少一部分,从而获得清洁且光滑的蚀刻表面。

    Method of fabricating long wavelength vertical-cavity surface-emitting lasers
    7.
    发明授权
    Method of fabricating long wavelength vertical-cavity surface-emitting lasers 失效
    制造长波长垂直腔表面发射激光器的方法

    公开(公告)号:US06727109B2

    公开(公告)日:2004-04-27

    申请号:US10210668

    申请日:2002-07-31

    IPC分类号: H01L2100

    摘要: The present invention relates to a method of fabricating vertical-cavity surface emitting lasers being watched as a light source for long wavelength communication. The present invention includes forming a layer having a high resistance near the surface by implanting heavy ions such as silicon (Si), so that the minimum current injection diameter is made very smaller unlike implantation of a proton. Further, the present invention includes regrowing crystal so that current can flow the epi surface in parallel to significantly reduce the resistance up to the current injection part formed by silicon (Si) ions. Therefore, the present invention can not only effectively reduce the current injection diameter but also significantly reduce the resistance of a device to reduce generation of a heat. Further, the present invention can further improve dispersion of a heat using InP upon regrowth and thus improve the entire performance of the device.

    摘要翻译: 本发明涉及一种垂直腔表面发射激光器的制造方法,该激光器被视为用于长波长通信的光源。 本发明包括通过注入诸如硅(Si)的重离子在表面附近形成具有高电阻的层,使得最小电流注入直径不像植入质子那样非常小。 此外,本发明包括再生晶体,使得电流可以平行地流动外延表面,以显着降低直到由硅(Si)离子形成的电流注入部分的电阻。 因此,本发明不仅可以有效地降低电流注入直径,而且可以显着降低器件的电阻以减少发热。 此外,本发明可以进一步改善在再生后使用InP的散热分散,从而提高装置的整体性能。

    Method for fabricating semiconductor optical device
    9.
    发明授权
    Method for fabricating semiconductor optical device 有权
    制造半导体光学器件的方法

    公开(公告)号:US06989312B2

    公开(公告)日:2006-01-24

    申请号:US10800680

    申请日:2004-03-16

    IPC分类号: H01L21/20

    摘要: Provided is a method for fabricating a semiconductor optical device that can be used as a reflecting semiconductor mirror or an optical filter, in which two or more types of semiconductor layers having different etch rates are alternately stacked, at least one type of semiconductor layers is selectively etched to form an air-gap structure, and an oxide or a nitride having a good heat transfer property is deposited so that the air gap is buried, whereby it is possible to effectively implement the semiconductor reflector or the optical filter having a high reflectance in a small period because of the large index contrast between the oxide or the nitride buried in the air gap and the semiconductor layer.

    摘要翻译: 提供一种制造半导体光学器件的方法,该半导体光学器件可以用作反射半导体镜或光学滤波器,其中具有不同蚀刻速率的两种或更多种类型的半导体层被交替堆叠,至少一种类型的半导体层是选择性的 蚀刻以形成气隙结构,并且沉积具有良好传热特性的氧化物或氮化物,从而使气隙被埋入,由此可以有效地实现具有高反射率的半导体反射器或滤光器 这是由于在空气间隙和半导体层中埋入的氧化物或氮化物之间的大的折射率造成的对比度小的周期。

    Hybrid metal bonded vertical cavity surface emitting laser and fabricating method thereof
    10.
    发明申请
    Hybrid metal bonded vertical cavity surface emitting laser and fabricating method thereof 审中-公开
    混合金属结合垂直腔表面发射激光器及其制造方法

    公开(公告)号:US20060126694A1

    公开(公告)日:2006-06-15

    申请号:US11179954

    申请日:2005-07-12

    IPC分类号: H01S5/00

    摘要: Provided is a method of fabricating a vertical cavity surface emitting laser among semiconductor optical devices, comprising: bonding a dielectric mirror layer to an epi-structure having a mirror layer and an active layer; bonding these on a new substrate using a metal bonded method; removing the existing substrate; and fabricating a vertical cavity surface emitting laser on the new substrate. The method of fabricating the vertical cavity surface emitting laser is performed by moving and attaching a vertical cavity surface emitting laser to a new substrate using an external metallic bonding method, without electrically and optically affecting upper and lower mirrors and an active layer that constitutes the vertical cavity surface emitting laser. While using the existing method of fabricating the vertical cavity surface emitting laser, the VCSEL is fabricated by moving to a new substrate having good thermal characteristics so that good heat emission characteristics are accomplished, thus facilitating manufacture of the vertical cavity surface emitting laser having high reliability and good characteristics.

    摘要翻译: 提供了一种在半导体光学器件中制造垂直腔表面发射激光器的方法,包括:将介质镜层结合到具有镜层和有源层的外延结构; 使用金属键合方法将它们结合在新的基板上; 去除现有的基板; 并在新基板上制造垂直腔表面发射激光器。 垂直腔表面发射激光器的制造方法是通过使用外部金属接合方法将垂直空腔表面发射激光器移动并附着到新的衬底而进行的,而不会电和影响上镜和下反射镜以及构成垂直腔的表面发射激光的有源层 腔表面发射激光。 在使用制造垂直腔表面发射激光器的现有方法的同时,通过移动到具有良好热特性的新衬底来制造VCSEL,从而实现良好的发热特性,从而有助于制造具有高可靠性的垂直腔表面发射激光器 和良好的特点。