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1.发明授权Minimizing flux residue by controlling amount of moisture during reflow 有权通过控制回流期间的水分量来最大限度地减少助焊剂残留量公开(公告)号：US06409070B1
公开(公告)日：2002-06-25
申请号：US09663939
申请日：2000-09-18
IPC分类号： B23K3102
CPC分类号： B23K1/203 , B23K2101/40 , H01L2224/16225 , H01L2224/73204 , H05K3/3436 , H05K3/3489
摘要： A method of manufacturing a flip-chip semiconductor device by attaching a semiconductor die to a substrate using solder comprises the steps of applying a no-clean flux to the semiconductor die and the substrate; heating the solder and the flux in a furnace to bond the semiconductor die to the substrate; and underfilling between the semiconductor die and the substrate. While the solder and flux is being heated, a reducing atmosphere in the furnace is being measured to determine the moisture content. When the moisture content exceeds a threshold amount, a signal will be provided. A reflow furnace for practicing the method is also disclosed.
摘要翻译： 通过使用焊料将半导体管芯附着到衬底来制造倒装芯片半导体器件的方法包括以下步骤：向半导体管芯和衬底施加免清洗助焊剂; 在炉中加热焊料和焊剂以将半导体管芯粘合到衬底上; 并且在半导体管芯和衬底之间的底部填充。 当焊料和焊剂被加热时，测量炉中的还原气氛以确定含水量。 当水分含量超过阈值时，将提供信号。 还公开了用于实施该方法的回流炉。
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2.发明授权公开(公告)号：US06722553B2
公开(公告)日：2004-04-20
申请号：US09922936
申请日：2001-08-07
IPC分类号： B23K1308
CPC分类号： H05K3/3489 , B23K1/203 , B23K2101/36 , H05K3/3436
摘要： A method and apparatus are provided for controllably dispensing flux on a substrate having a plurality of conductive terminals. Flux having a viscosity range between 10 centipoises and about 150 centipoises is sprayed on the substrate and the conductive terminals at a valve pressure range between about 1.5 psi and about 30 psi via a dispense nozzle of a flux dispenser. Upon a subsequent high temperature solder reflow process, the sprayed flux on the substrate is mostly removed by thermal decomposition to volatile species, thereby significantly reducing flux residue remaining on the surface of the substrate between the conductive terminals.
摘要翻译： 提供了一种方法和装置，用于在具有多个导电端子的基板上可控地分配通量。 具有10厘泊和约150厘泊之间的粘度范围的助焊剂通过焊剂分配器的分配喷嘴在约1.5psi至约30psi之间的阀压力范围内喷射到衬底和导电端子上。 在随后的高温焊料回流工艺中，基板上的喷涂焊剂主要通过热分解除去到挥发性物质，从而显着减少在导电端子之间残留在基板表面上的焊剂残余物。
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公开(公告)号：US06617195B1
公开(公告)日：2003-09-09
申请号：US09624491
申请日：2000-07-24
IPC分类号： H01L2144
CPC分类号： H01L24/81 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01076 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H05K3/3494
摘要： A method of manufacturing a semiconductor device by attaching a flip chip die to an organic substrate using solder comprises applying no-clean flux to the flip chip die or the organic substrate; heating the flip chip die and the organic substrate to bond the flip chip die to the organic substrate, and cooling the flip chip die and the organic substrate. The step of heating the flux includes controlling oxygen and moisture content of an atmosphere surrounding the flux, preheating to a temperature of about 145° C. to about 165° C., soaking at a temperature of about 145° C. to about 165° C. for about four to about six minutes, and reflowing above the solder's melting point.
摘要翻译： 通过使用焊料将倒装芯片裸片附着到有机基板来制造半导体器件的方法包括向倒装芯片或有机基板施加免清洗助焊剂; 加热倒装晶片管芯和有机衬底以将倒装晶片管芯结合到有机衬底上，并冷却倒装晶片管芯和有机衬底。 加热焊剂的步骤包括控制焊剂周围的气氛中的氧气和水分含量，预热至约145℃至约165℃的温度，在约145℃至约165℃的温度下浸泡 C.约4至6分钟，并回流焊料熔点以上。
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4.发明授权Automated brush fluxing system for application of controlled amount of flux to packages 失效自动刷式助熔系统，用于将包含控制量的助焊剂应用于包装
公开(公告)号：US6098867A
公开(公告)日：2000-08-08
申请号：US40511
申请日：1998-03-17
CPC分类号： H01L21/4864
摘要： An automated method of applying flux to substrate on which a semiconductor chip is to be assembled in a flip chip configuration by applying a controlled amount of flux to the substrate by a brush that applies the flux to the substrate in a programmed pattern of strokes thereby overcoming the surface tension of the flux/substrate surface. The programmed pattern of brush strokes is determined empirically for the specific combination of substrate and chip that is being assembled and is thus repeatable and operator independent. The empirically determined program also determines the amount of flux that will be applied to the substrate for the specific combination of substrate and chip being assembled. The empirically determined program is applied to a mechanical stage that moves the brush and to a flux reservoir by a CPU.
摘要翻译： 一种自动化方法，其通过将刷子施加受控量的通量施加到衬底上，以编程的行程模式将焊剂施加到衬底上，从而将焊剂施加到以半导体芯片组装的半导体芯片组装的衬底上，从而克服 助焊剂/基材表面的表面张力。 根据经验来确定编程的画笔笔画样式，用于正在组装的衬底和芯片的特定组合，并因此可重复且与操作者无关。 经验确定的程序还确定将被组装的衬底和芯片的特定组合将施加到衬底的通量的量。 经验确定的程序应用于通过CPU移动刷子和通量储存器的机械平台。
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公开(公告)号：US06488158B1
公开(公告)日：2002-12-03
申请号：US09659826
申请日：2000-09-11
申请人： Mohammad Khan , Raj N. Master , Maria G. Guardado , Loo L. Teoh , Ahmad Juwanda
发明人： Mohammad Khan , Raj N. Master , Maria G. Guardado , Loo L. Teoh , Ahmad Juwanda
IPC分类号： A47G1908
CPC分类号： H01L21/67333 , H01L21/67336 , H01L21/6835 , H01L2221/68313
摘要： A boat is formed with a plurality of through-holes sized to securely maintain ceramic or organic flip chip semiconductor packages in place during assembly. Embodiments comprises a boat having a bottom layer with an array of four-sided through-holes and a top layer with an array of through-holes and tabs extending from the sides of the through-hole. Embodiments further include a boat having a bottom layer with through-holes smaller than substantially aligned overlying through-holes in the top layer, the substantially aligned through-holes forming flip chip package holding pockets. An alignment mechanism ensures that components are accurately positioned on flip chip packages held in the boat during assembly.
摘要翻译： 船形成有多个通孔，其尺寸设计成在组装期间可靠地将陶瓷或有机倒装芯片半导体封装保持在适当的位置。 实施例包括具有具有四面通孔阵列的底层和具有从通孔侧面延伸的通孔阵列的顶层的船。 实施例还包括具有底层的船，该底层具有通孔小于顶层中的基本上对准的覆盖通孔，基本对准的通孔形成倒装芯片封装保持袋。 对准机构确保组件准确地定位在组装期间保持在船中的倒装芯片封装上。
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6.发明授权公开(公告)号：US06671450B2
公开(公告)日：2003-12-30
申请号：US09887367
申请日：2001-06-21
IPC分类号： G02B600
CPC分类号： G02B6/4248
摘要： Apparatus and methods to metallize, reinforce, and hermetically seal multiple optical fibers are described herein. A ribbon of optical fibers may be placed into a fixture to expose a mid-span segment for removal of the coatings from the optical fibers by acid etching, laser, etc. A variety of metallic coatings may then be deposited onto the bare segment of the optical fibers. The metallized segment of optical fibers are then deposited with solderable alloy onto a plate for attachment to the plate for reinforcement of the metallized segment. The plate and metallized segment is then fed through a package opening and hermetically sealed to internally connect one or more components inside the package by heating the package to melt additional solder around the opening or gap. Epoxy is then applied over the solder to help protect the solder and additionally seal the package.
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