公开(公告)号：US06382500B1

公开(公告)日：2002-05-07

申请号：US09642835

申请日：2000-08-22

申请人： Raj N. Master ,  Mohammad Zubair Khan ,  Maria Guardado ,  Sp Lee ,  Sofi Mohd

发明人： Raj N. Master ,  Mohammad Zubair Khan ,  Maria Guardado ,  Sp Lee ,  Sofi Mohd

IPC分类号： B23K100

CPC分类号： B23K1/203 ,  B23K1/0016 ,  B23K1/008 ,  B23K2101/40

摘要： When soldering semiconductor devices in a solder reflow furnace flux is vaporized and carried to the furnace exhaust pipe. The flux condenses on the walls of the exhaust pipe and drips back into the furnace contaminating production parts. A solder reflow furnace with a flux effluent collector prevents flux drip-back. The flux effluent collector has an exhaust gas heater that maintains flux effluent in a gaseous state, a flux cooler, to subsequently condense flux, and a flux condensation region where the flux condenses. The flux condensation region is offset from the furnace's exhaust opening so that condensed flux cannot drip back into the furnace.

摘要翻译： 当在焊料回流炉中焊接半导体器件时，助熔剂被蒸发并运送到炉排气管。 助焊剂在排气管的壁上冷凝并滴入炉中，污染生产部件。 具有助焊剂流出物收集器的焊料回流炉防止焊剂滴落。 助焊剂流出物收集器具有一个废气加热器，其保持处于气态的助熔剂流出物，助熔剂冷却器，随后冷凝助熔剂，以及通量冷凝的助熔剂冷凝区域。 助熔剂冷凝区域与炉的排气口偏离，使得冷凝的通量不能滴入炉中。