公开(公告)号：US5988485A

公开(公告)日：1999-11-23

申请号：US40651

申请日：1998-03-17

申请人： Raj N. Master ,  Orion K. Starr ,  Mohammad Z. Khan

发明人： Raj N. Master ,  Orion K. Starr ,  Mohammad Z. Khan

IPC分类号： H01L21/60 ,  H01L21/48 ,  B23K1/018

CPC分类号： H01L21/4864 ,  H01L2224/83192 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701

摘要： A method of assembling a substrate and die in a flip chip configuration uses a non-hazardous cleaning solvent to clean the flux residue. The non-hazardous cleaning solvent utilized is Ionox obtained from Kyzen Corporation. Optimized process parameters are: time 10-30 minutes, temperature 70-90.degree. C., pressure 40-70 psi, rotation speed and reversals 100-1000 rpm and 24-100 reversal cycles.

摘要翻译： 以倒装芯片配置组装衬底和管芯的方法使用非危险清洁溶剂来清洁焊剂残留物。 使用的非危险清洗溶剂是从Kyzen Corporation获得的Ionox。 优化的工艺参数为：时间10-30分钟，温度70-90℃，压力40-70psi，转速和反转100-1000转和24-100反转循环。

公开(公告)号：US6103549A

公开(公告)日：2000-08-15

申请号：US40643

申请日：1998-03-17

申请人： Raj N. Master ,  Orion K. Starr ,  Maria Guardado ,  Mohammad Zubair Khan

发明人： Raj N. Master ,  Orion K. Starr ,  Maria Guardado ,  Mohammad Zubair Khan

IPC分类号： H05K3/34 ,  H01L21/56 ,  H01L21/60 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/563 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/351

摘要： A method of assembling a substrate and die in a flip chip configuration using a no clean flux. The no clean fluxes have sufficient chemical activity to activate solder bumps contacting bond pads to form reliable solder joints, sufficient tackiness to hold the substrate and die in alignment with the solder bumps contacting the bond pads, and a viscosity to enable a high volume manufacturing process to be used. The no clean fluxes leave a minimal amount of residue during a reflow process that does not interfere with an underfill operation and does not adversely affect the solder joints. The no clean fluxes that can be used for this application are RM1919 from Alpha Metals, Co. and H208 from Indium Company.

摘要翻译： 使用无清洁焊剂以倒装芯片配置组装衬底和管芯的方法。 不干净的焊剂具有足够的化学活性以激活焊料凸点接触焊盘以形成可靠的焊接接头，足够的粘性以保持衬底和管芯与接触焊盘接触的焊料凸块对齐，并且具有使得能够进行大量制造工艺的粘度 要使用的。 不干净的焊剂在回流过程中留下最少量的残留物，其不会妨碍底部填充操作，并且不会不利地影响焊点。 可用于本应用的无清洁助焊剂来自Alpha Metals，Co.的RM1919和Indium Company的H208。

公开(公告)号：US06409070B1

公开(公告)日：2002-06-25

申请号：US09663939

申请日：2000-09-18

申请人： Raj N. Master ,  Mohammad Z. Khan ,  Maria G. Guardado ,  Diong Hing Ding ,  Junaida Abu Bakar

发明人： Raj N. Master ,  Mohammad Z. Khan ,  Maria G. Guardado ,  Diong Hing Ding ,  Junaida Abu Bakar

IPC分类号： B23K3102

CPC分类号： B23K1/203 ,  B23K2101/40 ,  H01L2224/16225 ,  H01L2224/73204 ,  H05K3/3436 ,  H05K3/3489

摘要： A method of manufacturing a flip-chip semiconductor device by attaching a semiconductor die to a substrate using solder comprises the steps of applying a no-clean flux to the semiconductor die and the substrate; heating the solder and the flux in a furnace to bond the semiconductor die to the substrate; and underfilling between the semiconductor die and the substrate. While the solder and flux is being heated, a reducing atmosphere in the furnace is being measured to determine the moisture content. When the moisture content exceeds a threshold amount, a signal will be provided. A reflow furnace for practicing the method is also disclosed.

摘要翻译： 通过使用焊料将半导体管芯附着到衬底来制造倒装芯片半导体器件的方法包括以下步骤：向半导体管芯和衬底施加免清洗助焊剂; 在炉中加热焊料和焊剂以将半导体管芯粘合到衬底上; 并且在半导体管芯和衬底之间的底部填充。 当焊料和焊剂被加热时，测量炉中的还原气氛以确定含水量。 当水分含量超过阈值时，将提供信号。 还公开了用于实施该方法的回流炉。

公开(公告)号：US06371310B1

公开(公告)日：2002-04-16

申请号：US09740838

申请日：2000-12-21

申请人： Raj N. Master ,  Mohammad Z. Khan ,  L. K. Teoh

发明人： Raj N. Master ,  Mohammad Z. Khan ,  L. K. Teoh

IPC分类号： A47F700

CPC分类号： H01L21/67333

摘要： A boat is formed with layers comprising substantially aligned holes for safely accommodating land grid array semiconductor packages during assembly. The boat includes a bottom layer with an array of through-holes having a substantially square cross-sectional shape with rounded corners, a middle layer with an array of through-holes having a substantially octagonal cross-sectional shape and a top layer having an array of through-holes having a substantially square cross-sectional shape with notched sides and vertical tabs extending upwardly from the sidewalls of each notched side. The layers may be attached by spot welding or other means.

摘要翻译： 船形成有包括基本上对准的孔的层，用于在组装期间安全地容纳平台阵列半导体封装。 船包括具有基本上具有圆角的基本正方形横截面形状的通孔阵列的底层，具有基本上八边形横截面形状的通孔阵列的中间层和具有阵列的顶层 的通孔具有基本正方形的横截面形状，具有切口侧面和从每个缺口侧的侧壁向上延伸的垂直突出部。 这些层可以通过点焊或其他方式附着。

公开(公告)号：US06722553B2

公开(公告)日：2004-04-20

申请号：US09922936

申请日：2001-08-07

申请人： Raj N. Master ,  Mohammad Z. Khan ,  Maria G. Guardado ,  Ooi Tong Ong

发明人： Raj N. Master ,  Mohammad Z. Khan ,  Maria G. Guardado ,  Ooi Tong Ong

IPC分类号： B23K1308

CPC分类号： H05K3/3489 ,  B23K1/203 ,  B23K2101/36 ,  H05K3/3436

摘要： A method and apparatus are provided for controllably dispensing flux on a substrate having a plurality of conductive terminals. Flux having a viscosity range between 10 centipoises and about 150 centipoises is sprayed on the substrate and the conductive terminals at a valve pressure range between about 1.5 psi and about 30 psi via a dispense nozzle of a flux dispenser. Upon a subsequent high temperature solder reflow process, the sprayed flux on the substrate is mostly removed by thermal decomposition to volatile species, thereby significantly reducing flux residue remaining on the surface of the substrate between the conductive terminals.

摘要翻译： 提供了一种方法和装置，用于在具有多个导电端子的基板上可控地分配通量。 具有10厘泊和约150厘泊之间的粘度范围的助焊剂通过焊剂分配器的分配喷嘴在约1.5psi至约30psi之间的阀压力范围内喷射到衬底和导电端子上。 在随后的高温焊料回流工艺中，基板上的喷涂焊剂主要通过热分解除去到挥发性物质，从而显着减少在导电端子之间残留在基板表面上的焊剂残余物。

公开(公告)号：US06617195B1

公开(公告)日：2003-09-09

申请号：US09624491

申请日：2000-07-24

申请人： Raj N. Master ,  Mohammad Z. Khan ,  Maria G. Guardado

发明人： Raj N. Master ,  Mohammad Z. Khan ,  Maria G. Guardado

IPC分类号： H01L2144

CPC分类号： H01L24/81 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/3494

摘要： A method of manufacturing a semiconductor device by attaching a flip chip die to an organic substrate using solder comprises applying no-clean flux to the flip chip die or the organic substrate; heating the flip chip die and the organic substrate to bond the flip chip die to the organic substrate, and cooling the flip chip die and the organic substrate. The step of heating the flux includes controlling oxygen and moisture content of an atmosphere surrounding the flux, preheating to a temperature of about 145° C. to about 165° C., soaking at a temperature of about 145° C. to about 165° C. for about four to about six minutes, and reflowing above the solder's melting point.

摘要翻译： 通过使用焊料将倒装芯片裸片附着到有机基板来制造半导体器件的方法包括向倒装芯片或有机基板施加免清洗助焊剂; 加热倒装晶片管芯和有机衬底以将倒装晶片管芯结合到有机衬底上，并冷却倒装晶片管芯和有机衬底。 加热焊剂的步骤包括控制焊剂周围的气氛中的氧气和水分含量，预热至约145℃至约165℃的温度，在约145℃至约165℃的温度下浸泡 C.约4至6分钟，并回流焊料熔点以上。

公开(公告)号：US07923850B2

公开(公告)日：2011-04-12

申请号：US12198227

申请日：2008-08-26

申请人： Mohammad Khan ,  Jun Zhai ,  Ranjit Gannamani ,  Raj N. Master

发明人： Mohammad Khan ,  Jun Zhai ,  Ranjit Gannamani ,  Raj N. Master

IPC分类号： H01L23/448 ,  H01L21/56

CPC分类号： H01L23/16 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/0401

摘要： Various semiconductor chip arrangements and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a semiconductor chip that has an external peripheral wall to a first side of a substrate. A first metallic ring is coupled to the first side of the substrate. The first metallic ring has an internal peripheral wall that frames the semiconductor chip and is separated from the external peripheral wall by a gap. The first metallic ring has a coefficient of thermal expansion less than about 6.0 10−6 K−1.

摘要翻译： 公开了各种半导体芯片布置及其制造方法。 一方面，提供一种制造方法，其包括将具有外周壁的半导体芯片与基板的第一侧耦合。 第一金属环耦合到衬底的第一侧。 第一金属环具有框架半导体芯片并且与外周壁隔开间隙的内周壁。 第一金属环的热膨胀系数小于约6.0×10 -6 K -1。

公开(公告)号：US20080227310A1

公开(公告)日：2008-09-18

申请号：US11687529

申请日：2007-03-16

申请人： Seah Sun Too ,  Raj N. Master ,  Jacquana Diep ,  Mohammad Khan

发明人： Seah Sun Too ,  Raj N. Master ,  Jacquana Diep ,  Mohammad Khan

IPC分类号： H01R12/00

CPC分类号： H01L23/433 ,  H01L23/467 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2924/3511 ,  H01R12/7076 ,  H05K7/1061 ,  H01L2224/0401

摘要： Various sockets for packaged integrated circuits and methods of making the same are provided. In one aspect, a method of mounting a semiconductor chip is provided that includes providing a package that has a base substrate with a first side and a second side opposite the first side. The second side has a central region. The package includes a semiconductor chip and a lid coupled to the first side. A socket is provided for receiving the base substrate. The socket includes a mound that projects toward the second side of the base substrate when the base substrate is seated in the socket to provide support for the central region of the base substrate. The package is mounted in the socket. The mound provides support for the central region of the base substrate.

摘要翻译： 提供了用于封装集成电路的各种插座及其制造方法。 一方面，提供了一种安装半导体芯片的方法，其包括提供具有第一侧和与第一侧相对的第二侧的基底的封装。 第二边有一个中部地区。 该封装包括半导体芯片和连接到第一侧的盖子。 提供了用于接收基底的插座。 插座包括当基底座位于插座中时朝向基底基板的第二侧突出的墩，以为基底基板的中心区域提供支撑。 包装安装在插座中。 土丘为基底的中心区域提供支撑。

公开(公告)号：US06372544B1

公开(公告)日：2002-04-16

申请号：US09599530

申请日：2000-06-23

申请人： Jonathan D. Halderman ,  Raj N. Master

发明人： Jonathan D. Halderman ,  Raj N. Master

IPC分类号： H01L2144

CPC分类号： H01L21/563 ,  H01L24/31 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83859 ,  H01L2224/83951 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05599

摘要： A softened and compliant fillet portion of a cured polymeric underfill in a flip-chip arrangement reduces occurences of fillet crackings caused by thermal stresses. The softening of the fillet is achieved by chemically breaking cross-links in the cured polymeric underfill material using a chemical solvent. In another embodiment, the softening of the fillet is achieved by applying heat using a controllable beam of thermal energy to break up the cross-links to thereby soften the fillet.

摘要翻译： 固化的聚合物底部填充物的软化且柔顺的圆角部分以倒装芯片布置减少了由热应力引起的圆角裂纹的发生。 通过使用化学溶剂化学破坏固化的聚合物底部填充材料中的交联来实现圆角的软化。 在另一个实施例中，通过使用可控的热能束施加热来实现圆角的软化，以分解交联以便软化圆角。

公开(公告)号：US5543584A

公开(公告)日：1996-08-06

申请号：US843684

申请日：1992-02-28

申请人： Edward F. Handford ,  Joseph M. Harvilchuck ,  Mario J. Interrante ,  Raymond A. Jackson ,  Raj N. Master ,  Sudipta K. Ray ,  William E. Sablinski ,  Thomas A. Wassick

发明人： Edward F. Handford ,  Joseph M. Harvilchuck ,  Mario J. Interrante ,  Raymond A. Jackson ,  Raj N. Master ,  Sudipta K. Ray ,  William E. Sablinski ,  Thomas A. Wassick

IPC分类号： H01L21/3205 ,  H01L21/768 ,  H01L23/498 ,  H01L23/52 ,  H01L23/525 ,  H01L23/538 ,  H05K3/00 ,  H05K3/02 ,  H05K3/22 ,  H05K3/34 ,  H05K1/11

CPC分类号： H01L21/76892 ,  H01L23/49866 ,  H01L23/525 ,  H05K3/225 ,  H01L2924/0002 ,  H05K2201/10181 ,  H05K2201/10234 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2203/0769 ,  H05K2203/107 ,  H05K2203/121 ,  H05K2203/173 ,  H05K2203/175 ,  H05K3/0017 ,  H05K3/027 ,  H05K3/34 ,  Y10T29/49124

摘要： The present invention relates generally to a new method of repairing electrical lines, and more particularly to repairing electrical lines having an opening at the module level with devices in place. Various methods and processes are used to repair this open or defective portion in an electrical conductor line. It could be repaired by securing a jumper wire or nugget across the open or the repair could be made by a deposition process, which includes but is not limited to filling the opening with a solder type material or inserting a solder coated electrical wire and heating the solder and allowing the solder to melt and repair the open. One of the attributes of this invention is the ability to repair on a substrate or module on which active components such as chips, and passive components such as pins, capacitors, etc. have been attached. The invention also allows repair of fine line patterns which are normally not repairable by conventional techniques.

摘要翻译： 本发明一般涉及一种修复电线的新方法，更具体地说，涉及在装置的适当位置修复具有模块级开口的电线。 使用各种方法和过程来修复电导体线中的这个开路或有缺陷的部分。 它可以通过将跨接线或熔核固定在整个开口处进行修复，或者可以通过沉积工艺进行修复，该沉积工艺包括但不限于用焊料型材料填充开口或插入焊料涂覆的电线并加热 焊接并允许焊料熔化并修复开路。 本发明的一个特征是在其上附着有诸如引脚，电容器等的诸如芯片和无源部件的有源部件的基板或模块上进行修复的能力。 本发明还允许修复通常不能通过常规技术修复的细线图案。