公开(公告)号：US20140341255A1

公开(公告)日：2014-11-20

申请号：US14280027

申请日：2014-05-16

申请人： Ralf KAISER ,  Alexander LUX ,  Markus REINHARD ,  Christoph GMELIN ,  Reinhold HERRMANN ,  Patrick PATZNER

发明人： Ralf KAISER ,  Alexander LUX ,  Markus REINHARD ,  Christoph GMELIN ,  Reinhold HERRMANN ,  Patrick PATZNER

IPC分类号： G01K13/02 ,  G01L11/00

CPC分类号： G01K13/02 ,  G01K2205/02 ,  G01L11/00 ,  G01L19/0084 ,  G01L19/0092 ,  G01L19/0627 ,  G01L19/143 ,  G01L23/24 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A device for measuring a pressure and a temperature of a fluid medium flowing in a duct, the device including a pressure sensor element; a temperature sensor having a temperature sensor element; a housing that has a connecting piece, the connecting piece being insertable into the duct in an insertion direction, the connecting piece having an interior chamber, the interior chamber having an opening through which the interior chamber may be exposed to the fluid medium; and a carrier substrate, the pressure sensor element being connected electrically and mechanically to the carrier substrate. In order to increase the service life of the temperature sensor, and in order to allow temperature measurement that is as accurate as possible, it is provided, in this context, that the carrier substrate be positioned substantially parallel to the insertion direction in the interior chamber of the connecting piece, the interior chamber extending along the insertion direction, and it is provided that the temperature sensor be connected electrically and mechanically to the carrier substrate.

摘要翻译： 一种用于测量在管道中流动的流体介质的压力和温度的装置，所述装置包括压力传感器元件; 具有温度传感器元件的温度传感器; 具有连接件的壳体，所述连接件可沿插入方向插入到所述管道中，所述连接件具有内部腔室，所述内部腔室具有开口，所述内部腔室可通过所述开口暴露于所述流体介质; 和载体衬底，所述压力传感器元件电连接和机械地连接到所述载体衬底。 为了增加温度传感器的使用寿命，并且为了允许尽可能精确的温度测量，在本上下文中，提供了载体基板大致平行于内部腔室中的插入方向定位 所述内部室沿着所述插入方向延伸，并且所述温度传感器与所述载体基板电气机械地连接。

公开(公告)号：US20140345124A1

公开(公告)日：2014-11-27

申请号：US14283989

申请日：2014-05-21

申请人： Patrik PATZNER ,  Carsten KASCHUBE ,  Christoph GMELIN ,  Andreas OTTO ,  Markus REINHARD ,  Ronny WOLF

发明人： Patrik PATZNER ,  Carsten KASCHUBE ,  Christoph GMELIN ,  Andreas OTTO ,  Markus REINHARD ,  Ronny WOLF

IPC分类号： H05K3/30

CPC分类号： H05K3/325 ,  H05K1/115 ,  H05K3/308 ,  H05K2201/09854 ,  H05K2201/1059 ,  H05K2201/10856 ,  H05K2201/10878 ,  H05K2203/0285 ,  Y10T29/49139

摘要： A method for solderless electrical press-fit contacting of electrically conductive press-fit pins in circuit boards include: providing a circuit board having a thickness, at least one electrical conductor path, and a contacting opening guided perpendicularly through the circuit board and having a metallized inner wall; providing an electrically conductive press-fit pin having a longitudinal axis and having a press-fit region suitable for press-fitting into the contacting opening and having a substantially round cross section; and press-fitting the press-fit pin into the contacting opening by applying onto the press-fit pin a force acting along the longitudinal axis of the press-fit pin, press-fitting being assisted by the application of ultrasound acting on the press-fit pin.

摘要翻译： 一种用于电路板中的导电压配合销的无焊接电压配合接触的方法包括：提供具有厚度，至少一个电导体路径和垂直于电路板引导的接触开口的电路板，并且具有金属化 内墙; 提供具有纵向轴线并具有适于压配合到所述接触开口中并且具有基本圆形横截面的压配合区域的导电压配合销; 并且通过在压配合销上施加沿着压配合销的纵向轴线的力，将压配合销压入接触开口中，通过施加超声波作用在压配合销上， 适合针。