公开(公告)号：US08907439B1

公开(公告)日：2014-12-09

申请号：US13163909

申请日：2011-06-20

申请人： Randolph R. Kay ,  David V. Campbell ,  Subhash L. Shinde ,  Jeffrey L. Rienstra ,  Darwin K. Serkland ,  Michael L. Holmes ,  Seethambal S. Mani ,  Joy M. Barker ,  Dahwey Chu ,  Thomas Gurrieri

发明人： Randolph R. Kay ,  David V. Campbell ,  Subhash L. Shinde ,  Jeffrey L. Rienstra ,  Darwin K. Serkland ,  Michael L. Holmes ,  Seethambal S. Mani ,  Joy M. Barker ,  Dahwey Chu ,  Thomas Gurrieri

IPC分类号： H01L31/12

CPC分类号： H01L27/14634

摘要： A modular, scalable focal plane array is provided as an array of integrated circuit dice, wherein each die includes a given amount of modular pixel array circuitry. The array of dice effectively multiplies the amount of modular pixel array circuitry to produce a larger pixel array without increasing die size. Desired pixel pitch across the enlarged pixel array is preserved by forming die stacks with each pixel array circuitry die stacked on a separate die that contains the corresponding signal processing circuitry. Techniques for die stack interconnections and die stack placement are implemented to ensure that the desired pixel pitch is preserved across the enlarged pixel array.

摘要翻译： 提供了一种模块化的，可缩放的焦平面阵列作为集成电路芯片的阵列，其中每个管芯包括给定量的模块化像素阵列电路。 骰子阵列有效地将模块化像素阵列电路的数量乘以产生更大的像素阵列而不增加管芯尺寸。 通过将每个像素阵列电路管芯堆叠在包含对应的信号处理电路的单独的管芯上形成管芯堆叠来保留扩大的像素阵列上期望的像素间距。 实现用于管芯堆叠互连和管芯堆叠放置的技术以确保跨越扩大的像素阵列保留期望的像素间距。

公开(公告)号：US06905260B2

公开(公告)日：2005-06-14

申请号：US09749287

申请日：2000-12-26

申请人： Gene R. Anderson ,  Marcelino G. Armendariz ,  Robert P. Bryan ,  Richard F. Carson ,  Dahwey Chu ,  Edwin B. Duckett, III ,  Rachel Knudsen Giunta ,  Robert T. Mitchell ,  Frederick B. McCormick ,  David W. Peterson ,  Merideth A. Rising ,  Cathleen A. Reber ,  Bill H. Reysen

发明人： Gene R. Anderson ,  Marcelino G. Armendariz ,  Robert P. Bryan ,  Richard F. Carson ,  Dahwey Chu ,  Edwin B. Duckett, III ,  Rachel Knudsen Giunta ,  Robert T. Mitchell ,  Frederick B. McCormick ,  David W. Peterson ,  Merideth A. Rising ,  Cathleen A. Reber ,  Bill H. Reysen

IPC分类号： G02B6/26 ,  G02B6/36 ,  G02B6/38 ,  G02B6/42

CPC分类号： G02B6/4277 ,  G02B6/266 ,  G02B6/3885 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/4206 ,  G02B6/4207 ,  G02B6/421 ,  G02B6/4212 ,  G02B6/4219 ,  G02B6/4227 ,  G02B6/4239 ,  G02B6/4249 ,  G02B6/426 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4286

摘要： A process is provided for aligning and connecting at least one optical fiber to at least one optoelectronic device so as to couple light between at least one optical fiber and at least one optoelectronic device. One embodiment of this process comprises the following steps: (1) holding at least one optical element close to at least one optoelectronic device, at least one optical element having at least a first end; (2) aligning at least one optical element with at least one optoelectronic device; (3) depositing a first non-opaque material on a first end of at least one optoelectronic device; and (4) bringing the first end of at least one optical element proximate to the first end of at least one optoelectronic device in such a manner that the first non-opaque material contacts the first end of at least one optoelectronic device and the first end of at least one optical element. The optical element may be an optical fiber, and the optoelectronic device may be a vertical cavity surface emitting laser. The first non-opaque material may be a UV optical adhesive that provides an optical path and mechanical stability. In another embodiment of the alignment process, the first end of at least one optical element is brought proximate to the first end of at least one optoelectronic device in such a manner that an interstitial space exists between the first end of at least one optoelectronic device and the first end of at least one optical element.

摘要翻译： 提供了一种用于将至少一根光纤对准和连接到至少一个光电器件的工艺，以便在至少一个光纤与至少一个光电器件之间耦合光。 该方法的一个实施例包括以下步骤：（1）保持靠近至少一个光电子器件的至少一个光学元件，至少一个具有至少第一端的光学元件; （2）将至少一个光学元件与至少一个光电器件对准; （3）在至少一个光电器件的第一端上沉积第一不透明材料; 和（4）使至少一个光学元件的第一端靠近至少一个光电子器件的第一端，使得第一不透明材料接触至少一个光电器件的第一端，而第一端 的至少一个光学元件。 光学元件可以是光纤，并且光电子器件可以是垂直腔表面发射激光器。 第一不透明材料可以是提供光路和机械稳定性的UV光学粘合剂。 在对准过程的另一实施例中，使至少一个光学元件的第一端靠近至少一个光电子器件的第一端，使得在至少一个光电器件的第一端和 至少一个光学元件的第一端。

公开(公告)号：US06799902B2

公开(公告)日：2004-10-05

申请号：US09749283

申请日：2000-12-26

申请人： Gene R. Anderson ,  Marcelino G. Armendariz ,  Johnny R. F. Baca ,  Robert P. Bryan ,  Richard F. Carson ,  Dahwey Chu ,  Edwin B. Duckett, III ,  Frederick B. McCormick ,  David W. Peterson ,  Gary D. Peterson ,  Cathleen A. Reber ,  Bill H. Reysen

发明人： Gene R. Anderson ,  Marcelino G. Armendariz ,  Johnny R. F. Baca ,  Robert P. Bryan ,  Richard F. Carson ,  Dahwey Chu ,  Edwin B. Duckett, III ,  Frederick B. McCormick ,  David W. Peterson ,  Gary D. Peterson ,  Cathleen A. Reber ,  Bill H. Reysen

IPC分类号： G02B636

CPC分类号： G02B6/4239 ,  G02B6/266 ,  G02B6/4204 ,  G02B6/4206 ,  G02B6/4207 ,  G02B6/421 ,  G02B6/4212 ,  G02B6/4221 ,  G02B6/4224 ,  G02B6/4227 ,  G02B6/4253 ,  G02B6/4269 ,  G02B6/4277 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4286 ,  G02B6/4292 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optoelectronic mounting structure is provided that may be used in conjunction with an optical transmitter, receiver or transceiver module. The mounting structure may be a flexible printed circuit board. Thermal vias or heat pipes in the head region may transmit heat from the mounting structure to the heat spreader. The heat spreader may provide mechanical rigidity or stiffness to the heat region. In another embodiment, an electrical contact and ground plane may pass along a surface of the head region so as to provide an electrical contact path to the optoelectronic devices and limit electromagnetic interference. In yet another embodiment, a window may be formed in the head region of the mounting structure so as to provide access to the heat spreader. Optoelectronic devices may be adapted to the heat spreader in such a manner that the devices are accessible through the window in the mounting structure.

摘要翻译： 提供了可以与光发射器，接收器或收发器模块结合使用的光电安装结构。 安装结构可以是柔性印刷电路板。 头部区域中的热通孔或热管可以将热量从安装结构传递到散热器。 散热器可以为热区域提供机械刚度或刚度。 在另一个实施例中，电触点和接地平面可以沿着头部区域的表面通过，以便提供到光电子器件的电接触路径并限制电磁干扰。 在另一个实施例中，可以在安装结构的头部区域中形成窗口，以便提供对散热器的通路。 光电子器件可以以这样的方式适应于散热器，使得器件可通过安装结构中的窗口接近。

公开(公告)号：US6052287A

公开(公告)日：2000-04-18

申请号：US987276

申请日：1997-12-09

申请人： David W. Palmer ,  Richard A. Gassman ,  Dahwey Chu

发明人： David W. Palmer ,  Richard A. Gassman ,  Dahwey Chu

IPC分类号： H01L23/498 ,  H01L25/065 ,  H05K7/02

CPC分类号： H01L23/49827 ,  H01L25/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/3011

摘要： A ball-grid-array integrated circuit (IC) chip carrier formed from a silicon substrate is disclosed. The silicon ball-grid-array chip carrier is of particular use with ICs having peripheral bond pads which can be reconfigured to a ball-grid-array. The use of a semiconductor substrate such as silicon for forming the ball-grid-array chip carrier allows the chip carrier to be fabricated on an IC process line with, at least in part, standard IC processes. Additionally, the silicon chip carrier can include components such as transistors, resistors, capacitors, inductors and sensors to form a "smart" chip carrier which can provide added functionality and testability to one or more ICs mounted on the chip carrier. Types of functionality that can be provided on the "smart" chip carrier include boundary-scan cells, built-in test structures, signal conditioning circuitry, power conditioning circuitry, and a reconfiguration capability. The "smart" chip carrier can also be used to form specialized or application-specific ICs (ASICs) from conventional ICs. Types of sensors that can be included on the silicon ball-grid-array chip carrier include temperature sensors, pressure sensors, stress sensors, inertia or acceleration sensors, and/or chemical sensors. These sensors can be fabricated by IC processes and can include microelectromechanical (MEM) devices.

摘要翻译： 公开了一种由硅衬底形成的球栅阵列集成电路（IC）芯片载体。 硅球栅阵列芯片载体特别适用于具有外围接合焊盘的IC，其可以被重新配置为球栅阵列。 使用诸如硅的半导体衬底来形成球栅阵列芯片载体允许芯片载体在IC工艺线上制造，至少部分地具有标准IC工艺。 此外，硅芯片载体可以包括诸如晶体管，电阻器，电容器，电感器和传感器的组件，以形成能够为安装在芯片载体上的一个或多个IC提供附加功能和可测试性的“智能”芯片载体。 可以在“智能”芯片载体上提供的功能的类型包括边界扫描单元，内置测试结构，信号调节电路，功率调节电路和重新配置能力。 “智能”芯片载体也可用于从常规IC形成专门的或专用的IC（ASIC）。 可以包括在硅球栅格阵列芯片载体上的传感器的类型包括温度传感器，压力传感器，应力传感器，惯性或加速度传感器和/或化学传感器。 这些传感器可以由IC工艺制造并且可以包括微机电（MEM）装置。