Quantum information processing using electromagnetically induced transparency
    3.
    发明授权
    Quantum information processing using electromagnetically induced transparency 有权
    使用电磁感应透明度的量子信息处理

    公开(公告)号:US07560726B2

    公开(公告)日:2009-07-14

    申请号:US10364987

    申请日:2003-02-11

    IPC分类号: H01J40/14

    CPC分类号: B82Y10/00 G06N99/002

    摘要: Quantum information processing structures and methods use photons and four-level matter systems in electromagnetically induced transparency (EIT) arrangements for one and two-qubit quantum gates, two-photon phase shifters, and Bell state measurement devices. For efficient coupling of the matter systems to the photons while decoupling the matter systems from the phonon bath, molecular cages or molecular tethers maintain the atoms within the electromagnetic field of the photon, e.g., in the evanescent field surrounding the core of an optical fiber carrying the photons. To reduce decoherence caused by spontaneous emissions, the matter systems can be embedded in photonic bandgap crystals or the matter systems can be selected to include metastable energy levels.

    摘要翻译: 量子信息处理结构和方法使用光子和四级物质系统在一个和两个量子位量子门,双光子移相器和贝尔状态测量装置的电磁感应透明度(EIT)布置中。 为了将物质系统有效耦合到光子,同时将物质系统与声子浴解耦,分子笼或分子系链将原子保持在光子的电磁场内,例如在包含光纤的纤芯的周围的消逝场中 光子。 为了减少由自发辐射引起的去相干,物质系统可以嵌入光子带隙晶体中,或者可以选择物质系统来包括亚稳态能级。

    Scalable, component-accessible, and highly interconnected three-dimensional component arrangement within a system
    4.
    发明授权
    Scalable, component-accessible, and highly interconnected three-dimensional component arrangement within a system 有权
    系统内可扩展的,可组件访问的和高度互连的三维组件布置

    公开(公告)号:US08214786B2

    公开(公告)日:2012-07-03

    申请号:US10935845

    申请日:2004-09-08

    IPC分类号: G06F17/50

    摘要: Embodiments of the present invention include dense, but accessible and well-interconnected component arrangements within multi-component systems, such as high-end multi-processor computer systems, and methods for constructing such arrangements. In a described embodiment, integrated-circuit-containing processing components, referred to as a “flat components,” are arranged into local blocks of intercommunicating flat components. The local flat-component blocks are arranged into interconnected, primitive multi-local-block repeating units, and the primitive local-block repeating units are layered together in a three-dimensional, regularly repeating structure that can be assembled to approximately fill any specified three-dimensional volume. The arrangement provides for relatively short, direct pathways from the surface of the specified volume to any particular local block and flat component within the three-dimensional arrangement.

    摘要翻译: 本发明的实施例包括在诸如高端多处理器计算机系统的多组件系统内的密集但可访问和良好互连的组件布置,以及用于构造这种布置的方法。 在所描述的实施例中,被称为“平面部件”的集成电路的处理部件被布置在相互连通的平面部件的局部块中。 本地平面组件块被布置成互连的原始多局部块重复单元,并且原始局部块重复单元以三维的规则重复的结构分层在一起,其可以被组装以大致填充任何指定的三 维数。 该装置提供从指定体积的表面到三维布置中的任何特定局部块和平坦部件的相对短的直接通路。

    Autonomous evanescent optical nanosensor
    6.
    发明授权
    Autonomous evanescent optical nanosensor 失效
    自动渐逝光学纳米传感器

    公开(公告)号:US07233711B1

    公开(公告)日:2007-06-19

    申请号:US11127542

    申请日:2005-05-11

    IPC分类号: G02B6/00 G02B6/12

    摘要: A sensor includes traps that are adjacent to a waveguide and capable of holding a contaminant for an interaction with an evanescent field surrounding the waveguide. When held in a trap, a particle of the contaminant, which may be an atom, a molecule, a virus, or a microbe, scatters light from the waveguide, and the scattered light can be measured to detect the presence or concentration of the contaminant. Holding of the particles permits sensing of the contaminant in a gas where movement of the particles might otherwise be too fast to permit measurement of the interaction with the evanescent field. The waveguide, a lighting system for the waveguide, a photosensor, and a communications interface can all be fabricated on a semiconductor die to permit fabrication of an autonomous nanosensor capable of suspension in the air or a gas being sensed.

    摘要翻译: 传感器包括与波导相邻并且能​​够保持污染物以与与波导周围的ev逝场相互作用的陷阱。 当保持在陷阱中时,可能是原子,分子,病毒或微生物的污染物的颗粒散射来自波导的光,并且可以测量散射光以检测污染物的存在或浓度 。 保持颗粒允许感测气体中的污染物,其中颗粒的移动可能太快以至于不能测量与渐逝场的相互作用。 波导,用于波导的照明系统,光传感器和通信接口都可以在半导体管芯上制造,以允许制造能够在空气中悬浮的自主纳米传感器或被感测的气体。

    Electric-field-enhancement structures including dielectric particles, apparatus including same, and methods of use
    7.
    发明授权
    Electric-field-enhancement structures including dielectric particles, apparatus including same, and methods of use 失效
    包括电介质颗粒的电场增强结构,包括其的设备和使用方法

    公开(公告)号:US07696477B2

    公开(公告)日:2010-04-13

    申请号:US11724409

    申请日:2007-03-14

    IPC分类号: G01N23/00

    摘要: In one aspect of the present invention, an electric-field-enhancement structure is disclosed. The electric-field-enhancement structure includes a substrate and an ordered arrangement of dielectric particles having at least two adjacent dielectric particles spaced from each other a controlled distance. The controlled distance is selected so that when a resonance mode is excited in each of the at least two adjacent dielectric particles responsive to excitation electromagnetic radiation, each of the resonance modes interacts with each other to result in an enhanced electric field between the at least two adjacent dielectric particles. Other aspects of the present invention are electric-field-enhancement apparatuses that utilize the described electric-field-enhancement structures, and methods of enhancing an electric field between adjacent dielectric particles.

    摘要翻译: 在本发明的一个方面,公开了一种电场增强结构。 电场增强结构包括基底和具有至少两个相邻的电介质颗粒彼此间隔可控距离的介质颗粒的有序布置。 控制距离被选择为使得当谐振模式在响应于激发电磁辐射的至少两个相邻电介质颗粒中的每一个中被激发时,每个谐振模式彼此相互作用以在至少两个之间产生增强的电场 相邻的电介质颗粒。 本发明的其他方面是利用所述电场增强结构的电场增强装置以及增强相邻电介质颗粒之间的电场的方法。

    Integrated circuits having photonic interconnect layers and methods for fabricating same
    8.
    发明申请
    Integrated circuits having photonic interconnect layers and methods for fabricating same 有权
    具有光互连层的集成电路及其制造方法

    公开(公告)号:US20080246106A1

    公开(公告)日:2008-10-09

    申请号:US11732549

    申请日:2007-04-03

    IPC分类号: H01L31/0232

    摘要: Various embodiments of the present invention are directed to integrated circuits having photonic interconnect layers and methods for fabricating the integrated circuits. In one embodiment of the present invention, an integrated circuit comprises an electronic device layer and one or more photonic interconnect layers. The electronic device layer includes one or more electronic devices, and the electronic device layer is attached to a surface of an intermediate layer. One of the photonic interconnect layers is attached to an opposing surface of the intermediate layer, and each of the photonic interconnect layers has at least one photonic device in communication with at least one of the electronic devices of the electronic device layer.

    摘要翻译: 本发明的各种实施例涉及具有光子互连层的集成电路和用于制造集成电路的方法。 在本发明的一个实施例中,集成电路包括电子器件层和一个或多个光子互连层。 电子器件层包括一个或多个电子器件,并且电子器件层附着到中间层的表面。 光子互连层中的一个附着到中间层的相对表面,并且每个光子互连层具有与电子器件层的至少一个电子器件通信的至少一个光子器件。

    Integrated circuits having photonic interconnect layers and methods for fabricating same
    9.
    发明授权
    Integrated circuits having photonic interconnect layers and methods for fabricating same 有权
    具有光互连层的集成电路及其制造方法

    公开(公告)号:US07778501B2

    公开(公告)日:2010-08-17

    申请号:US11732549

    申请日:2007-04-03

    IPC分类号: G02B6/12

    摘要: Various embodiments of the present invention are directed to integrated circuits having photonic interconnect layers and methods for fabricating the integrated circuits. In one embodiment of the present invention, an integrated circuit comprises an electronic device layer and one or more photonic interconnect layers. The electronic device layer includes one or more electronic devices, and the electronic device layer is attached to a surface of an intermediate layer. One of the photonic interconnect layers is attached to an opposing surface of the intermediate layer, and each of the photonic interconnect layers has at least one photonic device in communication with at least one of the electronic devices of the electronic device layer.

    摘要翻译: 本发明的各种实施例涉及具有光子互连层的集成电路和用于制造集成电路的方法。 在本发明的一个实施例中,集成电路包括电子器件层和一个或多个光子互连层。 电子器件层包括一个或多个电子器件,并且电子器件层附着到中间层的表面。 光子互连层中的一个附着到中间层的相对表面,并且每个光子互连层具有与电子器件层的至少一个电子器件通信的至少一个光子器件。