OPTICAL WINDOW WITH INTEGRATED TEMPERATURE SENSING

    公开(公告)号:US20210212244A1

    公开(公告)日:2021-07-08

    申请号:US17190037

    申请日:2021-03-02

    申请人: RAYTHEON COMPANY

    IPC分类号: H05K9/00

    摘要: Methods and apparatus for measuring and optionally adjusting the temperature profile of an optical window. In one example, an optical window with integrated temperature sensing functionality includes a first window layer of an optically transparent material, a second window layer of the optically transparent material, an electromagnetic interference shielding grid disposed between the first and second window layers and including a first electrically conductive structure and a second electrically conductive structure, and a thermally sensitive material disposed between the first and second electrically conductive structures, the thermally sensitive material having an electrical property that varies as a function of temperature.

    Optical window with integrated temperature sensing

    公开(公告)号:US10939596B1

    公开(公告)日:2021-03-02

    申请号:US16537214

    申请日:2019-08-09

    申请人: RAYTHEON COMPANY

    IPC分类号: H05K9/00

    摘要: Methods and apparatus for measuring and optionally adjusting the temperature profile of an optical window. In one example, an optical window with integrated temperature sensing functionality includes a first window layer of an optically transparent material, a second window layer of the optically transparent material, an electromagnetic interference shielding grid disposed between the first and second window layers and including a first electrically conductive structure and a second electrically conductive structure, and a thermally sensitive material disposed between the first and second electrically conductive structures, the thermally sensitive material having an electrical property that varies as a function of temperature.

    OPTICAL WINDOW WITH INTEGRATED TEMPERATURE SENSING

    公开(公告)号:US20210045270A1

    公开(公告)日:2021-02-11

    申请号:US16537214

    申请日:2019-08-09

    申请人: RAYTHEON COMPANY

    IPC分类号: H05K9/00

    摘要: Methods and apparatus for measuring and optionally adjusting the temperature profile of an optical window. In one example, an optical window with integrated temperature sensing functionality includes a first window layer of an optically transparent material, a second window layer of the optically transparent material, an electromagnetic interference shielding grid disposed between the first and second window layers and including a first electrically conductive structure and a second electrically conductive structure, and a thermally sensitive material disposed between the first and second electrically conductive structures, the thermally sensitive material having an electrical property that varies as a function of temperature.

    OPTICAL WINDOW WITH INTEGRATED TEMPERATURE SENSING

    公开(公告)号:US20240008234A1

    公开(公告)日:2024-01-04

    申请号:US18369573

    申请日:2023-09-18

    申请人: RAYTHEON COMPANY

    IPC分类号: H05K9/00

    摘要: A method of controlling a temperature profile of an optical window comprising: measuring a temperature-dependent electrical property of a thermally sensitive material included in the optical window using an embedded electromagnetic interference shield in the optical window to determine the temperature profile of the optical window, the embedded electromagnetic interference shield including a two-dimensional array of electrically conductive wires; and based on the measurements, selectively biasing at least one wire of the two-dimensional array of electrically conductive wires to locally alter the temperature-dependent electrical property of the thermally sensitive material in at least one selected spatial region of the optical window to control the temperature profile of the optical window.

    WIRE-BASED INDUCTORS
    7.
    发明申请

    公开(公告)号:US20200258674A1

    公开(公告)日:2020-08-13

    申请号:US16273225

    申请日:2019-02-12

    申请人: Raytheon Company

    摘要: A continuous wire that includes a wound inductance from a first yarn material formed of filaments or nanotubes, the first yarn being doped with or including a first material that causes it to be electrically conductive and a second yarn formed of material filaments or nanotubes that is electrically insulating and may include magnetic particles wound with the first yarn in bifilar fashion or both yarns wrapped in a bifilar fashion around an insulating core yarn which may include magnetic particles to increase the inductance of the wire. The doping and electrical conductance of the yarns can be varied along the length of the wire to integrate sections of lumped electrical conductance and inductance.

    Optical window with integrated temperature sensing

    公开(公告)号:US11792967B2

    公开(公告)日:2023-10-17

    申请号:US17190037

    申请日:2021-03-02

    申请人: RAYTHEON COMPANY

    IPC分类号: H05K9/00

    摘要: Methods and apparatus for measuring and optionally adjusting the temperature profile of an optical window. In one example, an optical window with integrated temperature sensing functionality includes a first window layer of an optically transparent material, a second window layer of the optically transparent material, an electromagnetic interference shielding grid disposed between the first and second window layers and including a first electrically conductive structure and a second electrically conductive structure, and a thermally sensitive material disposed between the first and second electrically conductive structures, the thermally sensitive material having an electrical property that varies as a function of temperature.

    Patterned conductive microstructures within a heat shrinkable substrate

    公开(公告)号:US11638348B2

    公开(公告)日:2023-04-25

    申请号:US16934951

    申请日:2020-07-21

    申请人: Raytheon Company

    摘要: A conductive interconnect structure comprises a polymeric substrate (e.g., a thermoplastic) and a plurality of compliant conductive microstructures (e.g., conductive carbon nanofibers) embedded in the polymeric substrate. The microstructures can be arranged linearly or in a grid pattern. In response to heating, the polymeric substrate transitions from an unshrunk state to a shrunken state to move the microstructures closer together, thereby increasing an interconnect density of the compliant conductive microstructures. Thus, the gap or pitch between adjacent microstructures is reduced in response to heat-induced shrinkage of the polymeric substrate to generate finely-pitched microstructures that are densely pitched, thereby increasing the current-carrying capacity of the microstructures. The polymeric material can be heated to conform or form-fit to planar and non-planar surfaces/geometries, and can be selectively heated at various portions to tailor or customize the interconnect density of the microstructures at selected portions. Associated electrical conducting assemblies and methods are provided.

    Apertures with dynamically variable electromagnetic properties

    公开(公告)号:US11451309B2

    公开(公告)日:2022-09-20

    申请号:US16537212

    申请日:2019-08-09

    申请人: RAYTHEON COMPANY

    IPC分类号: H04B15/02 H03H7/01 H03H9/24

    摘要: A dynamic aperture is disclosed. A dynamic aperture includes a base layer, a conductive structure disposed on the base layer, and a layer of a material having a dynamically controllable electrical conductivity that is disposed over the base layer and the conductive structure. A transmission profile of the dynamic aperture is determined by a combination of the conductive structure and the layer of the material. The transmission profile is dynamically alterable by controlling the electrical conductivity of the layer of the material.