Methods and systems for capacitive balancing of relative humidity sensors having integrated signal conditioning
    1.
    发明授权
    Methods and systems for capacitive balancing of relative humidity sensors having integrated signal conditioning 有权
    具有集成信号调理功能的相对湿度传感器的电容平衡方法和系统

    公开(公告)号:US06867602B2

    公开(公告)日:2005-03-15

    申请号:US10322152

    申请日:2002-12-18

    IPC分类号: G01D5/24 G01N27/22 G01R27/26

    CPC分类号: G01N27/225 G01D5/24

    摘要: Methods of and systems for balancing the capacitance of a common series capacitive circuit in a semiconductor-based sensor, such as a humidity sensor, are described. Relative humidity sensors can provide measurements via a series capacitive circuit including a humidity-sensitive dielectric separating a common top plate and first and second bottom plates associated with a first and second capacitor, Cx1 and Cx2. For proper operation, the common top plate should be in capacitive balance. Capacitive balance can be achieved by creating voids within and/or along the common top plate of the sensor. A system for creating voids can include a precision cutting instrument, a measuring device for enabling the measurement of capacitance of at least one of the common series capacitive circuit, Cx1 and Cx2, and power provided from a voltage source.

    摘要翻译: 对基于半导体的传感器(例如湿度传感器)中的公共串联电容电路的电容进行平衡的方法和系统进行说明。 相对湿度传感器可以通过串联电容电路提供测量,该串联电容电路包括分离公共顶板和与第一和第二电容器Cx1和Cx2相关联的第一和第二底板的湿度敏感电介质。 为了正常工作,普通顶板应处于电容平衡状态。 电容平衡可以通过在传感器的公共顶板内和/或沿传感器的共同顶板产生空隙来实现。 用于产生空隙的系统可以包括精密切割仪器,用于测量公共串联电容电路Cx1和Cx2中的至少一个的电容的测量装置以及从电压源提供的功率。

    Relative humidity sensor with integrated signal conditioning
    2.
    发明授权
    Relative humidity sensor with integrated signal conditioning 有权
    具有集成信号调理功能的相对湿度传感器

    公开(公告)号:US06724612B2

    公开(公告)日:2004-04-20

    申请号:US10192451

    申请日:2002-07-09

    IPC分类号: H01G438

    CPC分类号: G01D5/24 G01N27/225

    摘要: Methods of and systems providing high reliability relative humidity sensors having integrated signal conditioning are described, providing a series capacitive circuit including a humidity-sensitive dielectric, a common top plate and first and second bottom plates associated with a first and second capacitor, respectively. Changes in humidity affect the humidity-sensitive dielectric thereby causing changes in the capacitive value of said series capacitive circuit. The system includes a common top plate; a common humidity-sensitive dielectric formed under said common top plate; a first series capacitor Cx1 including a first bottom plate formed under said common humidity-sensitive dielectric opposite said common top plate; a second series capacitor Cx2 including a second bottom plate formed under said common humidity-sensitive dielectric opposite said common top plate; wherein said first series capacitor Cx1 and said second series capacitor Cx2 commonly share said dielectric and commonly share said common top plate and are arranged in a series capacitor circuit configuration within a semiconductor system. A sampling voltage source can provide a fixed voltage through said series capacitive circuit.

    摘要翻译: 描述了提供具有集成信号调理的高可靠性相对湿度传感器的方法和系统,其分别提供包括与第一和第二电容器相关联的湿度敏感电介质,公共顶板以及第一和第二底板的串联电容电路。 湿度的变化影响湿敏电介质,从而引起所述串联电容电路的电容值的变化。 该系统包括一个共同的顶板; 形成在所述公共顶板下方的共同的湿度敏感电介质; 第一串联电容器Cx1,包括形成在与所述公共顶板相对的所述公共温度敏感电介质下方的第一底板; 第二串联电容器Cx2,包括形成在与所述公共顶板相对的所述公共温度敏感电介质下方的第二底板; 其中所述第一串联电容器Cx1和所述第二串联电容器Cx2共同共享所述电介质并共同共享所述公共顶板并且被布置在半导体系统内的串联电容器电路配置中。 采样电压源可以通过所述串联电容电路提供固定电压。

    Sensor or capacitance measuring with a microprocessor
    3.
    发明授权
    Sensor or capacitance measuring with a microprocessor 失效
    用微处理器测量传感器或电容

    公开(公告)号:US07472028B2

    公开(公告)日:2008-12-30

    申请号:US11158393

    申请日:2005-06-21

    申请人: Steve R. Foote

    发明人: Steve R. Foote

    IPC分类号: G01R25/00

    摘要: An apparatus, system, and method for measuring parameters, measuring or determining capacitance, producing a digital output that is dependent upon a capacitance, or converting a variable capacitance output, of a sensor capacitor for example, into a digital format. By activating and deactivating pins, a microprocessor may form various circuits, for instance, each containing a resistor and a different capacitor and, in some embodiments, without the use of intermediate switching components. The microprocessor may alternately measure the time to change the charge of each of the capacitors and then calculate the capacitance of one of the capacitors using the measured times and known capacitances of one or more reference capacitors. Certain embodiments use two reference capacitors and alternately charge and discharge the capacitors, and a simple formula may be used to calculate capacitance using times to reach a threshold voltage. A measured parameter may be humidity or pressure, for example.

    摘要翻译: 用于测量参数,测量或确定电容,产生取决于电容的数字输出或将可变电容输出转换成例如传感器电容器的数字格式的装置,系统和方法。 通过激活和去激活引脚,微处理器可以形成各种电路,例如每个电路包含电阻器和不同的电容器,并且在一些实施例中,不使用中间开关部件。 微处理器可以交替地测量改变每个电容器的电荷的时间,然后使用测量的时间和一个或多个参考电容器的已知电容来计算一个电容器的电容。 某些实施例使用两个参考电容器并且交替地对电容器进行充电和放电,并且可以使用简单的公式来计算电容,以达到阈值电压的时间。 例如,测量的参数可以是湿度或压力。

    Temperature sensor with internal rigid substrate
    4.
    发明授权
    Temperature sensor with internal rigid substrate 失效
    具有内部刚性基板的温度传感器

    公开(公告)号:US5726624A

    公开(公告)日:1998-03-10

    申请号:US673854

    申请日:1996-07-01

    CPC分类号: G01K7/183

    摘要: A temperature sensor is made with a rigid substrate disposed within a metallic tube for the purpose of supporting a resistive temperature detector and conductive strips disposed on the substrate. The conductive strips of palladium silver are deposited on the substrate and in electrical communication with gold pads that are used to permit the RTD to be connected to the gold pads by wire bonding techniques. A sleeve is provided at an opposite end of the sensor to support a first end region of the rigid substrate at a preselected position within the tube. The second end region of the substrate extends away from the sleeve and toward an opposite end of the tube, which is crimped to seal it. Conductive wires are avoided within the main portion of the outer metallic tube, thus eliminating the need for fiber glass sleeved wires extending through the tube.

    摘要翻译: 温度传感器由设置在金属管内的刚性基板制成,用于支撑电阻温度检测器和设置在基板上的导电条。 钯银的导电条被沉积在基板上并与金焊盘电连通,用于允许RTD通过引线接合技术连接到金焊盘。 在传感器的相对端处设置套筒,以在管内的预选位置处支撑刚性基底的第一端部区域。 衬底的第二端区域远离套管延伸并且朝着管的相对端延伸,该端部被压接以将其密封。 在外金属管的主要部分内避免导电线,因此不需要延伸穿过管的玻璃纤维套管。