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1.发明授权Liquid-cooling memory modules with liquid flow pipes between memory module sockets 有权内存模块插槽之间具有液体流管的液冷存储器模块公开(公告)号：US08587943B2
公开(公告)日：2013-11-19
申请号：US13305092
申请日：2011-11-28
申请人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
发明人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
CPC分类号： H01L23/473 , G06F1/20 , G06F2200/201 , H01L23/4093 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes.
摘要翻译： 液冷计算机存储器系统包括与冷却液体源流体连通的第一和第二块。 多个间隔开的传热管沿着系统板在从第一歧管块到第二歧管块的存储器模块插槽之间延伸。 传热管可以是将冷却液体循环在存储器模块插槽之间的液体流管。 或者，传热管可以是将热量从存储器模块传导到液冷块的封闭热管。 提供单独的散热器以将每个存储器模块热桥接到相邻的传热管。
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公开(公告)号：US08638559B2
公开(公告)日：2014-01-28
申请号：US13293174
申请日：2011-11-10
申请人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
发明人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
IPC分类号： H05K7/20
CPC分类号： F28D15/0275 , G06F1/185 , G06F1/20 , H01L23/4093 , H01L23/427 , H01L23/473 , H01L2924/0002 , H05K7/20509 , H05K7/20772 , H05K7/20809 , H01L2924/00
摘要： A cooling system for a memory module comprises a heat conduction assembly for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each heat conduction assembly includes a frame having opposing first and second supports, first and second heat spreader plates each extending from the first support to the second support, and a pair of flattened heat pipes each extending along a respective one of the heat spreader plates from the first support to the second support. The liquid-cooled mounting blocks releasably support the heat conduction assembly over a memory module socket with the memory module between the heat spreader plates.
摘要翻译： 用于存储器模块的冷却系统包括用于将热量从存储器模块传导到液冷的安装块的热传导组件。 在一个实施例中，每个热传导组件包括具有相对的第一和第二支撑件的框架，每个从第一支撑件延伸到第二支撑件的第一和第二散热板，以及一对扁平化的热管， 散热板从第一支撑到第二支撑。 液体冷却的安装块通过存储器模块插座可释放地支撑热传导组件，存储器模块位于散热板之间。
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3.发明申请LIQUID-COOLING MEMORY MODULES WITH LIQUID FLOW PIPES BETWEEN MEMORY MODULE SOCKETS 有权存储器模块插座之间液体流管的液体冷却存储器模块公开(公告)号：US20130135812A1
公开(公告)日：2013-05-30
申请号：US13305092
申请日：2011-11-28
申请人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
发明人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
CPC分类号： H01L23/473 , G06F1/20 , G06F2200/201 , H01L23/4093 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes.
摘要翻译： 液冷计算机存储器系统包括与冷却液体源流体连通的第一和第二块。 多个间隔开的传热管沿着系统板在从第一歧管块到第二歧管块的存储器模块插槽之间延伸。 传热管可以是将冷却液体循环在存储器模块插槽之间的液体流管。 或者，传热管可以是将热量从存储器模块传导到液冷块的封闭热管。 提供单独的散热器以将每个存储器模块热桥接到相邻的传热管。
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公开(公告)号：US20130120926A1
公开(公告)日：2013-05-16
申请号：US13293174
申请日：2011-11-10
申请人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
发明人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
CPC分类号： F28D15/0275 , G06F1/185 , G06F1/20 , H01L23/4093 , H01L23/427 , H01L23/473 , H01L2924/0002 , H05K7/20509 , H05K7/20772 , H05K7/20809 , H01L2924/00
摘要： A cooling system for a memory module comprises a heat conduction assembly for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each heat conduction assembly includes a frame having opposing first and second supports, first and second heat spreader plates each extending from the first support to the second support, and a pair of flattened heat pipes each extending along a respective one of the heat spreader plates from the first support to the second support. The liquid-cooled mounting blocks releasably support the heat conduction assembly over a memory module socket with the memory module between the heat spreader plates.
摘要翻译： 用于存储器模块的冷却系统包括用于将热量从存储器模块传导到液冷的安装块的热传导组件。 在一个实施例中，每个热传导组件包括具有相对的第一和第二支撑件的框架，每个从第一支撑件延伸到第二支撑件的第一和第二散热板，以及一对扁平化的热管， 散热板从第一支撑到第二支撑。 液体冷却的安装块通过存储器模块插座可释放地支撑热传导组件，存储器模块位于散热板之间。
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公开(公告)号：US20110225819A1
公开(公告)日：2011-09-22
申请号：US12728096
申请日：2010-03-19
申请人： Richard M. Barina , James R. Drake , Daniel P. Kelaher , George M. Moorefield, II , Derek I. Schmidt , James S. Womble
发明人： Richard M. Barina , James R. Drake , Daniel P. Kelaher , George M. Moorefield, II , Derek I. Schmidt , James S. Womble
CPC分类号： H05K13/0491 , Y10T29/4913 , Y10T29/53183 , Y10T29/53257 , Y10T29/53274 , Y10T29/53283
摘要： A tool according to one embodiment includes an actuating mechanism including a cam plate; at least one gripper member operatively coupled to the cam plate; and a carriage for supporting the at least one gripper member, wherein the at least one gripper member is actuatable by the cam plate, wherein rotation of the cam plate causes the at least one gripper member to move between a first position and a second position, wherein when the at least one gripper member is in the first position, the tool is able to accept a processor for holding thereof, and wherein when the at least one gripper member is in the second position, the tool securely holds the processor therein. Additional systems and methods are also presented.
摘要翻译： 根据一个实施例的工具包括具有凸轮板的致动机构; 至少一个可操作地联接到所述凸轮板的夹持器构件; 以及用于支撑所述至少一个夹持构件的滑架，其中所述至少一个夹持构件可由所述凸轮板致动，其中所述凸轮板的旋转使所述至少一个夹持构件在第一位置和第二位置之间移动， 其中，当所述至少一个夹持构件处于所述第一位置时，所述工具能够接受用于保持其的处理器，并且其中当所述至少一个夹持构件处于所述第二位置时，所述工具将所述处理器牢固地保持在其中。 还介绍了其他系统和方法。
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公开(公告)号：US07344394B1
公开(公告)日：2008-03-18
申请号：US11872987
申请日：2007-10-16
IPC分类号： H01R13/62
CPC分类号： H05K7/1489 , G06F1/183
摘要： A latch mechanism for securing a module in an electronic component chassis includes at least one lever arm attached to the module and rotable between a latched and unlatched position, at least a portion of the lever arm having an interference fit with the chassis when the lever arm is in the latched position. The latch mechanism further includes at least one pawl rotably attached to the module such that when the lever arm is moved to the latched position, the lever arm rotates the pawl into a latched position wherein the pawl has an interference fit with the chassis.
摘要翻译： 用于将模块固定在电子部件底盘中的闩锁机构包括至少一个杠杆臂，该杠杆臂附接到模块并可在锁定和解锁位置之间旋转，当杠杆臂 处于锁定位置。 闩锁机构还包括可旋转地附接到模块的至少一个棘爪，使得当杠杆臂移动到闩锁位置时，杠杆臂将棘爪旋转到闩锁位置，其中棘爪与底盘具有过盈配合。
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公开(公告)号：US08336199B2
公开(公告)日：2012-12-25
申请号：US12728096
申请日：2010-03-19
申请人： Richard M. Barina , James R. Drake , Daniel P. Kelaher , George M. Moorefield, II , Derek I. Schmidt , James S. Womble
发明人： Richard M. Barina , James R. Drake , Daniel P. Kelaher , George M. Moorefield, II , Derek I. Schmidt , James S. Womble
IPC分类号： B23P19/00
CPC分类号： H05K13/0491 , Y10T29/4913 , Y10T29/53183 , Y10T29/53257 , Y10T29/53274 , Y10T29/53283
摘要： A tool according to one embodiment includes an actuating mechanism including a cam plate; at least one gripper member operatively coupled to the cam plate; and a carriage for supporting the at least one gripper member, wherein the at least one gripper member is actuatable by the cam plate, wherein rotation of the cam plate causes the at least one gripper member to move between a first position and a second position, wherein when the at least one gripper member is in the first position, the tool is able to accept a processor for holding thereof, and wherein when the at least one gripper member is in the second position, the tool securely holds the processor therein. Additional systems and methods are also presented.
摘要翻译： 根据一个实施例的工具包括具有凸轮板的致动机构; 至少一个可操作地联接到所述凸轮板的夹持器构件; 以及用于支撑所述至少一个夹持构件的滑架，其中所述至少一个夹持构件可由所述凸轮板致动，其中所述凸轮板的旋转使所述至少一个夹持构件在第一位置和第二位置之间移动， 其中，当所述至少一个夹持构件处于所述第一位置时，所述工具能够接受用于保持其的处理器，并且其中当所述至少一个夹持构件处于所述第二位置时，所述工具将所述处理器牢固地保持在其中。 还介绍了其他系统和方法。
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公开(公告)号：US07431640B1
公开(公告)日：2008-10-07
申请号：US12046567
申请日：2008-03-12
CPC分类号： F24F13/08 , B01D41/04 , F24F2003/1639 , H05K7/20181
摘要： An air moving device assembly in a computer system has an air moving device such as a fan or blower within a housing for moving air from an air inlet to an air outlet. A mesh with a plurality of openings covers the air outlet. A back flow damper assembly is positioned over the air outlet. The back flow damper assembly further comprises at least one damper door movable in an open position and a closed position. The damper door has at least one tooth such that when the damper door is in the closed position, the tooth interacts with at least one of the plurality of openings in the mesh. By periodically cycling the air moving device controlled by device management software, the teeth will close and open, loosening debris from the mesh, allowing the debris to be blown out the rear of the housing once the device is turned back on.
摘要翻译： 计算机系统中的空气移动装置组件具有在壳体内的空气移动装置，例如风扇或鼓风机，用于将空气从空气入口移动到空气出口。 具有多个开口的网覆盖空气出口。 背风阻尼器组件位于空气出口上方。 回流阻尼器组件还包括至少一个可在打开位置和关闭位置运动的阻尼器门。 阻尼器门具有至少一个齿，使得当阻尼门处于关闭位置时，齿与网中的多个开口中的至少一个相互作用。 通过周期性地循环由设备管理软件控制的空气移动装置，齿将关闭并打开，松开网格上的碎屑，一旦设备重新打开，就可以将碎屑吹出壳体的后部。
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公开(公告)号：US07438571B1
公开(公告)日：2008-10-21
申请号：US12021662
申请日：2008-01-29
IPC分类号： H01R13/62
CPC分类号： H05K7/1489 , G06F1/183
摘要： A latch mechanism for securing a module in an electronic component chassis includes at least one lever arm attached to the module and rotable between a latched and unlatched position, at least a portion of the lever arm having an interference fit with the chassis when the lever arm is in the latched position. The latch mechanism further includes at least one pawl rotably attached to the module such that when the lever arm is moved to the latched position, the lever arm rotates the pawl into a latched position wherein the pawl has an interference fit with the chassis.
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公开(公告)号：US20100308189A1
公开(公告)日：2010-12-09
申请号：US12480998
申请日：2009-06-09
IPC分类号： A47B96/00
CPC分类号： H05K7/1489 , G06F1/186
摘要： A method and system to support simultaneous unlatching from a rack of two or more adjacently mounted and vertically aligned hardware components. One interface bracket is secured to one vertical rail of the rack, and a second interface bracket is secured to a second vertical rail of the rack on an opposite side of the rack. A set of latches are provided in communication with each interface bracket, with the number of latches corresponding to the number of hardware components in communication with the interface bracket. Actuation of one of the latches releases fastening of at least one hardware components from the rack, and accommodates removal of the release component from the rack.
摘要翻译： 一种支持从两个或多个相邻安装和垂直对齐的硬件组件的机架同时解锁的方法和系统。 一个接口支架被固定在机架的一个垂直导轨上，第二接口支架固定在机架另一侧的另一个垂直导轨上。 提供与每个接口支架通信的一组锁存器，其中锁存器的数量对应于与接口支架通信的硬件组件的数量。 其中一个闩锁的致动释放了来自机架的至少一个硬件组件的紧固，并且允许将释放部件从机架中移除。
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