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    Multi-heat sink LED device
    1.
    发明授权
    Multi-heat sink LED device 有权
    多功能散热LED设备

    公开(公告)号：US07997763B2

    公开(公告)日：2011-08-16

    申请号：US12414690

    申请日：2009-03-31

    申请人： Richard N. Giardina ,  G. James Deutschlander ,  Brian S. Fetscher ,  Andrey Y. Sadchikov ,  Henrick A. Zabawski

    发明人： Richard N. Giardina ,  G. James Deutschlander ,  Brian S. Fetscher ,  Andrey Y. Sadchikov ,  Henrick A. Zabawski

    IPC分类号： F21V21/00 ,  F21V29/00 ,  H01J9/24

    CPC分类号： F21V29/70 ,  F21V15/01 ,  F21V23/026 ,  F21V29/004 ,  F21V29/71 ,  F21V29/85 ,  F21V29/89 ,  F21Y2115/10

    摘要： A light emitting diode (LED) lighting device that includes a housing and a heat sink assembly received within the housing. The heat sink assembly includes at least a first heat sink member and at least a second heat sink member. A printed circuit board having at least one LED provided thereon is mounted to both the first heat sink member and the second heat sink member. At least one biasing member biases an outer side of the first heat sink member and an outer side of the second heat sink member into contact with an inner side of the housing. Heat from the at least one LED is transferred through the heat sink assembly to the housing, where it is dissipated into the air.

    摘要翻译： 一种发光二极管（LED）照明装置，其包括容纳在壳体内的壳体和散热器组件。 散热器组件至少包括第一散热构件和至少第二散热构件。 具有设置在其上的至少一个LED的印刷电路板安装到第一散热构件和第二散热构件。 至少一个偏置构件偏压第一散热构件的外侧和第二散热构件的外侧与壳体的内侧接触。 来自至少一个LED的热量通过散热器组件传送到壳体，在那里它被散发到空气中。