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公开(公告)号：US06554180B1
公开(公告)日：2003-04-29
申请号：US09637922
申请日：2000-08-14
申请人： Rikiya Katoh , Osamu Munekata , Yoshitaka Toyoda
发明人： Rikiya Katoh , Osamu Munekata , Yoshitaka Toyoda
IPC分类号： B23K35363
CPC分类号： B23K35/262 , B23K35/025 , B23K2101/42 , H05K3/3442 , H05K3/3463 , H05K3/3484 , H05K2201/10636 , Y02P70/611
摘要： A lead-free solder paste suitable for soldering chip parts includes a powder of a twin-peak Sn-based solder alloy containing 0.2-1.0 mass % of Ag and a flux. The solder alloy has a first peak of heat absorption in a differential scanning calorimeter curve at the start of melting and a second peak when the major portion of the alloy subsequently melts.
摘要翻译： 适用于焊接芯片部件的无铅焊膏包括含有0.2-1.0质量％的Ag和焊剂的双峰Sn基焊料合金的粉末。 焊料合金在熔化开始时在差示扫描量热仪曲线中具有第一吸热峰值，而当合金的主要部分随后熔化时，第二峰值。
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公开(公告)号：US6050480A
公开(公告)日：2000-04-18
申请号：US970203
申请日：1997-11-14
IPC分类号： B23K35/22 , B23K35/02 , B23K35/26 , B23K35/36 , B23K35/363 , C22C13/00 , H05K3/34 , B23K31/00 , B23K31/02
CPC分类号： C22C13/00 , B23K35/025 , B23K35/262 , B23K35/3613
摘要： A solder paste suitable for use in reflow soldering of chip components having good soldering properties without causing tombstoning comprises a solder powder admixed with a viscous flux. The solder powder is comprised of a twin peak solder alloy consisting essentially, on a weight basis, of: 60-65% Sn, 0.1-0.6% Ag, 0.1-2% Sb, and a balance of Pb, and having a liquidus temperature below 200.degree. C.
摘要翻译： 适合用于回流焊接具有良好焊接性能而不引起墓碑的焊膏包括与粘性助熔剂混合的焊料粉末。 焊料粉末由双峰焊料合金组成，其基本上以重量计包含：60-65％Sn，0.1-0.6％Ag，0.1-2％Sb和余量的Pb，并具有液相线温度 低于200℃
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公开(公告)号：US06503338B1
公开(公告)日：2003-01-07
申请号：US09559062
申请日：2000-04-28
IPC分类号： B23K35363
CPC分类号： B23K35/262
摘要： A lead-free solder alloy which has a relatively low melting temperature and which is suitable for soldering electronic devices consists essentially of from 5 to 9 mass % of Zn, from 2 to 15 mass % of Bi, optionally from 0.001 to 1 mass % of P or from 0.001 to 0.1 mass % of Ge, and a balance of Sn. The solder alloy has a liquidus temperature of at most 220° C.
摘要翻译： 具有相对低的熔融温度且适用于焊接电子器件的无铅焊料合金基本上由5〜9质量％的Zn，2〜15质量％的Bi，任选0.001〜1质量％ 或0.001〜0.1质量％的Ge，余量为Sn。 焊料合金的液相线温度至多为220℃
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公开(公告)号：US07682468B2
公开(公告)日：2010-03-23
申请号：US11889356
申请日：2007-08-10
IPC分类号： C22C13/00
CPC分类号： C22C13/00 , B23K1/0016 , B23K1/085 , B23K1/203 , B23K35/262 , B23K2101/42 , H05K3/3463
摘要： A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one element of Ag and Sb in a total amount of at most 4 wt %, and/or at least one element of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one element of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.
摘要翻译： 适用于电子部件流动焊接到印刷电路板的无铅焊料合金包括0.1〜3wt％的Cu，0.001-0.1wt％的P，0.001-0.1wt％的Ge，余量的Sn 。 焊料合金还可以含有总量最多为4重量％的Ag和Sb的至少一种元素，和/或Ni，Co，Fe，Mn，Cr和Mo中的至少一种元素的总量为 为了降低合金的熔点，为了强化合金，和/或Bi，In和Zn的至少一种元素，其总量最多为5重量％，最多为0.5重量％。
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公开(公告)号：US07338567B2
公开(公告)日：2008-03-04
申请号：US10666129
申请日：2003-09-22
IPC分类号： C22C13/00
CPC分类号： C22C13/00 , B23K1/0016 , B23K1/085 , B23K1/203 , B23K35/262 , B23K2101/42 , H05K3/3463
摘要： A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one element of Ag and Sb in a total amount of at most 4 wt %, and/or at least one element of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one element of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.
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公开(公告)号：US07029542B2
公开(公告)日：2006-04-18
申请号：US10614351
申请日：2003-07-08
申请人： Masazumi Amagai , Masako Watanabe , Kensho Murata , Osamu Munekata , Yoshitaka Toyoda , Minoru Ueshima , Tsukasa Ohnishi , Hiroshi Okada
发明人： Masazumi Amagai , Masako Watanabe , Kensho Murata , Osamu Munekata , Yoshitaka Toyoda , Minoru Ueshima , Tsukasa Ohnishi , Hiroshi Okada
CPC分类号： B23K35/262 , B23K35/0244 , B23K2101/42
摘要： A lead-free solder alloy comprises 1.0–5.0 wt % Ag, 0.01–0.5 wt % Ni, one or both of (a) 0.001–0.05 wt % Co and (b) at least one of P, Ge, and Ga in a total amount of 0.001–0.05 wt %, and a remainder of Sn. The solder can form solder bumps which have a high bonding strength and which do not undergo yellowing after soldering.
摘要翻译： 一种无铅焊料合金包含1.0-5.0重量％的Ag，0.01-0.5重量％的Ni，（a）0.001-0.05重量％的Co中的一个或两个，和（b）一个或多个P，Ge和Ga中的至少一个， 总量为0.001-0.05重量％，余量为Sn。 焊料可以形成具有高粘合强度并且在焊接后不经历黄变的焊料凸块。
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公开(公告)号：US08216395B2
公开(公告)日：2012-07-10
申请号：US12659815
申请日：2010-03-22
IPC分类号： C22C13/00
CPC分类号： B23K1/0016 , B23K1/085 , B23K1/203 , B23K35/22 , B23K35/262 , B23K2101/42 , C22C13/00 , Y10T428/12708
摘要： A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one of Ag and Sb in a total amount of at most 4 wt %, and/or at least one of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.
摘要翻译： 适用于电子部件流动焊接到印刷电路板的无铅焊料合金包括0.1〜3wt％的Cu，0.001-0.1wt％的P，0.001-0.1wt％的Ge，余量的Sn 。 焊料合金可以进一步包含总量最多为4重量％的Ag和Sb中的至少一种，和/或至少一种Ni，Co，Fe，Mn，Cr和Mo中的至少一种 为了降低合金的熔点，为了强化合金，和/或Bi，In和Zn中的至少一种，总量为5重量％以下。
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公开(公告)号：US20100297470A1
公开(公告)日：2010-11-25
申请号：US12659815
申请日：2010-03-22
CPC分类号： B23K1/0016 , B23K1/085 , B23K1/203 , B23K35/22 , B23K35/262 , B23K2101/42 , C22C13/00 , Y10T428/12708
摘要： A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one of Ag and Sb in a total amount of at most 4 wt %, and/or at least one of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.
摘要翻译： 适用于电子部件流动焊接到印刷电路板的无铅焊料合金包括0.1〜3wt％的Cu，0.001-0.1wt％的P，0.001-0.1wt％的Ge，余量的Sn 。 焊料合金可以进一步包含总量最多为4重量％的Ag和Sb中的至少一种，和/或至少一种Ni，Co，Fe，Mn，Cr和Mo中的至少一种 为了降低合金的熔点，为了强化合金，和/或Bi，In和Zn中的至少一种，总量为5重量％以下。
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公开(公告)号：US20080061117A1
公开(公告)日：2008-03-13
申请号：US11889356
申请日：2007-08-10
CPC分类号： C22C13/00 , B23K1/0016 , B23K1/085 , B23K1/203 , B23K35/262 , B23K2101/42 , H05K3/3463
摘要： A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one element of Ag and Sb in a total amount of at most 4 wt %, and/or at least one element of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one element of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.
摘要翻译： 适用于电子部件流动焊接到印刷电路板的无铅焊料合金包括0.1〜3wt％的Cu，0.001-0.1wt％的P，0.001-0.1wt％的Ge，余量的Sn 。 焊料合金还可以含有总量最多为4重量％的Ag和Sb的至少一种元素，和/或Ni，Co，Fe，Mn，Cr和Mo中的至少一种元素的总量为 为了降低合金的熔点，为了强化合金，和/或Bi，In和Zn的至少一种元素，其总量最多为5重量％，最多为0.5重量％。
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公开(公告)号：US20050036902A1
公开(公告)日：2005-02-17
申请号：US10614351
申请日：2003-07-08
申请人： Masazumi Amagai , Masako Watanabe , Osamu Munekata , Yoshitaka Toyoda , Minoru Ueshima , Tsukasa Ohnishi , Hiroshi Okada
发明人： Masazumi Amagai , Masako Watanabe , Osamu Munekata , Yoshitaka Toyoda , Minoru Ueshima , Tsukasa Ohnishi , Hiroshi Okada
CPC分类号： B23K35/262 , B23K35/0244 , B23K2101/42
摘要： A lead-free solder alloy comprises 1.0-5.0 wt % Ag, 0.01-0.5 wt % Ni, one or both of (a) 0.001-0.05 wt % Co and (b) at least one of P, Ge, and Ga in a total amount of 0.001-0.05 wt %, and a remainder of Sn. The solder can form solder bumps which have a high bonding strength and which do not undergo yellowing after soldering.
摘要翻译： 一种无铅焊料合金包含1.0-5.0重量％的Ag，0.01-0.5重量％的Ni，（a）0.001-0.05重量％的Co中的一个或两个，和（b）一个或多个P，Ge和Ga中的至少一个， 总量为0.001-0.05重量％，余量为Sn。 焊料可以形成具有高粘合强度并且在焊接后不经历黄变的焊料凸块。
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